Robust Low Noise Broadband Pre-Matched Bipolar RF Transistor Data Sheet Revision 1., 13-6-19 RF & Protection Devices
Edition 13-6-19 Published by Infineon Technologies AG 8176 Munich, Germany 13 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BFP83, Robust Low Noise Broadband Pre-Matched Bipolar RF Transistor Revision History: 13-6-19, Revision 1. Page Subjects (major changes since last revision) Trademarks of Infineon Technologies AG AURIX, C166, CanPAK, CIPOS, CIPURSE, EconoPACK, CoolMOS, CoolSET, CORECONTROL, CROSSAVE, DAVE, DI-POL, EasyPIM, EconoBRIDGE, EconoDUAL, EconoPIM, EconoPACK, EiceDRIVER, eupec, FCOS, HITFET, HybridPACK, I²RF, ISOFACE, IsoPACK, MIPAQ, ModSTACK, my-d, NovalithIC, OptiMOS, ORIGA, POWERCODE ; PRIMARION, PrimePACK, PrimeSTACK, PRO-SIL, PROFET, RASIC, ReverSave, SatRIC, SIEGET, SINDRION, SIPMOS, SmartLEWIS, SOLID FLASH, TEMPFET, thinq!, TRENCHSTOP, TriCore. Other Trademarks Advance Design System (ADS) of Agilent Technologies, AMBA, ARM, MULTI-ICE, KEIL, PRIMECELL, REALVIEW, THUMB, µvision of ARM Limited, UK. AUTOSAR is licensed by AUTOSAR development partnership. Bluetooth of Bluetooth SIG Inc. CAT-iq of DECT Forum. COLOSSUS, FirstGPS of Trimble Navigation Ltd. EMV of EMVCo, LLC (Visa Holdings Inc.). EPCOS of Epcos AG. FLEXGO of Microsoft Corporation. FlexRay is licensed by FlexRay Consortium. HYPERTERMINAL of Hilgraeve Incorporated. IEC of Commission Electrotechnique Internationale. IrDA of Infrared Data Association Corporation. ISO of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB of MathWorks, Inc. MAXIM of Maxim Integrated Products, Inc. MICROTEC, NUCLEUS of Mentor Graphics Corporation. MIPI of MIPI Alliance, Inc. MIPS of MIPS Technologies, Inc., USA. murata of MURATA MANUFACTURING CO., MICROWAVE OFFICE (MWO) of Applied Wave Research Inc., OmniVision of OmniVision Technologies, Inc. Openwave Openwave Systems Inc. RED HAT Red Hat, Inc. RFMD RF Micro Devices, Inc. SIRIUS of Sirius Satellite Radio Inc. SOLARIS of Sun Microsystems, Inc. SPANSION of Spansion LLC Ltd. Symbian of Symbian Software Limited. TAIYO YUDEN of Taiyo Yuden Co. TEAKLITE of CEVA, Inc. TEKTRONIX of Tektronix Inc. TOKO of TOKO KABUSHIKI KAISHA TA. UNIX of X/Open Company Limited. VERILOG, PALLADIUM of Cadence Design Systems, Inc. VLYNQ of Texas Instruments Incorporated. VXWORKS, WIND RIVER of WIND RIVER SYSTEMS, INC. ZETEX of Diodes Zetex Limited. Last Trademarks Update 11-11-11 Data Sheet 3 Revision 1., 13-6-19
Table of Contents Table of Contents Table of Contents................................................................ List of Figures................................................................... 5 List of Tables.................................................................... 6 1 Product Brief.................................................................... 7 Features........................................................................ 8 3 Maximum Ratings................................................................ 9 Thermal Characteristics.......................................................... 1 5 Electrical Characteristics......................................................... 11 5.1 DC Characteristics............................................................... 11 5. General AC Characteristics........................................................ 11 5.3 Frequency Dependent AC Characteristics............................................. 1 6 Characteristic DC Diagrams...................................................... 15 7 Characteristic AC Diagrams...................................................... 18 8 Simulation Data................................................................. 9 Package Information SOT33..................................................... 5 Data Sheet Revision 1., 13-6-19
