PM41NU N-Channel Enhancement Mode MOSFET Features Pin Description 4V/57, R DS(ON) =8.2mΩ (typ.) @ V GS =1V R DS(ON) =13mΩ (typ.) @ V GS =5V Super High Dense Cell Design Reliable and Rugged Lead Free and Green Devices vailable (RoHS Compliant) pplications Power Management in LCD monitor/tv inverter. G D S Top View of TO-252 D G S N-Channel MOSFET Ordering and Marking Information PM41N ssembly Material Handling Code Temp. Range Package Code Package Code U : TO-252 Operating Junction Temp. Range C : -55 to 15 C Handling Code TR : Tape & Reel ssembly Material L : Lead Free Device G : Halogen and Lead Free Device PM41N U : PM41N XXXXX XXXXX - Date Code Note: NPEC lead-free products contain molding compounds/die attach materials and 1% matte tin plate termination finish; which are fully compliant with RoHS. NPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-2C for MSL classification at lead-free peak reflow temperature. NPEC defines Green to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 9ppm by weight in homogeneous material and total of Br and Cl does not exceed 15ppm by weight). NPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright NPEC Electronics Corp. Rev.. 2 - Feb., 28 1
PM41NU bsolute Maximum Ratings Symbol Parameter Rating Unit Common Ratings (T =25 C Unless Otherwise Noted) V DSS Drain-Source Voltage 4 V GSS Gate-Source Voltage ±2 V T J Maximum Junction Temperature 15 C T STG Storage Temperature Range -55 to 15 C I S Diode Continuous Forward Current 2 Mounted on Large Heat Sink I DP I D P D 3µs Pulse Drain Current Tested T C =25 C 14 T C =1 C 1 Continuous Drain Current T C =25 C 57 T C =1 C 35 Maximum Power Dissipation T C =25 C 5 T C =1 C 2 W R θjc Thermal Resistance-Junction to Case 2.5 C/W Mounted on PCB of 1in 2 pad area T C =25 C 48 I DP 3µs Pulse Drain Current Tested T C =1 C 32 I D P D Continuous Drain Current T =25 C 12 T =1 C 8 Maximum Power Dissipation T =25 C 2.5 T =1 C 1 W R θj Thermal Resistance-Junction to mbient 5 C/W Mounted on PCB of Minimum Footprint T C =25 C 4 I DP 3µs Pulse Drain Current Tested T C =1 C 24 I D P D Continuous Drain Current T =25 C 1 T =1 C 6 Maximum Power Dissipation T =25 C 1.5 T =1 C.5 W R θj Thermal Resistance-Junction to mbient 75 C/W Copyright NPEC Electronics Corp. Rev.. 2 - Feb., 28 2
PM41NU Electrical Characteristics (T =25 C Unless Otherwise Noted) Symbol Parameter Test Condition PM41NU Min. Typ. Max. Unit Static Characteristics BV DSS Drain-Source Breakdown Voltage V GS =V, I DS =25µ 4 V I DSS Zero Gate Voltage Drain Current V DS =32V, V GS =V 1 T J =85 C 3 V GS(th) Gate Threshold Voltage V DS =V GS, I DS =25µ 1.5 2 2.5 V I GSS Gate Leakage Current V GS =±2V, V DS =V ±1 n R DS(ON) a Drain-Source On-state Resistance V GS =1V, I DS =15 8.2 1 V GS =5V, I DS =8 13 17 Diode Characteristics V SD a Diode Forward