DATA SHEET NE664M04 / 2SC5754 NPN SILICON RF TRANSISTOR FOR MEDIUM OUTPUT POWER AMPLIFICATION (0.4 W) FLAT-LEAD 4-PIN THIN-TYPE SUPER MINIMOLD (M04)

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FEATURES DATA SHEET NPN SILON RF TRANSISTOR NE664M4 / 2SC74 NPN SILON RF TRANSISTOR FOR MEDIUM OUTPUT POWER AMPLIFATION (.4 W) FLAT-LEAD 4-PIN THIN-TYPE SUPER MINIMOLD (M4) Ideal for 46 MHz to 2.4 GHz medium output power amplification PO (1 db) = 26. dbm TYP. @ VCE = 3.6 V, f = 1.8 GHz, Pin = dbm High collector efficiency: = 6% UHS-HV technology (ft = 2 GHz) adopted High reliability through use of gold electrodes Flat-lead 4-pin thin-type super minimold (M4) package ORDERING INFORMATION Part Number Quantity Supplying Form NE664M4-A 2SC74-A NE664M4-T2-A 2SC74-T2-A pcs (Non reel) 8 mm wide embossed taping 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. The unit sample quantity is pcs. Pin 1 (Emitter), Pin 2 (Collector) face the perforation side of the tape Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. JEITA Part No. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Document No. PU18EJ2VDS (2nd edition) Date Published March 23 CP(K) The mark shows major revised points.

NE664M4 / 2SC74 ABSOLUTE MAXIMUM RATINGS (TA = +2 C) Parameter Symbol Ratings Unit Collector to Base Voltage VCBO 13 V Collector to Emitter Voltage VCEO. V Emitter to Base Voltage VEBO 1. V Collector Current ma Total Power Dissipation Ptot Note 73 mw Junction Temperature Tj C Storage Temperature Tstg 6 to + C Note Mounted on 38 38 mm, t =.4 mm polyimide PCB THERMAL RESISTANCE Parameter Symbol Test Conditions Ratings Unit Junction to Ambient Resistance Rth j-a1 Mounted on 38 38 mm, t =.4 mm polyimide PCB 17 C/W Rth j-a2 Stand alone device in free air 7 C/W 2 Data Sheet PU18EJ2VDS

NE664M4 / 2SC74 ELECTRAL CHARACTERISTS (TA = +2 C) DC Characteristics Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Collector Cut-off Current BO VCB = V, IE = ma 1 na Emitter Cut-off Current IEBO VBE = 1 V, = ma 1 na DC Current Gain hfe Note 1, = 1 ma 4 6 1 RF Characteristics Gain Bandwidth Product ft, = 1 ma, f =. GHz 16 2 GHz Insertion Power Gain S21e 2, = 1 ma, f = 2 GHz. 6. db Reverse Transfer Capacitance Cre Note 2 VCB = 3 V, IE = ma, f = 1 MHz 1. 1. pf Maximum Available Power Gain MAG Note 3, = 1 ma, f = 2 GHz 12. db Linear Gain GL VCE = 3.6 V, q = 2 ma, f = 1.8 GHz, Pin = dbm, 1/2 Duty Gain 1 db Compression Output Power PO (1 db) VCE = 3.6 V, q = 4 ma, f = 1.8 GHz, Pin = dbm, 1/2 Duty Collector Efficiency VCE = 3.6 V, q = 4 ma, f = 1.8 GHz, Pin = dbm, 1/2 Duty Notes 1. Pulse measurement: PW 3 μs, Duty Cycle 2% 2. Collector to base capacitance when the emitter grounded 3. MAG = hfe CLASSIFATION Rank Marking S21 S12 FB R7 hfe Value 4 to 1 (K (K 2 1) ) 12. db 26. dbm 6 % Data Sheet PU18EJ2VDS 3

NE664M4 / 2SC74 TYPAL CHARACTERISTS (Unless otherwise specified, TA = +2 C) Total Power Dissipation Ptot (mw) Collector Current (ma) DC Current Gain hfe 1 6 4 2 2 1 1 1 1.1.1.1. 1 1 1 1 TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE Mounted on Polyimide PCB 8 (38 38 mm, t =.4 mm) 73 Stand alone device in free air 2 7 1 12 COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE Ambient Temperature TA ( C).6.7.8.9 1. Base to Emitter Voltage VBE (V) DC CURRENT GAIN vs. COLLECTOR CURRENT 1 1 1 Collector Current (ma) Reverse Transfer Capacitance Cre (pf) Collector Current (ma) 2. 1. 1.. 4 4 3 3 2 2 1 REVERSE TRANSFER CAPACITANCE vs. COLLECTOR TO BASE VOLTAGE f = 1 MHz 1 2 3 4 Collector to Base Voltage VCB (V) COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE 7 ma 6 ma ma 4 ma 3 ma IB :. ma step 2 ma IB =. ma 1 2 3 4 6 Collector to Emitter Voltage VCE (V) 1 ma 4 Data Sheet PU18EJ2VDS