List of Figures List of Figures Figure -1 Total Power Dissipation P tot = f (T s )................................................ 1 Figure 5-1 BFP83 Testing Circuit.......................................................... 1 Figure 6-1 Collector Current vs. Collector Emitter Voltage I C = f (V CE ), I B = Parameter................. 15 Figure 6- DC Current Gain h FE = f (I C ), V CE = 1.8 V............................................ 15 Figure 6-3 Collector Current vs. Base Emitter Forward Voltage I C = f (V BE ), V CE = 1.8 V................ 16 Figure 6- Base Current vs. Base Emitter Forward Voltage I B = f (V BE ), V CE = 1.8 V................... 16 Figure 6-5 Base Current vs. Base Emitter Reverse Voltage I B = f (V EB ), V CE = 1.8 V................... 17 Figure 7-1 3rd Order Intercept Point at Output OIP3 = f (I C ), Z S = Z L = 5 Ω, V CE, f = Parameters........ 18 Figure 7-3rd Order Intercept Point at Output OIP3 [m] =f (I C, V CE ), Z S = Z L = 5 Ω, f = 5.5 GHz...... 18 Figure 7-3 Compression Point at Output OP 1 [m] = f (I C, V CE ), Z S = Z L = 5 Ω, f = 5.5 GHz.......... 19 Figure 7- Gain G ma, G ms, IS 1 I² = f (f), V CE = 1.8 V, I C = 15 ma................................... 19 Figure 7-5 Maximum Power Gain G max = f (I C ), V CE = 1.8 V, f = Parameter in GHz.................... Figure 7-6 Maximum Power Gain G max = f (V CE ), I C = 15 ma, f = Parameter in GHz................... Figure 7-7 Input Reflection Coefficient S 11 = f (f), V CE = 1.8 V, I C = 8 / 15 ma........................ 1 Figure 7-8 Source Impedance for Minimum Noise Figure Z opt = f (f), V CE = 1.8 V, I C = 8 / 15 ma......... 1 Figure 7-9 Output Reflection Coefficient S = f (f), V CE = 1.8 V, I C = 8 / 15 ma....................... Figure 7-1 Noise Figure NF min = f (f), V CE = 1.8 V, I C = 8 / 15 ma, Z S = Z opt.......................... Figure 7-11 Noise Figure NF min = f (I C ), V CE = 1.8 V, Z S = Z opt, f = Parameter in GHz................... 3 Figure 7-1 Noise Figure NF 5 = f (I C ), V CE = 1.8 V, Z S = 5 Ω, f = Parameter in GHz................... 3 Figure 9-1 Package Outline............................................................... 5 Figure 9- Package Footprint.............................................................. 5 Figure 9-3 Marking Description (Marking BFP83: Ts)......................................... 5 Figure 9- Tape Dimensions.............................................................. 5 Data Sheet 5 Revision 1., 13-6-19
List of Tables List of Tables Table 3-1 Maximum Ratings at T A = 5 C (unless otherwise specified)............................. 9 Table -1 Thermal Resistance........................................................... 1 Table 5-1 DC Characteristics at T A = 5 C................................................. 11 Table 5- General AC Characteristics at T A = 5 C........................................... 11 Table 5-3 AC Characteristics, V CE =1.8V, f = 5 MHz........................................ 1 Table 5- AC Characteristics, V CE =1.8V, f = 9 MHz........................................ 1 Table 5-5 AC Characteristics, V CE =1.8V, f = 1.5 GHz........................................ 13 Table 5-6 AC Characteristics, V CE =1.8V, f = 1.9 GHz........................................ 13 Table 5-7 AC Characteristics, V CE =1.8V, f =. GHz........................................ 13 Table 5-8 AC Characteristics, V CE =1.8V, f = 3.5 GHz........................................ 1 Table 5-9 AC Characteristics, V CE =1.8V, f = 5.5 GHz........................................ 1 Table 5-1 AC Characteristics, V CE =1.8V, f = 1 GHz......................................... 1 Data Sheet 6 Revision 1., 13-6-19
Product Brief 1 Product Brief The BFP83 is a low noise broadband NPN bipolar RF transistor. Its integrated feedback provides a broadband pre-match to 5 Ω at input and output and improves the stability against parasitic oscillations. These measures simplify the design of arbitrary LNA application circuits. The device is based on Infineon s reliable high volume silicon germanium carbon (SiGe:C) heterojunction bipolar technology. The collector design supports voltages up to V CEO =.5 V and currents up to I C = 55 ma. The device is especially suited for mobile applications in which low power consumption is a key requirement. The transistor is fitted with internal protection circuits, which enhance the robustness against electrostatic discharge (ESD) and against high levels of RF input power. The device is housed in an easy to use plastic package with visible leads. Data Sheet 7 Revision 1., 13-6-19
Features Features Low noise broadband NPN RF transistor based on Infineon s reliable, high volume SiGe:C bipolar technology High maximum RF input power and ESD robustness m maximum RF input power, 1.5 KV HBM ESD hardness Unique combination of high RF performance, robustness and ease of application circuit design Low noise figure: NF min = 1. at. GHz and 1. at 5.5 GHz, 1.8 V, 8 ma High gain: S 1 = 1 at. GHz and 15.5 at 5.5 GHz, 1.8 V, 15 ma OIP3 = 3 m at. GHz and m at 5.5 GHz, 1.8 V, ma Ideal for low voltage applications e.g. V CC = 1. V and 1.8 V (.85 V, 3.3 V, 3.6 V requires corresponding collector resistor) Low power consumption, ideal for mobile applications Easy to use Pb free (RoHS compliant) and halogen free industry standard package with visible leads Qualification report according to AEC-Q11 available 3 1 Applications As Low Noise Amplifier (LNA) in Wireless Communications: WLAN IEEE8.11b,g,n,a,ac single- and dual band applications, broadband LTE or WiMAX LNA Satellite navigation systems (e.g. GPS, GLONASS, COMPASS...) and satellite C-band LNB (1st and nd stage LNA) Broadband amplifiers: Dualband WLAN, multiband mobile phone, UWB up to 1 GHz ISM bands up to 1 GHz Dedicated short range communication (DSRC) system: WLAN IEEE8.11p Attention: ESD (Electrostatic discharge) sensitive device, observe handling precautions Product Name Package Pin Configuration Marking BFP83 SOT33 1 = B = E 3 = C = E Ts Data Sheet 8 Revision 1., 13-6-19
Maximum Ratings 3 Maximum Ratings Table 3-1 Maximum Ratings at T A = 5 C (unless otherwise specified) Parameter Symbol Values Unit Note / Test Condition Min. Max. Collector emitter voltage V CEO.5. Collector emitter voltage 1) Collector base voltage ) V CES.5. V CBO.9.6 V T A = 5 C T A = -55 C Open base V T A = 5 C T A = -55 C E-B short circuited V T A =5 C T A = -55 C Open emitter Base current I B -5 5 ma Collector current I C 55 ma RF input power P RFin m ESD stress pulse V ESD -1.5 1.5 kv HBM, all pins, acc. to JESD-A11 Total power dissipation 3) P tot 15 mw T S 99 C Junction temperature T J 15 C Storage temperature T Stg -55 15 C 1) V CES is identical to V CEO due to design ) V CBO is similar to V CEO due to design 3) T S is the soldering point temperature. T S is measured on the emitter lead at the soldering point of the pcb. Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Data Sheet 9 Revision 1., 13-6-19
