5 Watt Mosorb Zener Transient Voltage Suppressors Unidirectional Mosorb devices are designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. These devices are ON Semiconductor s exclusive, cost-effective, highly reliable Surmetic axial leaded package and are ideally-suited for use in communication systems, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications, to protect CMOS, MOS and Bipolar integrated circuits. Features Working Peak Reverse Voltage Range 5.8 V to 4 V Peak Power 5 Watts @ ms ESD Rating of Class 3 (>6 kv) per Human Body Model Maximum Clamp Voltage @ Peak Pulse Current Low Leakage < 5 A Above V UL 497B for Isolated Loop Circuit Protection Response Time is Typically < ns Pb Free Packages are Available* Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are readily solderable MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES: 6 C, /6 in from the case for seconds POLARITY: Cathode indicated by polarity band MOUNTING POSITION: Any Cathode Anode AXIAL LEAD CASE 4A PLASTIC MARKING DIAGRAMS A.5KE xxxa YYWW A N6 xxx YYWW A = Assembly Location.5KExxxA = ON Device Code N6xxx = JEDEC Device Code YY = Year WW = Work Week = Pb Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping.5KExxxAG.5KExxxARL4G N6xxxAG N6xxxARL4G 5 Units/Box 5/Tape & Reel 5 Units/Box 5/Tape & Reel *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. Semiconductor Components Industries, LLC, October, Rev. 3 Publication Order Number: N667A/D
MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation (Note ) @ T L 5 C P PK 5 W Steady State Power Dissipation @ T L 75 C, Lead Length = 3/8 in Derated above T L = 75 C P D 5. W mw/ C Thermal Resistance, Junction to Lead R JL C/W Forward Surge Current (Note ) @ T A = 5 C I FSM A Operating and Storage Temperature Range T J, T stg 65 to +75 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Nonrepetitive current pulse per Figure 5 and derated above T A = 5 C per Figure.. / sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. ELECTRICAL CHARACTERISTICS (T A = 5 C unless otherwise noted, V F = 3.5 V Max., I F (Note 3) = A) Symbol Parameter I I PP Maximum Reverse Peak Pulse Current I F V C Clamping Voltage @ I PP V RWM Working Peak Reverse Voltage I R V BR I T Maximum Reverse Leakage Current @ V RWM Breakdown Voltage @ I T Test Current V RWM V C V BR I R I T V F V V BR Maximum Temperature Coefficient of V BR I F Forward Current V F Forward Voltage @ I F I PP Uni Directional TVS
ELECTRICAL CHARACTERISTICS (T A = 5 C unless otherwise noted, V F = 3.5 V Max. @ I F (Note 3) = A) Device JEDEC Device (Note 4) Breakdown Voltage V C @ I PP (Note 7) V RWM (Note 5) I R @ V RWM V BR (Note 6) (Volts) @ I T V C I PP V BR (Volts) ( A) Min Nom Max (ma) (Volts) (A) (%/ C).5KE6.8AG N667AG 5.8 6.45 6.8 7.4.5 43.57.5KE7.5AG 6.4 5 7.3 7.5 7.88.3 3.6.5KE8.AG N669AG 7. 7.79 8. 8.6. 4.65.5KE9.AG 7.78 5 8.65 9. 9.55 3.4.68.5KEAG N67AG 8.55 9.5.5 4.5 3.73.5KEAG 9.4 5.5.6 5.6 96.75.5KEAG. 5.4.6 6.7 9.78.5KE3AG N674AG. 5.4 3 3.7 8. 8.8.5KE5AG N675AG.8 5 4.3 5 5.8. 7.84.5KE6A, G N676AG 3.6 5 5. 6 6.8.5 67.86.5KE8A, G N677AG 5.3 5 7. 8 8.9 5. 59.5.88.5KEAG N678AG 7. 5 9 7.7 54.9 N679AG 8.8 5.9 3. 3.6 49.9.5KE4AG N68AG.5 5.8 4 5. 33. 45.94.5KE7AG N68AG 3. 5 5.7 7 8.4 37.5 4.96.5KE3AG N68AG 5.6 5 8.5 3 3.5 4.4 36.97.5KE33AG N683AG 8. 5 3.4 33 34.7 45.7 33.98.5KE36AG N684AG 3.8 5 34. 36 37.8 49.9 3.99.5KE39AG N685AG 33.3 5 37. 39 4 53.9 8..5KE43AG N686AG 36.8 5 4.9 43 45. 59.3 5.3..5KE47AG N687AG 4. 5 44.7 47 49.4 64.8 3...5KE5AG N688A, G 43.6 5 48.5 5 53.6 7..4..5KE56AG N689AG 47.8 5 53. 56 58.8 77 9.5.3.5KE6AG N69AG 53 5 58.9 6 65. 85 7.7.4.5KE68AG N69AG 58. 5 64.6 68 7.4 9 6.3.4.5KE75AG N69AG 64. 5 7.3 75 78.8 3 4.6.5.5KE8A, G 7. 5 77.9 8 86. 3 3.3.5.5KE9AG N694AG 77.8 5 86.5 9 95.5 5.6 N695AG 85.5 5 95 5 37.6 Devices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and best overall value. 3. / sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. 4. Indicates JEDEC registered data 5. A transient suppressor is normally selected according to the maximum working peak reverse voltage (V RWM ), which should be equal to or greater than the dc or continuous peak operating voltage level. 6. V BR measured at pulse test current I T at an ambient temperature of 5 C 7. Surge current waveform per Figure 5 and derate per Figures and. The G suffix indicates Pb Free package or Pb Free packages are available. 3
