Supersedes February 009 pplications Voltage Regulator Module (VRM) Multi-phase regulators Desktop and servers Base station equipment Notebook and laptop regulators Data networking and storage systems Point-of-load modules (POL) Battery power systems DCR sensing circuits Product features 6.8 x 6.8 x 4. mm surface mount package Iron powder core material Magnetically shielded, low EMI High temperature core material eliminates thermal aging issues High current carrying capacity, low core losses Tight DCR tolerance for sensing circuits Inductance range from 0.40 µh to 4.7 µh Current range from 5.0 to 7 Frequency range up to MHz Halogen free, lead free, RoHS compliant Environmental Data Storage temperature range (Component): -40 C to +55 C Operating temperature range: -40 C to +55 C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-00 (latest revision) compliant Pb HLOGEN HF FREE
Product Specifications Part Number 6 OCL ± 5% (μh) FLL Min. (μh) I rms 3 () I sat 4 @ +5 C () DCR (mω) @ +0 C K-factor 5 -R40-R 0.40 0.8 7 7 3. ±0% 383. -R60-R 0.60 0.4 4 4.5 ±0% 33.5 -R0-R.00 0.7 7 6. ±0% 65.3 -R8-R.80.6 8.5 3.0 ±0% 0.8 -R3-R.30.56 7.5.5 6.5 ±0% 64. -3R3-R 3.30.3 6.0 9.5 5.0 ±0% 49.9-4R7-R 4.70 3.9 5.0 8.0 9.5 ±0% 7.7 Open Circuit Inductance (OCL) Test Parameters: 00 khz, 0.0 V rms, 0.0 dc Full Load Inductance (FLL) Test Parameters: 00 khz, 0. V rms,i sat 3 I rms : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for C currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed +5 C under worst case operating conditions verified in the end application. 4 I sat : Peak current for approximately 0% rolloff at +5 C. 5 K-factor: Used to determine B p-p for core loss (see graph). B p-p = K * L * ΔI : (Gauss), K: (K-factor from table), L: (inductance in μh), ΔI (peak-to-peak ripple current in amps). 6 Part Number Definition: -xxx-r = Product code and size xxx= Inductance value in μh, R = decimal point. If no R is present, then third character = # of zeros -R suffix = RoHS compliant Dimensions (mm) Top View Side View Bottom View Recommended Pad Layout Schematic 6.80 Max -R40 to R0= 4.0 max -R8 to 4R7= 4.00 max -R40 to R3=.0 +/- 0. -3R3 to 4R7=.00 +/- 0. 3.3±0.3 7.60.50(x) xxx wwllyy R 6.80 Max 4.00(x) The nominal DCR test point is in the middle of the terminal Part Marking: xxx = Inductance value in μh. (R = Decimal point). If no R is present, then last character is # of zeros wwllyy = Date code R = Revision level Do not route traces or vias underneath the inductor Packaging information (mm) Supplied in tape and reel packaging, 000 parts per 3 diameter reel..5 Dia min. 4.0.0.5 Dia. +0./-0.0.75 Section - 7.50 xxx wwllyy R 7.5 6.0 ±0.3 -R40 to R0= 4. -R8 to 4R7= 4.0 6.9.0 User direction of feed
Technical Data 4348 Temperature rise vs. total loss 60 50 Tempetature Rise( C) 40 30 0 0 0 0 0. 0.4 0.6 0.8..4 Tota l Los s (W) Core loss vs. Bp-p 500 khz 00 khz 0 MHz 50 khz Core Loss (W) 0. 0.0 0.00 0 00 000 0000 Bp- p ( G aus s ) 3
Inductance characteristics 00% % of OCL vs % of Isat 80% 5 C % of OCL 60% 40% 0% 0% 0% 0% 40% 60% 80% 00% 0% 40% 60% % of Isat 4
Technical Data 4348 Solder reflow profile T P Max. Ramp Up Rate = 3 C/s Max. Ramp Down Rate = 6 C/s t P T C -5 C Table - Standard SnPb Solder (T c ) Package Thickness mm3 <350 mm3 350 T L Temperature T smax T smin Preheat ts t <.5mm) 35 C 0 C.5mm 0 C 0 C Table - Lead (Pb) Free Solder (T c ) Package Thickness <350 350-000 >000 <.6mm 60 C 60 C 60 C.6.5mm 60 C 50 C 45 C >.5mm 50 C 45 C 45 C 5 C Time 5 C to Peak Time Reference JDEC J-STD-00 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) 00 C 50 C Temperature max. (T smax ) 50 C 00 C Time (T smin to T smax ) (t s ) 60-0 Seconds 60-0 Seconds verage ramp up rate T smax to T p 3 C/ Second Max. 3 C/ Second Max. Liquidous temperature (Tl) Time at liquidous (t L ) 83 C 60-50 Seconds Peak package body temperature (T P )* Table Table 7 C 60-50 Seconds Time (t p )** within 5 C of the specified classification temperature (T c ) 0 Seconds** 30 Seconds** verage ramp-down rate (T p to T smax ) 6 C/ Second Max. 6 C/ Second Max. Time 5 C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 000 Eaton Boulevard Cleveland, OH 44 United States 07 Eaton ll Rights Reserved Printed in US Publication No. 4348 BU-SB09086 July 07 Eaton is a registered trademark. ll other trademarks are property of their respective owners.