Thermal Characteristics Thermal Characteristics Table -1 Thermal Resistance Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Junction - soldering point 1) R thjs 5 K/W 1) For the definition of R thjs please refer to Application Note AN77 (Thermal Resistance Calculation). P tot [mw] 13 1 11 1 9 8 7 6 5 3 1 5 5 75 1 15 15 T S [ C] Figure -1 Total Power Dissipation P tot = f (T s ) Data Sheet 1 Revision 1., 13-6-19
Electrical Characteristics 5 Electrical Characteristics 5.1 DC Characteristics Table 5-1 DC Characteristics at T A = 5 C Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Collector emitter breakdown voltage V (BR)CEO.5.6 V I C = 1 ma, I B = Open base Collector emitter leakage current I CES na V CE = 1.5 V, V BE = E-B short circuited Collector base leakage current I CBO na V CB = 1.5 V, I E = Open emitter Emitter base leakage current I EBO 1 μa V EB =.5 V, I C = Open collector DC current gain h FE 15 6 5 V CE = 1.8 V, I C = 15 ma Pulse measured 5. General AC Characteristics Table 5- General AC Characteristics at T A = 5 C Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Collector base capacitance 1) C CB 5.3.6 pf f = 1 MHz f = 1 GHz V CB = 1.8 V, V BE = Emitter grounded Collector emitter capacitance C CE.5 pf f = 1 MHz V CE = 1.8 V, V BE = Base grounded Emitter base capacitance C EB.73 pf f = 1 MHz V EB =. V,V CB = Collector grounded 1) Including integrated feedback capacitance Data Sheet 11 Revision 1., 13-6-19
Electrical Characteristics 5.3 Frequency Dependent AC Characteristics Measurement setup is a test fixture with Bias T s in a 5 Ω system, T A = 5 C Top View VC Bias -T OUT E C VB IN Bias-T B (Pin 1) E Figure 5-1 BFP83 Testing Circuit Table 5-3 AC Characteristics, V CE =1.8V, f = 5 MHz Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Power Gain Maximum power gain Transducer gain Minimum Noise Figure Minimum noise figure Associated gain Linearity 1 compression point at output 3rd order intercept point at output G ma S 1 NF min G ass OP 1 OIP3.5.5.9 7 m Z S = Z L =5Ω Table 5- AC Characteristics, V CE =1.8V, f = 9 MHz Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Power Gain Maximum power gain Transducer gain Minimum Noise Figure Minimum noise figure Associated gain Linearity 1 compression point at output 3rd order intercept point at output G ma S 1 NF min G ass OP 1 OIP3.9 8 3.5 m Z S = Z L =5Ω Data Sheet 1 Revision 1., 13-6-19
Electrical Characteristics Table 5-5 AC Characteristics, V CE =1.8V, f = 1.5 GHz Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Power Gain Maximum power gain Transducer gain Minimum Noise Figure Minimum noise figure Associated gain Linearity 1 compression point at output 3rd order intercept point at output G ma S 1 NF min G ass OP 1 OIP3 3.5 3.95 1 6.5 m Z S = Z L =5Ω Table 5-6 AC Characteristics, V CE =1.8V, f = 1.9 GHz Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Power Gain Maximum power gain Transducer gain Minimum Noise Figure Minimum noise figure Associated gain Linearity 1 compression point at output 3rd order intercept point at output G ma S 1 NF min G ass OP 1 OIP3.5.95 8.5 m Z S = Z L =5Ω Table 5-7 AC Characteristics, V CE =1.8V, f =. GHz Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Power Gain Maximum power gain Transducer gain Minimum Noise Figure Minimum noise figure Associated gain Linearity 1 compression point at output 3rd order intercept point at output G ma S 1 NF min G ass OP 1 OIP3 1.5 1 1. 19.5 6.5 m Z S = Z L =5Ω Data Sheet 13 Revision 1., 13-6-19
