IDT5V60014 LOW PHASE NOISE ZERO DELAY BUFFER. Description. Features. Block Diagram DATASHEET

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DATASHEET IDT5V60014 Description The IDT5V60014 is a high speed, high output drive, low phase noise Zero Delay Buffer (ZDB) which integrates IDT s proprietary analog/digital Phase Locked Loop (PLL) techniques. The IDT5V60014 is designed to operate at low frequencies, with faster rise and fall times, and with lower phase noise. The zero delay feature means that the rising edge of the input clock aligns with the rising edges of both outputs, giving the appearance of no delay through the device. There are two outputs on the chip. The device has internal feedback loop eliminating the complexity of external feedback loop. The chip is ideal for synchronizing outputs in a large variety of systems, from personal computers to data communications to video. The low phase noise performance makes the device particularly suitable for audio applications. By allowing off-chip feedback paths, the IDT5V60014 can eliminate the delay through other devices. Features Packaged in 8-pin MSOP (Pb free) Low phase noise zero delay buffer Low skew outputs Input clock frequency from 10 MHz to 38 MHz at 3.3 V Phase noise of better than -100 dbc/hz from 1 khz to 1 MHz offset from carrier Recover poor input clock duty cycle Output clock duty cycle of 45/55 at 3.3 V High drive strength Full CMOS clock swings with 15 ma drive capability at TTL levels Advanced, low power CMOS process 3.3 V operating voltages Industrial Temperature Range: -40 to +85 C Block Diagram ICLK Phase Detector, Charge pump, and Loop Filter VCO Output Buffer Output Buffer CLK1 CLK2 Internal feedback IDT 1 IDT5V60014 REV D 040609

Pin Assignment ICLK 1 8 NC VDD CLK1 GND VDD CLK2 4 5 GND Pin Descriptions Pin Number Pin Name Pin Type 1 ICLK Input Reference clock input. 2 VDD Power Connect to +3.3 V. 3 GND Power Connect to ground. 4 CLK2 Output Clock output. 5 GND Power Connect to ground. 6 VDD Power Connect to +3.3 V. 7 CLK1 Output Clock output. 8 NC - No connect. Pin Description External Components The IDT5V60014 requires a minimum number of external components for proper operation. A decoupling capacitor of 0.01µF must be connected between VDD and GND on each side of the chip (between pins 2 and 3, and between pins 6 and 5). They must be connected close to the device to minimize lead inductance. No external power supply filtering is required for this device. A 33Ω terminating resistor can be used next to each output pin. IDT 2 IDT5V60014 REV D 040609

Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the IDT5V60014. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Supply Voltage, VDD, referenced to GND Inputs, referenced to GND Clock Output, referenced to GND Storage Temperature Soldering Temperature, max of 10 seconds Ambient Operating Temperature Rating 7 V -0.5 V to VDD+0.5 V -0.5 V to VDD+0.5 V -65 to +150 C 260 C -20 to +85 C DC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V, Ambient Temperature -20 to +85 C Parameter Symbol Conditions Min. Typ. Max. Units Operating Supply Voltage VDD 3 3.6 V Input High Voltage V IH ICLK (pins 1) VDD/2+1 VDD/2 V Input Low Voltage V IL ICLK (pins 1) VDD/2 VDD/2-1 V Output High Voltage, V OH I OH = -4 ma VDD-0.4 V CMOS level Output High Voltage V OH I OH = -25 ma 2.4 V Output Low Voltage V OL I OL = 25 ma 0.4 V IDD Operating Supply No load, 3.3 V 26 ma Current Short Circuit Current I OS Each output ±100 ma Input Capacitance C IN ICLK 5 pf IDT 3 IDT5V60014 REV D 040609

AC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V, Ambient Temperature -20 to +85 C Parameter Symbol Conditions Min. Typ. Max. Units Input Frequency, Clock Input f IN 10 38 MHz Skew CLK2 with respect to CLK1 Note 2-300 50 300 ps Input Clock to Output Note 2-250 300 750 ps Output Clock Rise Time, 3.3 V 0.8 to 2.0 V, 15 pf load 0.45 ns Output Clock Fall Time, 3.3 V 2.0 to 0.8 V, 15 pf load 0.55 ns Input Clock Duty Cycle, 3.3 V fin = 25 MHz 30 70 % Output Clock Duty Cycle, 3.3 V At VDD/2 45 49 to 51 55 % Jitter (Cycle to Cycle) Note 3 Absolute 125 175 ps Period Jitter (pk-pk), Note 3 150 200 ps Long Term Jitter (pk-pk), Note 3 500 ps Phase Noise, Relative to Carrier 3 1 khz offset -125 dbc/hz Phase Noise, Relative to Carrier 3 100 khz offset -120 dbc/hz Phase Noise, Relative to Carrier 4 1 khz offset -120 dbc/hz Phase Noise, Relative to Carrier 4 100 khz offset -120 dbc/hz Notes: 1. Stresses beyond these can permanently damage the device. 2. Assumes clocks with the same rise time, measured from rising edges at VDD/2. Measured with 33Ω termination resistors and 15 pf loads. 3. Measured with 12 MHz input clock. 4. Measured with 10-38 MHz input clock. IDT 4 IDT5V60014 REV D 040609

Thermal Characteristics Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to θ JA Still air 95 C/W Ambient Thermal Resistance Junction to Case θ JC 48 C/W Marking Diagram 8 5 14GI YWW$ 1 4 Notes: 1. Line 1: truncated part number, G for RoHS compliance, I for industrial temp range. 2. Line 2: YWW is the year and week that the part was assembled; $ is the aseembly mark code. 3. Bottom marking: lot number and country of origin if not USA. IDT 5 IDT5V60014 REV D 040609

Package Outline and Package Dimensions (8-pin MSOP, 3.00 mm Body) Package dimensions are kept current with JEDEC Publication No. 95 8 Millimeters Inches* INDEX AREA 1 2 D E1 E Symbol Min Max Min Max A -- 1.10 -- 0.043 A1 0 0.15 0 0.006 A2 0.79 0.97 0.031 0.038 b 0.22 0.38 0.008 0.015 C 0.08 0.23 0.003 0.009 D 3.00 BASIC 0.118 BASIC E 4.90 BASIC 0.193 BASIC E1 3.00 BASIC 0.118 BASIC e 0.65 Basic 0.0256 Basic L 0.40 0.80 0.016 0.032 α 0 8 0 8 aaa - 0.10-0.004 *For reference only. Controlling dimensions in mm. A 2 A A 1 - C - c e b aaa SEATING PLANE C L Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature 5V60014DVGI see page 5 Tubes 8-pin MSOP -20 to +85 C 5V60014DVGI8 Tape and Reel 8-pin MSOP -20 to +85 C Parts that are ordered with a G after the two-letter package code are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT 6 IDT5V60014 REV D 040609

Revision History Rev. Originator Date Description of Change B R. Willner 03/03/09 Changed package from 8SOIC to 8MSOP. Removed commercial temperature range references. C R.Willner 3/12/19 Change input frequency to 10-38MHz. Added Carrier-to-Noise measurement data. D R.Willner 04/06/09 Released to final. IDT 7 IDT5V60014 REV D 040609

Innovate with IDT and accelerate your future networks. Contact: www.idt.com For Sales 800-345-7015 408-284-8200 Fax: 408-284-2775 For Tech Support www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA