PLA171PTR. Single-Pole, Normally Open OptoMOS Relay INTEGRATED CIRCUITS DIVISION

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Single-Pole, Normally Open OptoMOS Relay Parameter Rating Units Load Voltage 8 V P Load Current ma rms / ma DC On-Resistance (max) Input Control Current 2 ma Features 7mm Separation of Output Pins 8V P Blocking Voltage V rms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small Surface Mount Package Machine Insertable, Wave Solderable Flammability Rating UL 94 V- Applications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment Patient/Equipment Isolation Automotive High-Voltage Circuitry Aerospace Industrial Controls Description Specially designed to provide 7mm of separation between the two output pins, IXYS Integrated Circuits Division's is a single-pole, normally open (1-Form-A) Solid State Relay that uses optically coupled MOSFET technology to provide an en hanced input-to-output isolation of V rms. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The is designed to replace, and offers superior reliability over, electromechanical relays. This device provides bounce-free switching in a compact surface-mount package. Approvals UL Certified Component: File E7627 EN/IEC 69 Certified Component: TUV Certificate B 12 11 82667 1 Ordering Information Part # P PTR Pin Configuration Description 6-Pin (8-Pin Body) Flatpack (/Tube) 6-Pin (8-Pin Body) Flatpack, Tape & Reel (/Reel) 1 NC 2 + Control 3 Control 4 NC 8 Load Load Switching Characteristics of Normally Open Devices Form-A 9% I LOAD % t on t off Pb e3 DS--R3 www.ixysic.com 1

Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Blocking Voltage 8 V P Reverse Input Voltage V Input Control Current ma Peak (ms) 1 A Input Power Dissipation 1 1 mw Total Power Dissipation 2 8 mw ESD, Human Body Model 8 kv Isolation Voltage, Input to Output (6 Seconds) V rms Operational Temperature -4 to +8 C Storage Temperature -4 to +12 C 1 Derate linearly 1.33 mw / ºC 2 Derate linearly 6.67 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 2ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 =2mA I L - - ma rms / ma DC Peak =2mA, t=ms I LPK - - ±3 ma P On-Resistance 2 =2mA, I L = ma - 4 R I ON F =ma, I L =1mA - 7 8 Off-State Leakage Current =ma, V L =8V P I LEAK - - 1 µa Switching Speeds Turn-On t =ma, V L =V on -.42 Turn-Off t off -.1 ms Output Capacitance =ma, V L =V, f=1mhz C OUT - 11 - pf Input Characteristics Input Control Current to Activate 3 I L =ma -.39 2 ma Input Control Current to Deactivate -.1 - - ma Input Voltage Drop =ma V F.9 1.2 1.4 V Reverse Input Current V R =V I R - - µa Common Characteristics Input to Output Capacitance - C I/O - 3 - pf 1 Load derates linearly from ma @ 2 o C to ma @8 o C. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 6 o C) a LED drive current of ma is recommended. R3 2 www.ixysic.com

PERFORMANCE DATA @ 2ºC (Unless Otherwise Noted) * 3 Typical LED Forward Voltage Drop (N=, =ma) 2 Typical Turn-On Time (N=, =ma, I L =ma) 2 Typical Turn-Off Time (N=, =ma, I L =ma) 3 2 2 1 2 1 1 1.23 1.23 1.24 1.24 1.2 1.2 LED Forward Voltage (V).36.38.4.42.44.46.48 Turn-On Time (ms).13.14.14.1.1.16.16 Turn-Off Time (ms) 1 Typical for Switch Operation (N=, I L =ma) 3 Typical On-Resistance Distribution (N=, =2mA, I L =ma) 1 Typical Blocking Voltage Distribution (N=) 3 2 2 1.33.3.37.39.41.43.4 4. 4. 41. 41. 42. 42. On-Resistance ( ) 96 964 972 98 988 996 4 Blocking Voltage (V P ) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R3 www.ixysic.com 3

PERFORMANCE DATA @ 2ºC (Unless Otherwise Noted) * 1.6 Typical LED Voltage Drop.7 Typical Turn-On Time vs. LED Forward Current (I L =ma).16 Typical Turn-Off Time vs. LED Forward Current (I L =ma) LED Voltage Drop (V) 1. 1.4 1.3 1.2 =ma =2mA 1.1 =ma =ma 1. =2mA Turn-On Time (ms).6..4.3.2.1 2 3 4 Turn-Off Time (ms).18.16.14.12.1.148 2 3 4. LED Current to Operate (I L =ma).9 Typical Turn-On Time.2 Typical Turn-Off Time..4.4 Turn-On Time (ms).8.7.6..4 =2mA =ma Turn-Off Time (ms).18.16.14.12 =ma =2mA.3.3. On-Resistance ( ) 7 6 4 3 Typical On-Resistance ( =ma) I L =3mA I L =ma Load Current (ma) - Typical Load Current vs. Load Voltage ( =2mA) Load Current (ma) 1 9 8 7 6 Maximum Load Current ( =ma) 2 - -6-4 -2 2 4 6 Voltage (V) Blocking Voltage (V P ) 4 2 98 96 94 92 Typical Blocking Voltage 9 Leakage Current (na) 8 7 6 4 3 2 Typical Leakage Current (V L =8V) Load Current (A) Energy Rating Curve 1..8.6.4.2. s s 1ms ms ms 1s s s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R3 4 www.ixysic.com

Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Rating P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device P Maximum Temperature x Time 26ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb e3 R3 www.ixysic.com

Mechanical Dimensions P 7.62 TYP (.3) TYP 6.3 ±.127 (.2 ±.) Pin 1 2.4 ±.127 (. ±.).864 ±.2 (.34 ±.4) 9.398 ±.127 (.37 ±.).47 ±.76 (.18 ±.3) 9.62 ±.381 (.38 ±.1) 2.19 ±.2 (.8 ±.1) 2.286 MAX (.9) MAX See Note 3 7.62 ±.24 (.3 ±.) Leadframe to package standoff MIN=. MAX=.2 (.4).23 ±.2 (.8 ±.1).63 ±.127 (.2 ±.) Notes: 1. Coplanarity =.2mm (.4 ) MAX 2. Leadframe thickness does not include solder plating ( micro-inches MAX) 3. Sum of package height, standoff, and coplanarity shall not exceed 2.286mm (.9 ) Recommended PCB Land Pattern 7.62 (.3) 1. (.6).6 (.2) 8.7 (.342) 2.4 (.) Dimensions mm (inches) PTR Tape & Reel 33.2 DIA. (13. DIA.) 2. (.79) 4. (.17) Top Cover Tape Thickness.2 MAX. (.4 MAX.) 7. (.29) Bo =.3 (.46) W = 16. (.63) Embossed Carrier K = 2.7 (.6) K 1 = 2. (.79) P = 12. (.472) User Direction of Feed Ao =.3 (.46) Dimensions mm (inches) Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all Notes for constant dimensions listed on page of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS--R3 Copyright 213, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 3/2/213