Manufacturing Challenges in Electronic Packaging

Manufacturing Challenges in Electronic Packaging

Manufacturing Challenges in Electronic Packaging Y.C. Lee University of Colorado, Boulder, CO, USA and WT. Chen formerly a Senior Technical Staff Member, IBM Corporation, Endicott, New York, currently Visiting Principal Research Fellow, Institute of Materials Research and Engineering, Singapore SPRINGER-SCIENCE+BUSINESS MEDIA, B.V.

First edition 1998 1998 Springer Science+Business Media Dordrecht Originally published by Chapman & Hali in 1998 Softcover reprint of the hardcover 1st edition 1998 Typeset in 1O/12pt Palatino by Saxon Graphics Ltd, Derby ISBN 978-1-4613-7659-0 ISBN 978-1-4615-5803-3 (ebook) DOI 10.1007/978-1-4615-5803-3 Apart from any fair dealing for the purposes of research or private study, or criticism or review, as permitted under the UK Copyright Designs and Patents Act, 1988, this publication may not be reproduced, stored, or transmitted, in any form or by any means, without the prior permission in writing of the publishers, or in the case of reprographic reproduction only in accordance with the terms of the licences issued by the Copyright Licensing Agency in the UK, or in accordance with the terms of licences issued by the appropriate Reproduction Rights Organization outside the UK. Enquiries concerning reproduction outside the terms stated here should be sent to the publishers at the London address printed on this page. The publisher makes no representation, express or implied, with regard to the accuracy of the information contained in this book and cannot accept any legal responsibility or liability for any errors ar omissions that may be made. A catalogue record for this book is available from the British Library 00 Printed on acid-free text paper, manufaclured in accordance with ANSI/NISO Z39.48-1992 (Performanence of Paper).

Contents List of contributors Preface ix xi 1. Manufacturing challenges in electronic packaging: an overview 1 W. T. Chen, A.K. Trivedi and].a. Welsh 1.1 Introduction 1 1.2 Industries and markets and applications segments 6 1.3 Semiconductor technology trends and road map forecast 12 1.4 Microelectronic packaging 28 1.5 PCB manufacturing for organic packaging 46 1.6 Assembly technology in manufacturing of electronic packages 64 1.7 Conclusion 79 References 80 2. Challenges in solder assembly technologies P.P. Conway and D.]. Williams 2.1 Introduction 2.2 The interaction of soldering process with soldering materials 2.3 Processing the challenges 2.4 Soldering materials issues 2.5 Summary and conclusions References 82 82 84 94 108 111 112

vi Contents 3. Testing and characterization 114 T. Y. Wu and M.A. Gaynes 3.1 Introduction 114 3.2 Coefficient of thermal expansion 118 3.3 Mechanical characterization of thin-film materials 119 3.4 Tensile ductility of plated copper 123 3.5 PTH cracking 131 3.6 Warpage 133 3.7 Solder strain 135 3.8 Fracture toughness and crack propagation 137 3.9 Adhesion and interfacial delamination 140 3.10 Moisture 144 3.11 Summary 151 References 153 4. Design for manufacture and assembly of electronic packages 156 S.A. Leclerc and G. Subbarayal1 4.1 Introduction 156 4.2 General considerations 159 4.3 Design guidelines for the manufacture of PCBs 163 4.4 Design guidelines for the assembly of PCBs 168 4.5 Estimating the assembly cost 175 4.6 Case study 179 4.7 Concluding remarks 182 References 183 5. Process modeling, optimization and control in electronics manufacturing 185 R.L. Mahajan 5.1 Introduction 185 5.2 Physical models 188 5.3 Empirical models 194 5.4 Combined physical-empirical models 200

Contents 5.5 Process optimization 5.6 Run-by-run and real-time process control 5.7 Concluding remarks References Vll 203 206 216 217 6. Integrated manufacturing system for printed circuit board assembly 221 H. Onari 6.1 Introduction 221 6.2 Requirements of PCB assembly system 224 6.3 Outline of integrated manufacturing system for PCB assembly 229 6.4 Assembly process planning 236 6.5 Assembly scheduling 245 References 252 Index 255

Contributors Dr W.T. Chen (fonnerly), A.K. Trivedi and J.A Welsh IBM Corporation 1701 North Street Endicott, NY 13760 USA Dr P.P. Conway and Professor D.J. Williams Dept of Manufacturing Engineering Loughborough University of Technology Loughborough Leicestershire LE11 3TU UK Professor G. Subbarayan and S.A. Leclerc Dept of Mechanical Engineering University of Colorado Boulder, CO 80309-0427 USA Professor H. Onari Waseda University Science & Engineering Faculty Industrial Management Dept 3-4-1 Ohkubo, Shunjuku-ku Tokyo 169-50 Japan Dr T.Y. Wu and M.A. Gaynes IBM Corporation 1701 North Street Endicott, NY 13760 USA

x Contributors Professors y.c. Lee and R.L. Mahajan Dept of Mechanical Engineering University of Colorado Boulder, CO 80309-0427 USA

Preface About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing challenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging. Y.c. Lee, University of Colorado, Boulder W.T. Chen, Visiting Principal Research Fellow, Institute of Materials Research and Engineering, Singapore January 27,1997