Voltage I SD =15, V GS =V.8 1.1 V t rr Reverse Recovery Time 28 ns I DS =15, dl SD /dt=1/µs Reverse Recovery Charge 25 nc Q rr Gate Charge Characteristics b Q g Total Gate Charge 29 41 Q gs Gate-Source Charge V DS =2V, V GS =1V, I DS =15 3.6 Gate-Drain Charge 9.6 Q gd Dynamic Characteristics b R G Gate Resistance V GS =V,V DS =V,F=1MHz 1.5 Ω C iss Input Capacitance V GS =V, 14 C oss Output Capacitance V DS =2V, 215 Reverse Transfer Capacitance Frequency=1.MHz 15 C rss t d(on) Turn-on Delay Time 12 23 t r Turn-on Rise Time V DD =2V, R L =2Ω, 12 23 I DS =1, V GEN =1V, t d(off) Turn-off Delay Time R G =6Ω 37 68 Turn-off Fall Time 12 23 t f Notes a : Pulse test ; pulse width 3µs, duty cycle 2%. b : Guaranteed by design, not subject to production testing. µ mω nc pf ns Copyright NPEC Electronics Corp. Rev.. 2 - Feb., 28 3
PM41NU Typical Characteristics Power Dissipation Drain Current 6 7 5 6 Ptot - Power (W) 4 3 2 ID - Drain Current () 5 4 3 2 1 1 T C =25 o C 2 4 6 8 1 12 14 16 18 T C =25 o C,V G =1V 2 4 6 8 1 12 14 16 Tj - Junction Temperature ( C) Tj - Junction Temperature ( C) Safe Operation rea Thermal Transient Impedance 2 2 ID - Drain Current () 1 1 1 Rds(on) Limit 1ms 1ms 1ms 1s DC Normalized Effective Transient 1.1.5.2.1.1 Duty =.5.2 T C =25 O C.1.1.1 1 1 1 VDS - Drain - Source Voltage (V) Mounted on 1in 2 pad Single Pulse R θj :5 o C/W.1 1E-4 1E-3.1.1 1 1 1 Square Wave Pulse Duration (sec) Copyright NPEC Electronics Corp. Rev.. 2 - Feb., 28 4
PM41NU Typical Characteristics (Cont.) Output Characteristics Drain-Source On Resistance 14 V GS = 6.5,7,8,9,1V 28 ID - Drain Current () 12 6V 1 5.5V 8 5V 6 4.5V 4 4V 2 3.5V 3V..5 1. 1.5 2. 2.5 3. VDS - Drain-Source Voltage (V) RDS(ON) - On - Resistance (mω) 24 2 16 12 8 4 V GS =5V V GS =1V 1 2 3 4 5 6 ID - Drain Current () Drain-Source On Resistance Gate Threshold Voltage RDS(ON) - On - Resistance (mω) 32 28 24 2 16 12 8 I D =15 Normalized Threshold Vlotage 1.6 1.4 1.2 1..8.6.4.2 I DS =25µ 4 2 3 4 5 6 7 8 9 1 VGS - Gate - Source Voltage (V). -5-25 25 5 75 1 125 15 Tj - Junction Temperature ( C) Copyright NPEC Electronics Corp. Rev.. 2 - Feb., 28 5
PM41NU Typical Characteristics (Cont.) Drain-Source On Resistance Source-Drain Diode Forward 2. 1.8 V GS = 1V I DS = 15 1 Normalized On Resistance 1.6 1.4 1.2 1..8.6.4 IS - Source Current () 1 1 T j =15 o C T j =25 o C.2 R ON @T j =25 o C: 8.2mΩ. -5-25 25 5 75 1 125 15.1..2.4.6.8 1. 1.2 1.4 Tj - Junction Temperature ( C) VSD - Source-Drain Voltage (V) C - Capacitance (pf) 22 2 18 16 14 12 1 8 6 4 2 Crss Capacitance Coss Frequency=1MHz Ciss 5 1 15 2 25 3 35 4 VDS - Drain - Source Voltage (V) VGS - Gate-source Voltage (V) 1 9 8 7 6 5 4 3 2 1 V DS = 2V I D = 15 Gate Charge 5 1 15 2 25 3 QG - Gate Charge (nc) Copyright NPEC Electronics Corp. Rev.. 2 - Feb., 28 6