NE664M4 / 2SC74 Gain Bandwidth Product ft (GHz) Insertion Power Gain S21e 2 (db) Maximum Available Power Gain MAG (db) Maximum Stable Power Gain MSG (db) Insertion Power Gain S21e 2 (db) Maximum Available Power Gain MAG (db) Maximum Stable Power Gain MSG (db) GAIN BANDWIDTH PRODUCT vs. COLLECTOR CURRENT 2 f =. GHz 2 1 1 f = 1 GHz 1 1 1 Collector Current (ma) INSERTION POWER GAIN, MAG, MSG vs. COLLECTOR CURRENT 2 1 MSG Collector Current (ma) MAG S21e 2 1 1 1 1 INSERTION POWER GAIN, MAG, MSG vs. COLLECTOR CURRENT 2 f = 2. GHz 1 MSG MAG S21e 2 1 1 1 1 Collector Current (ma) Insertion Power Gain S21e 2 (db) Maximum Available Power Gain MAG (db) Maximum Stable Power Gain MSG (db) Insertion Power Gain S21e 2 (db) Maximum Available Power Gain MAG (db) Maximum Stable Power Gain MSG (db) 3 3 2 2 1 INSERTION POWER GAIN, MAG, MSG vs. FREQUENCY MSG MAG S21e 2 Frequency f (GHz) = 1 ma.1 1 1 INSERTION POWER GAIN, MAG, MSG vs. COLLECTOR CURRENT 2 1 f = 2 GHz MSG MAG S21e 2 1 1 1 1 Collector Current (ma) Data Sheet PU18EJ2VDS

NE664M4 / 2SC74 3 VCE = 3.2 V, f =.9 GHz q = 2 ma, 1/2 Duty 2 2 1 1 1 2 1 1 1 2 3 2 2 1 3 2 VCE = 3.2 V, f = 1.8 GHz q = 4 ma, 1/2 Duty 3 2 2 1 3 2 VCE = 3.6 V, f = 1.8 GHz q = 4 ma, 1/2 Duty 3 2 2 1 1 1 2 2 1 Collector Current (ma), Collector Efficiency η C (%) Collector Current (ma), Collector Efficiency η C (%) Collector Current (ma), Collector Efficiency η C (%) 3 VCE = 3.2 V, f = 2.4 GHz q = 2 ma, 1/2 Duty 2 2 1 1 2 2 2 1 1 1 2 3 2 2 1 3 2 VCE = 3.2 V, f = 1.8 GHz q = 2 ma, 1/2 Duty 3 2 2 1 1 1 2 2 1 3 2 VCE = 3.6 V, f = 1.8 GHz q = 2 ma, 1/2 Duty 3 2 2 1 Collector Current (ma), Collector Efficiency η C (%) Collector Current (ma), Collector Efficiency η C (%) Collector Current (ma), Collector Efficiency η C (%) Remark The graphs indicate nominal characteristics. 6 Data Sheet PU18EJ2VDS

NE664M4 / 2SC74 POWER SUPPLY IMPEDANCE, LOAD IMPEDANCE (Recommended value) Frequency f (GHz) Collector to Emitter Voltage VCE (V) Supply Impedance ZS (Ω) Load Impedance ZL (Ω).9 2.8 to 3.6 8.4.2 j.1 4.3 j 1.8 2.8 to 3.6 6.3 16.4 j.8 6.9 j 2.4 2.8 to 3.6.9 22.1 j.2 17.9 j ZS f =.9 GHz ZS ZL f = 2.4 GHz ZS ZL Tr. ZL RF input line GND ZS B E f = 1.8 GHz ZS ZL E C ZL GND RF output line Data Sheet PU18EJ2VDS 7