Electrical Characteristics Table 5-8 AC Characteristics, V CE =1.8V, f = 3.5 GHz Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Power Gain Maximum power gain Transducer gain Minimum Noise Figure Minimum noise figure Associated gain Linearity 1 compression point at output 3rd order intercept point at output G ma S 1 NF min G ass OP 1 OIP3 19.5 19 1.1 17.5 7.5 m Z S = Z L =5Ω Table 5-9 AC Characteristics, V CE =1.8V, f = 5.5 GHz Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Power Gain Maximum power gain Transducer gain Minimum Noise Figure Minimum noise figure Associated gain Linearity 1 compression point at output 3rd order intercept point at output G ma S 1 NF min G ass OP 1 OIP3 17 15.5 1. 15 19.5 m Z S = Z L =5Ω Table 5-1 AC Characteristics, V CE =1.8V, f = 1 GHz Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Power Gain Maximum power gain Transducer gain Minimum Noise Figure Minimum noise figure Associated gain Linearity 1 compression point at output 3rd order intercept point at output G ma S 1 NF min G ass OP 1 OIP3 13.5 8.5 1.85 9 16 m Z S = Z L =5Ω Note: OIP3 value depends on termination of all intermodulation frequency components. Termination used for this measurement is 5 Ω from. MHz to 1 GHz. Data Sheet 1 Revision 1., 13-6-19
Characteristic DC Diagrams 6 Characteristic DC Diagrams I C [ma] 18 16 1 1 1 8 6 8µA 7µA 6µA 5µA µa 3µA µa 1µA.5 1 1.5.5 V CE [V] Figure 6-1 Collector Current vs. Collector Emitter Voltage I C = f (V CE ), I B = Parameter 1 3 h FE 1 1 1 1 1 1 1 1 I c [ma] Figure 6- DC Current Gain h FE = f (I C ), V CE = 1.8 V Data Sheet 15 Revision 1., 13-6-19
Characteristic DC Diagrams 1 1 1 1 I C [ma] 1 1 1 1 3 1 1 5.5.55.6.65.7.75.8.85.9 V BE [V] Figure 6-3 Collector Current vs. Base Emitter Forward Voltage I C = f (V BE ), V CE = 1.8 V 1 1 1 1 I B [ma] 1 3 1 1 5 1 6 1 7.5.55.6.65.7.75.8.85.9 V [V] BE Figure 6- Base Current vs. Base Emitter Forward Voltage I B = f (V BE ), V CE = 1.8 V Data Sheet 16 Revision 1., 13-6-19
Characteristic DC Diagrams 1 6 1 7 1 8 I B [A] 1 9 1 1 1 11.3.35..5.5.55.6.65.7 V EB [V] Figure 6-5 Base Current vs. Base Emitter Reverse Voltage I B = f (V EB ), V CE = 1.8 V Data Sheet 17 Revision 1., 13-6-19
Characteristic AC Diagrams 7 Characteristic AC Diagrams 18 16 OIP 3 [m] 1 1 1 8 6 1.5V, MHz 1.8V, MHz 1.5V, 55MHz 1.8V, 55MHz 5 1 15 5 3 35 I C [ma] Figure 7-1 3rd Order Intercept Point at Output OIP3 = f (I C ), Z S = Z L = 5 Ω, V CE, f = Parameters I C [ma] 35 3 5 8 5 9 6 1 11 11 13 13 1 15 1 7 8 9 11 1515 1 16 16 17 17 18 19 18 19 17 18 1 19 1 15 1 16 16 16 17 18 19 16 13 1 1 13 1 15 5 1 1. 1. 1.6 1.8 V [V] CE 15 17 17 1 18 18 19 15 13 1 17 19 18 19 1 Figure 7-3rd Order Intercept Point at Output OIP3 [m] =f (I C, V CE ), Z S = Z L = 5 Ω, f = 5.5 GHz Data Sheet 18 Revision 1., 13-6-19
Characteristic AC Diagrams 35 3 1 1 3 1 33 5 6 5 6 5 7 7 I C [ma] 15 1 3 1 1 3 6 5 3 1 5 1 3 6 5 3 6 5 3 1 1 3 5 5 1 1. 1. 1.6 1.8 V CE [V] 6 Figure 7-3 Compression Point at Output OP 1 [m] = f (I C, V CE ), Z S = Z L = 5 Ω, f = 5.5 GHz G [] 6 18 16 1 1 1 8 6 S 1 G ma 1 3 5 6 7 8 9 1 f [GHz] Figure 7- Gain G ma, G ms, IS 1 I² = f (f), V CE = 1.8 V, I C = 15 ma Data Sheet 19 Revision 1., 13-6-19