PM41NU Package Information TO-252 E b3 c2 E1 GUGE PLNE L L4 D L3 H D1 b e c SEE VIEW SETING PLNE.25 VIEW 1 S Y M MILLIMETERS B O L MIN. MX. 1 b3 c c2 D D1 E 2.39.13 b.5.89 E1 e H L L3 2.18 4.95 5.46.46.61.46.89 5.33 4.57 6.35 6.73 3.81 9.4.9 2.29 BSC 6.22 6. 6. 1.78 L4 1.2 TO-252 MIN..86 INCHES.9 BSC MX..94.2.35.195.215.18.24.18.21.18 1.41.37.5.35.245.25.265.15.35.41.7.89 2.3.35.8.4 8 8 Note : Follow JEDEC TO-252..235.235 Copyright NPEC Electronics Corp. Rev.. 2 - Feb., 28 7
PM41NU Carrier Tape & Reel Dimensions OD P P2 P1 H E1 OD1 B T B W F K B SECTION - SECTION B-B d T1 pplication H T1 C d D W E1 F 33. 16.4+2. 13.+.5 5 MIN. 1.5 MIN. 2.2 MIN. 16..3 1.75.1 7.5.5 2. -. -.2 TO-252 P P1 P2 D D1 T B K 1.5+.1.6+. 1.4 4..1 8..1 2..5 1.5 MIN. 6.8.2 2.5.2 -. -.4.2 Devices Per Unit (mm) Package Type Unit Quantity TO-252 Tape & Reel 25 Copyright NPEC Electronics Corp. Rev.. 2 - Feb., 28 8
PM41NU Reflow Condition (IR/Convection or VPR Reflow) T P Ramp-up tp Critical Zone T L to T P Temperature T L Tsmax Tsmin ts Preheat t L Ramp-down 25 t 25 C to Peak Reliability Test Program Time Test item Method Description SOLDERBILITY MIL-STD-883D-23 245 C, 5 sec HOLT MIL-STD-883D-15.7 1 Hrs Bias @125 C PCT JESD-22-B, 12 168 Hrs, 1%RH, 121 C TST MIL-STD-883D-111.9-65 C~15 C, 2 Cycles Classification Reflow Profiles Profile Feature Sn-Pb Eutectic ssembly Pb-Free ssembly verage ramp-up rate (T L to T P ) 3 C/second max. 3 C/second max. Preheat 1 C 15 C - Temperature Min (Tsmin) 15 C 2 C - Temperature Max (Tsmax) 6-12 seconds 6-18 seconds - Time (min to max) (ts) Time maintained above: - Temperature (T L ) - Time (t L ) 183 C 6-15 seconds 217 C 6-15 seconds Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5 C of actual Peak Temperature (tp) 1-3 seconds 2-4 seconds Ramp-down Rate 6 C/second max. 6 C/second max. Time 25 C to Peak Temperature 6 minutes max. 8 minutes max. Note: ll temperatures refer to topside of the package. Measured on the body surface. Copyright NPEC Electronics Corp. Rev.. 2 - Feb., 28 9
PM41NU Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process Package Peak Reflow Temperatures Package Thickness Volume mm 3 <35 Volume mm 3 Table 2. Pb-free Process Package Classification Reflow Temperatures Package Thickness Volume mm 3 <35 Volume mm 3 35-2 Volume mm 3 >2 <1.6 mm 26 + C* 26 + C* 26 + C* 1.6 mm 2.5 mm 26 + C* 25 + C* 245 + C* 2.5 mm 25 + C* 245 + C* 245 + C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature + C. For example 26 C+ C) at the rated MSL level. 35 <2.5 mm 24 +/-5 C 225 +/-5 C 2.5 mm 225 +/-5 C 225 +/-5 C Customer Service npec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642 Fax : 886-3-56425 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindain City, Taipei County 23146, Taiwan Tel : 886-2-291-3838 Fax : 886-2-2917-3838 Copyright NPEC Electronics Corp. Rev.. 2 - Feb., 28 1