NE664M4 / 2SC74 APPLATION EXAMPLE (Low-cost PA solution) Bluetooth Power Class 1 f = 2.4 GHz dbm SS Cordless Phone f = 2.4 GHz T8 NE663M4 2SC9 DCS18 (GSM18) Cellular Phone f = 1.8 GHz Cordless Phone f =.9 GHz dbm 3 dbm R NE678M4 2SC73 T H 13 dbm 2 dbm NE68M3 2SC434 (3-pin TUSMM) 16 dbm 9 dbm R7 NE664M4 2SC74 R7 NE664M4 2SC74 R7 NE664M4 2SC74 R7 2 dbm 22 dbm 26 dbm A 3 9Z1 NE2379A (MOS FET) 2 dbm NE664M4 2SC74 3 dbm 8 Data Sheet PU18EJ2VDS

NE664M4 / 2SC74 EVALUATION CIRCUIT EXAMPLE : 1.8 GHz PA EVALUATION BOARD PCB Pattern and Element Layout RF in C2 C1 VB Equivalent Circuit RF in Parts List C1, C6 C2 C3 C4 C Parts SL1, SL4 SL2 SL3 C1 C2 18 pf SL1 VB Value 3 3 pf 3 pf pf 1. pf SL1 C3 C3 SL2 SL2 SL3 w =.2 mm SL C SL4 VC C4 C6 Tr. (NE664M4 / 2SC74) Size Tr. w =.76 mm, l = 2. mm w =.76 mm, l = mm SL3 VC RF out SL4 Remarks 1. 38 38 mm, t =.4 mm, C4 SL εr = 4. double-sided copper-clad polyimide board 2. Back side : GND pattern 3. Solder plating on pattern 4. : Through holes C C6 Classification Multiplayer ceramic chip capacitor Multiplayer ceramic chip capacitor Multiplayer ceramic chip capacitor Multiplayer ceramic chip capacitor Multiplayer ceramic chip capacitor Strip line Strip line Strip line RF out SL w =.76 mm, l = 1. mm Strip line Data Sheet PU18EJ2VDS 9

NE664M4 / 2SC74 EXAMPLE OF CHARACTERISTS FOR 1.8 GHz PA EVALUATION BOARD 3 VCE = 3.2 V, f = 1.8 GHz q = 4 ma, 1/2 Duty 2 2 1 1 1 2 2 1 1 1 2 3 2 2 1 3 2 VCE = 3.6 V, f = 1.8 GHz q = 4 ma, 1/2 Duty 3 2 2 1 Collector Current (ma), Collector Efficiency η C (%) Collector Current (ma), Collector Efficiency η C (%) Remark The graphs indicate nominal characteristics. S-PARAMETERS 3 VCE = 3.2 V, f = 1.8 GHz q = 2 ma, 1/2 Duty 2 2 1 1 1 2 2 1 1 1 2 3 2 2 1 3 2 VCE = 3.6 V, f = 1.8 GHz q = 2 ma, 1/2 Duty 3 2 2 1 Collector Current (ma), Collector Efficiency η C (%) Collector Current (ma), Collector Efficiency η C (%) 1 Data Sheet PU18EJ2VDS

NE664M4 / 2SC74 PACKAGE DIMENSIONS FLAT-LEAD 4-PIN THIN-TYPE SUPER MINIMOLD (M4) (UNIT: mm) 2. ±.1 1.2.6.6.9 ±..3 +.1.4 +.1.. 1 2 2. ±.1 1.2 ±.1 R7 PIN CONNECTIONS 1. Emitter 2. Collector 3. Emitter 4. Base 4 3.3 +.1.3 +.1...11 +.1..6.6 1.3 Data Sheet PU18EJ2VDS 11

NOTE 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. California Eastern Laboratories and Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. California Eastern Laboratories has used reasonable care in preparing the information included in this document, but California Eastern Laboratories does not warrant that such information is error free. California Eastern Laboratories and Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 3. California Eastern Laboratories and Renesas Electronics do not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of California Eastern Laboratories or Renesas Electronics or others. 4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. California Eastern Laboratories and Renesas Electronics assume no responsibility for any losses incurred by you or third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product.. Renesas Electronics products are classified according to the following two quality grades: Standard and High Quality. The recommended applications for each Renesas Electronics product depends on the product s quality grade, as indicated below. Standard : Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. High Quality : Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc. Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas Electronics product before using it in a particular application. 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Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by you. 8. 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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: CEL: NE664M4-T2-A NE664M4-A NE664M4-EVPW24 NE664M4-EVPW9 2SC74-T2-A 2SC74-A