Characteristic AC Diagrams G max [] 8 6 18 16 1 1 1 8 6.5GHz.9GHz 1.5GHz 1.9GHz.GHz 3.5GHz 5.5GHz 1.GHz 5 1 15 5 3 35 5 5 55 6 65 7 I [ma] C Figure 7-5 Maximum Power Gain G max = f (I C ), V CE = 1.8 V, f = Parameter in GHz 8 G max [] 6 18 16 1 1.5GHz.9GHz 1.5GHz 1.9GHz.GHz 3.5GHz 5.5GHz 1.GHz 1.5 1 1.5.5 V [V] CE Figure 7-6 Maximum Power Gain G max = f (V CE ), I C = 15 ma, f = Parameter in GHz Data Sheet Revision 1., 13-6-19
Characteristic AC Diagrams 1 1.5.1..3..5 7. 6. 8. 9. 7. 6. 5..3 to 1 GHz. 5..1..3..5 3. 1 1.5 3 5.. 1. 8. 11. 1. 1. 1. 1. 11. 9. 3 5 1.1. 3.. 1..3.3 1 5.3 3..5 1 1.5 8mA 15mA Figure 7-7 Input Reflection Coefficient S 11 = f (f), V CE = 1.8 V, I C = 8 / 15 ma 1 1.5.5..3 3. 5.1.5 to 1 GHz 1.1 3.5. 1.9.1..3..5.5 1 1.5.9.5 3 5 5.5 3.5 5.5 1. 1. 5.3 1. 3..5 1 1.5 8mA 15mA Figure 7-8 Source Impedance for Minimum Noise Figure Z opt = f (f), V CE = 1.8 V, I C = 8 / 15 ma Data Sheet 1 Revision 1., 13-6-19
Characteristic AC Diagrams 1 1.5.1.1...3.5 6. 6. 5..1..3..5 5.. 1 1.5 3 5 3. 1...3.. 7. 8. 1. 11. 1. 1. 11. 1. 9. 9.. 8. 7. 3...3 to 1 GHz 1..3.3 3 5 1 1 5 3.5 1 1.5 8mA 15mA Figure 7-9 Output Reflection Coefficient S = f (f), V CE = 1.8 V, I C = 8 / 15 ma NF min [] 1.8 1.6 1. 1. 1.8.6.. I C = 15mA I C = 8mA 1 3 5 6 7 8 9 1 f [GHz] Figure 7-1 Noise Figure NF min = f (f), V CE = 1.8 V, I C = 8 / 15 ma, Z S = Z opt Data Sheet Revision 1., 13-6-19
Characteristic AC Diagrams NF min [] 3.8 f = 1GHz.6 f = 5.5GHz. f = 3.5GHz. f =.GHz 1.8 f =.9GHz 1.6 1. 1. 1.8.6.. 5 1 15 5 I C [ma] Figure 7-11 Noise Figure NF min = f (I C ), V CE = 1.8 V, Z S = Z opt, f = Parameter in GHz NF 5 [] 3.5 3.5 1.5 f = 1GHz f = 5.5GHz f = 3.5GHz f =.GHz f =.9GHz 1.5 5 1 15 5 I [ma] C Figure 7-1 Noise Figure NF 5 = f (I C ), V CE = 1.8 V, Z S = 5 Ω, f = Parameter in GHz Note: The curves shown in this chapter have been generated using typical devices but shall not be considered as a guarantee that all devices have identical characteristic curves. T A =5 C. Data Sheet 3 Revision 1., 13-6-19
Simulation Data 8 Simulation Data For the SPICE Gummel Poon (GP) model as well as for the S-parameters (including noise parameters) please refer to our internet website. Please consult our website and download the latest versions before actually starting your design. You find the BFP83 SPICE GP model in the internet in MWO- and ADS-format, which you can import into these circuit simulation tools very quickly and conveniently. The model already contains the package parasitics and is ready to use for DC and high frequency simulations. The terminals of the model circuit correspond to the pin configuration of the device. The model parameters have been extracted and verified up to 1 GHz using typical devices. The BFP83 SPICE GP model reflects the typical DC- and RF-performance within the limitations which are given by the SPICE GP model itself. Besides the DC characteristics all S-parameters in magnitude and phase, as well as noise figure (including optimum source impedance, equivalent noise resistance and flicker noise) and intermodulation have been extracted. Data Sheet Revision 1., 13-6-19
Package Information SOT33 9 Package Information SOT33 ±. 1.3 3.1 MAX..1.9 ±.1 A.3 +.1 -.5 x.1 M 1.15 +.1.6 -.5.1±.1.1 MIN.. M A.15 +.1 -.5 1.5 ±.1 SOT33-PO V8 Figure 9-1 Package Outline.6 1.6.8 1.15.9 SOT33-FP V8 Figure 9- Package Footprint Type code Date code (YM) 5, June 56 XYs Manufacturer Pin 1 Figure 9-3 Marking Description (Marking BFP83: Ts)..3 8 Pin 1.15 1.1 SOT33-TP V Figure 9- Tape Dimensions Data Sheet 5 Revision 1., 13-6-19
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