MEMS som byggeklossett SensoNor perspektiv 14. mai 2009 SensoNor Technologies AS CTO Terje Kvisterøy Hva er viktig? Hva er tilgjengelig?
SensoNor Technologies AS MEMS all the way! Akers Elektronikk (later AME) start up at Horten, NORWAY, 1965; origin from SI (later Sintef) Spun off from AME in 1985 Listed on the Oslo Stock Exchange from 1992 2003 Acquired 100% 2003 by Infineon Delisting from Oslo Stock Exchange MBO structured split from Infineon March 2009 Today approximately 150 employees Sales 2008, 323 million NOK SensoNor operate its own Front End (FE) and Back End (BE) production facilities: 150 mm wafer fab for Bulk Micromachining capacity 3000 wafers a month Currently manufacturing approx 1 million sensor dies a week Assembly, packaging, and test capacity approx 15 million devices a year Core competence: Gyro Sensors 10 years of experience 2 million shipped Accelerometers 30 years of experience 35 million shipped Pressure Sensors 40 years of experience 200 million shipped SensoNor Technologies AS 2
Everything is technically possible! Silicon + Thin film processing Mite Approaching the Gear Chain Indexing Motor Silicon Mirror and Drive System Optical Encoder SensoNor Technologies AS 3
What is MEMS? Micro Electro Mechanical Systems characteristics Wafer based manufacturing (e.g. 6 and 8 today) Use of semiconductor industry infrastructure Examples of technologies complying with above, but are not typ. MEMS Hall sensors Magneto resistive sensors SAW filters / BAW resonators Photo and radiation sensors Examples of technologies not complying with above, not typ. MEMS Quartz resonators (e.g. in clocks) Quartz based sensors (e.g. in gyros) Micro Electro Mechanical Systems value chain MEMS component (e.g. pressure sensor) into sub system (e.g. electronic control unit) into system (e.g. engine) into OEM product (final product; e.g. car) SensoNor Technologies AS 4
Why MEMS? (often a strategic issue) Lower costdue to wafer based high volume manufacturing technology Can justify complete installations (no compromise in number of systems) Can improve redundancy (more parallel systems in sensitive applications) Can motivate use of enabling solutions for new or present applications Can save expenditure Smaller size due to semiconductor technology and system in package (SiP) solutions Can motivate use of enabling solutions for new or present applications (not enough roomspace for present state of art technology) Can result in much smaller system weight and size ( amplification factor) Lower weight due to semiconductor technology and system in package (SiP) solutions Can motivate use of enabling solutions for new or present applications (present state of art technology is to heavy) Can result in much smaller system weight and size ( amplification factor) More robust due to lower weight (vibration), more integration (less mechanical and electrical connections) and less power (less self generated heat) Less maintenance and replacement costs No down time (critical factor for sensitive applications) Less redundancy needed (save costs) Less power due to custom MEMS and IC technology Can motivate use of enabling solutions for new or present applications (no compromise in number of systems) More simple power supply systems (save costs) Better reliability and functionality due to less self heating Sensonor Technologies AS 5
MEMS principles in use Sensing principles (technologies) Piezoresistive Capacitive Magnetoresistive / hall effect Resistive Piezoelectric Actuating principles (technologies) Electrostatic Thermal (resistive) Piezoelectric SensoNor Technologies AS 6
Sensonor Gyro Example Air bag Application Z Pin 1 X=Sensitive axis Y SensoNor Technologies AS 7
Sensonor Gyro Example Coriolis Principle F (force) = 2 x M (mass) x Ω (angular rate) x V (excitation velocity) Excitation (typ 5μm) creating radial (V) velocity (on the tip) Detection caused by Coriolis force (open loop shown) SensoNor Technologies AS 8
Sensonor Gyro Example Design Triple stack structure Photo through top glass Low-C buried crossing 1 micron gap Interconnects on glass Travel stopper LSON 6 5 4 3 2 1 R12 C15 Electrode pattern on glass Press contacts Wire bond pads Glass p-type n-type Glass SensoNor Technologies AS 9
Micromachined Single Crystal Silicon Mass thickness 17μm Beam width 10μm SEM image of the butterfly masses SEM image of the wet etched notch and the RIE shaping the asymmetric beam Feature size 10μm Slits for stress relief and holes for damping control SensoNor Technologies AS 10
Assembly Manufacturing Process Die attach on copper based leadframe Epoxy over moulding Gyro Chip and ASIC wire bonding SensoNor Technologies AS 11
When to use MEMS? Is MEMS available? Can be used in applications for sensors and RF components and fluidics when small size, low weight, low power or low price matters Examples: pressure sensors accelerometers (angular and linear) gyros microphones non cooled bolometers (thermal imaging) Si clock (resonator/oscillator) drug delivery MEMS is mainly available in ranges and mechanical fits as directed by the volume industry SensoNor Technologies AS 12