P PK, PEAK POWER (kw) NONREPETITIVE PULSE WAVEFORM SHOWN IN FIGURE 5 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 5 C 8 6 4. s s s s ms ms t P, PULSE WIDTH 5 5 75 5 5 75 T A, AMBIENT TEMPERATURE ( C) Figure. Pulse Rating Curve Figure. Pulse Derating Curve, MEASURED @ ZERO BIAS, MEASURED @ ZERO BIAS C, CAPACITANCE (pf) MEASURED @ V RWM C, CAPACITANCE (pf) MEASURED @ V RWM V BR, BREAKDOWN VOLTAGE (VOLTS) V BR, BREAKDOWN VOLTAGE (VOLTS) Figure 3. Capacitance versus Breakdown Voltage P D, STEADY STATE POWER DISSIPATION (WATTS) 5 4 3 3/8 3/8 5 5 75 5 5 75 T L, LEAD TEMPERATURE ( C) Figure 4. Steady State Power Derating, VALUE (%) IPP 5 t r PEAK VALUE - I PP t P HALF VALUE - PULSE WIDTH (t P ) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 5% OF I PP. tr s 3 4 I PP t, TIME (ms) Figure 5. Pulse Waveform 4
IT, TEST CURRENT (AMPS) 5 5 5 T L = 5 C t P = s V BR(NOM) = 6.8 to 3 V V 4 V 43 V V 75 V 8 V.3.5.7 3 5 7 3 V BR, INSTANTANEOUS INCREASE IN V BR ABOVE V BR(NOM) (VOLTS) DERATING FACTOR.7.5.3...7.5.3. PULSE WIDTH ms ms s s....5 5 5 D, DUTY CYCLE (%) Figure 6. Dynamic Impedance Figure 7. Typical Derating Factor for Duty Cycle APPLICATION NOTES RESPONSE TIME In most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitance effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 8. The inductive effects in the device are due to actual turn-on time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 9. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. These devices have excellent response time, typically in the picosecond range and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper circuit layout, minimum lead lengths and placing the suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Z in is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation. DUTY CYCLE DERATING The data of Figure applies for non-repetitive conditions and at a lead temperature of 5 C. If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 7. Average power must be derated as the lead or ambient temperature rises above 5 C. The average power derating curve normally given on data sheets may be normalized and used for this purpose. At first glance the derating curves of Figure 7 appear to be in error as the ms pulse has a higher derating factor than the s pulse. However, when the derating factor for a given pulse of Figure 7 is multiplied by the peak power value of Figure for the same pulse, the results follow the expected trend. 5
TYPICAL PROTECTION CIRCUIT Z in V in LOAD V L V V in (TRANSIENT) V OVERSHOOT DUE TO INDUCTIVE EFFECTS V in (TRANSIENT) V L V L V in t d t D = TIME DELAY DUE TO CAPACITIVE EFFECT t t Figure 8. Figure 9. The entire series has Underwriters Laboratory Recognition for the classification of protectors (QVGQ) under the UL standard for safety 497B and File #E57. Many competitors only have one or two devices recognized or have recognition in a non-protective category. Some competitors have no recognition at all. With the UL497B recognition, our parts successfully passed several tests including Strike Voltage Breakdown test, Endurance UL RECOGNITION* Conditioning, Temperature test, Dielectric Voltage- Withstand test, Discharge test and several more. Whereas, some competitors have only passed a flammability test for the package material, we have been recognized for much more to be included in their Protector category. *Applies to.5ke6.8a thru.5ke5a 6
PACKAGE DIMENSIONS MOSORB CASE 4A 4 ISSUE D B P P D K A NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 98.. CONTROLLING DIMENSION: INCH. 3. LEAD FINISH AND DIAMETER UNCONTROLLED IN DIMENSION P. 4. 4A- THRU 4A-3 OBSOLETE, NEW STANDARD 4A-4. INCHES MILLIMETERS DIM MIN MAX MIN MAX A.335.374 8.5 9.5 B.89.9 4.8 5.3 D.38.4.96.6 K. --- 5.4 --- P ---.5 ---.7 K Mosorb and Surmetic are trademarks of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 87 USA Phone: 33 675 75 or 8 344 386 Toll Free USA/Canada Fax: 33 675 76 or 8 344 3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 8 8 9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 4 33 79 9 Japan Customer Focus Center Phone: 8 3 5773 385 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative N667A/D