Where do all the chips go? SensoNor Technologies AS 13
TOP 30 MEMS Manufactures Print heads DLPs Automotive Laptops & gaming Off-shelf available SensoNor Technologies AS 14
Top MEMS devices Compare: semiconductor revenue totaling $261.9 billion in 2008 SensoNor Technologies AS 15
MEMS inside Thermal ink jet printers SensoNor Technologies AS 16
MEMS inside TI DMD SensoNor Technologies AS 17
MEMS inside Sensonor Tire Pressure Module a) SiP with sensor die + ASIC + RF Piezoresistive pressure & acceleration sensor Wheel module w/battery SensoNor Technologies AS 18
MEMS inside Sensonor Tire Pressure Module b) Tripple stack sensor die Accelerometer and pressure sensor Chip area Sensitivity (p) Sensitivity (z) Resonance (z) Typ Q factor 2.6 x 2.3 mm2 32 µv/v/kpa 35 µv/v/g 6.5 khz 200 400 SensoNor Technologies AS 19
MEMS inside Sensonor Tire Pressure Module c) Pressure Sensor Temperature Sensor Accelerometer Sensor µc Logic Control Memory Timer RF Transmitter LF Receiver Supply Voltage Sensor SensoNor Technologies AS 20
MEMS inside computer & gamepads ST accelerometer in Wii controller SensoNor Technologies AS 21
MEMS inside cell phones RF MEMS OMRON RF MEMS Switch SensoNor Technologies AS 22
MEMS inside Micro fuidic connector Dolomite s fluidic connector SensoNor Technologies AS 23
MEMS inside Replace quartz resonators & oscillators SensoNor Technologies AS 24
Sensonor/Sintef/VUC MEMS Energy Harvester a) SensoNor Technologies AS 25
Movie showing long travel length for the seismic mass (~200 micrometer) b) SensoNor Technologies AS 26
Sensonor/Sintef/VUC MEMS Energy Harvester c) SensoNor Technologies AS 27
Some MEMS are for free! The cell-phone market decides! SensoNor Technologies AS 28
MEMS products in cell phone SensoNor Technologies AS 29
MEMS inside Silicone microphone Infineon Akustica SensoNor Technologies AS 30
MEMS global volume / price range pressure die = 500M / 0.25EUR consumer acc = 500M / 0.5EUR consumer microphone = 500M / 0.5EUR automotive accelerometer = 150M / 1EUR automotive sensor w/ microcontroller = 100M / 2EUR consumer gyro = 50M / 2EUR automotive gyro = 10M / 10EUR industrial accelerometer = 1M / 50EUR precision pressure = 500k / 200EUR DLM = 500k / 500EUR precision gyro = 100k / 500EUR bolometer = 100k / 1000EUR SensoNor Technologies AS 31
MEMS business model SensoNor Technologies AS 32
Major Norwegian MEMS activities www.sensonor.com mems pressure / inertia / thermal imaging sensors www.memscap.com mems pressure sensors www.presens.com mems pressure sensors www.ignis.com mems fiber optical components www.idex.no mems for finger print detection www.sintef.com mems sensors and actuators research in general www.hive.no mems education and research mainly for 3D packaging http://heim.ifi.uio.no/~oddvar/rfmems.htm mems education SensoNor Technologies AS 33
Memscap (fab less) Precision ( low ) pressure sensor Hystereses and repeatability 0.0025% SensoNor Technologies AS 34
Presens (fab less) Precision (high) pressure transducer 0.025% accuracy ASTRIX SensoNor Technologies AS 35
SensoNor (fab based) Precision gyros & pressure sensor 3 deg/hr 0.3deg/sqrHz SensoNor Technologies AS 36
MEMS specifications varies according to complexity of product! 1 page 38 pages SensoNor Technologies AS 37
Application Specific MEMS What costs? What time? (scale of order) As with ASICs, so custom made MEMS => can only be justified as part of a strategic decision! What time (minimum) Concept => 6 M 1st design => 6 M MPW / samples => 6M 2nd design => 3M Custom wafer run / samples => 4M Qualification / samples => 4M What cost (minimum) Concept => 0.5 MEUR 1st design => 0.5 MEUR MPW / samples => 0.02 MEUR 2nd design => 0.2 MEUR Custom wafer run / samples => 0.3 MEUR Qualification / samples => 0.2 MEUR 1st sample = 1.5 Y Commercial device = 2.5 Y 1st sample = 1 MEUR Commercial device = 2 MEUR SensoNor Technologies AS 38
Sensonor Foundry Service (Norway) www.multimems.com SensoNor Technologies AS 39
Silex Foundry Service (Sweden) www.silexmicrosystems.com SensoNor Technologies AS 40
Tronics Foundry Service (France) www.tronics mst.com SensoNor Technologies AS 41
Dalsa Foundry Service (Canada) www.dalsa.com/semi/ SensoNor Technologies AS 42
imt Foundry Service (USA) www.imtmems.com SensoNor Technologies AS 43
Sources for MEMS info (starter) Interesting sites: www.sandia.com http://www leti.cea.fr Journals and magazines www.smalltimes.com IEEE/ASME Journal of Microelectromechanical Systems www.mstnews.de MEMS industry associations www.memsindustrygroup.org www.mancef.org Global Conferences and/or Exhibitions www.sensor test.de (Nürenberg) www.sensorsexpo.com (Chicago + China + Japan) www.mancef coms2009.org (global tour) www.transducers09.org (each second year, global tour) www.mems2009.org (global tour) Market Research and Strategy Consulting Companies www.yole.fr (Micronews) www.isuppli.com SensoNor Technologies AS 44