Parameter Rating Units Blocking Voltage 7 V P Load Current 1 ma rms / ma DC On-Resistance (max) 1 LED Current to Operate 1 ma Transient Protection Characteristics Peak Pulse Power V WM W 4.2V Features Meets Requirements of EN13-4 (Installation Class 3) 37V rms Input/Output Isolation 1% Solid State Low Drive Power Requirements (TTL/CMOS Compatible) No Moving Parts High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Machine Insertable, Wave Solderable Applications Security Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Aerospace Industrial Controls Single-Pole OptoMOS Relay with Bidirectional Transient Protection Description The is a single-pole, normally open (1-Form-A) solid state relay with bi-directional transient voltage suppressor (TVS) relay protection, which is designed to meet the requirements of EN13-4 (installation class 3). The relay output is constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient GaAlAS infrared LED, controls the optically coupled output. The is available in an 8-pin, space-saving surface-mount package. Approvals UL Certified Component: File E727 CSA Certified Component: Certificate 11727 EN/IEC 9-1 Certified Component: TUV Certificate B 1 4941 Ordering Information Part # P PTR Pin Configuration Description 8-Pin Flatpack (/tube) 8-Pin Flatpack (1/reel) 1 2 + Control 3 Control 4 8 TVS +/- 7 TVS -/+ Load Load Switching Characteristics of Normally Open Devices Form-A 9% I LOAD 1% t on t off Pb e3 DS--R www.ixysic.com 1
Absolute Maximum Ratings @ 2ºC Parameter Ratings Units SSR Output Blocking Voltage 7 V P TVS Working Voltage, Maximum 4.2 V Reverse Input Voltage V Input Control Current ma Peak (1ms) 1 A Input Power Dissipation 1 1 mw SSR Output Power Dissipation 2 4 mw TVS Peak Pulse Power (I PP =9.3A, 1/1 s pulse) W Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Isolation Voltage, Input to Output 37 V rms Operating Temperature -4 to +8 C Storage Temperature -4 to +12 C 1 Derate linearly 1.33 mw / ºC 2 Derate linearly.7 mw / ºC SSR Electrical Characteristics @ 2ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous - I L - - 1 ma rms / ma DC Peak t=1ms I LPK - - ±4 ma P On-Resistance 1 I L =1mA, =1mA R ON - 7 1 Off-State Leakage Current V L =7V P I LEAK - - 1 µa Switching Speeds Turn-On t =ma, V L =1V on - - 2. Turn-Off t off - - 2. ms Output Capacitance V L =V, f=1mhz C OUT - 2 - pf Input Characteristics Input Control Current to Activate 2 I L =1mA - - 1 ma Input Dropout Current to Deactivate -.1 - - ma Input Voltage Drop =ma V F.9 1.2 1.4 V Common Characteristics Capacitance, Input to Output - C I/O - 3 - pf 1 Measurement taken within 1 second of turn-on time. 2 For applications requiring high temperature operation (> o C) a minimum LED drive current of 3mA is required. TVS Electrical Characteristics Parameter Conditions Symbol Min Typ Max Units Clamping Voltage I PP =9.3A V C - -. V Reverse Breakdown Voltage I=1mA V BR 44.4 - - V Reverse Leakage Current V WM =4.2V I L - - A R 2 www.ixysic.com
PERFORMANCE DATA* 2 Typical Turn-On Time (N=, =ma, I L =1mA, T A =2ºC) 2 Typical Turn-Off Time (N=, =ma, I L =1mA, T A =2ºC) 2 Typical On-Resistance Distribution (N=, I L =1mA, T A =2ºC) 2 1 1 2 1 1 1 1 7 8 8 9 9 1 1 Turn-On ( s).3.4.4.... Turn-Off (ms).8.9 7. 7.1 7.2 7.3 7.4 On-Resistance ( ) 3 Typical LED Forward Voltage Drop (N=, =ma, T A =2ºC) 2 Typical for Switch Operation (N=, I L =1mA, T A =2ºC) 3 Typical Blocking Voltage Distribution (N=, T A =2ºC) 3 2 2 1 1 2 1 1 3 2 2 1 1 1.21 1.22 1.23 1.24 1.2 LED Forward Voltage Drop (V).12.14.1.18.2.22 LED Current (ma) 84 8 8 87 88 89 9 Blocking Voltage (V P ) LED Forward Voltage (V) 1. 1. 1.4 1.3 LED Forward Voltage =ma =2mA =1mA 1.2 =ma 1.1 =2mA =1mA 1. -4-2 2 4 8 1 Turn-On Time ( s) 12 1 8 4 2 Typical Turn-On Time vs. LED Forward Current 1 1 2 LED Forward Current (ma) Turn-Off Time ( s) 48 48 47 47 4 4 Typical Turn-Off Time vs. LED Forward Current 1 1 2 LED Forward Current (ma) LED Current (ma).3.3.2.2 LED Current to Operate (I L =1mA) Turn-On Time ( s) 4 3 2 1 Turn-On Time =1mA =ma Turn-Off Time ( s) 8 7 4 3 Turn-Off Time =ma =1mA.1-4 -2 2 4 8 1-4 -2 2 4 8 1 2-4 -2 2 4 8 1 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R www.ixysic.com 3
On-Resistance ( ) 12 11 1 9 8 7 On-Resistance ( =1mA, I L =ma) -4-2 2 4 8 1 Load Current (ma) 1 1 14 14 13 13 12 PERFORMANCE DATA* Maximum Load Current ( =1mA) 12-4 -2 2 4 8 1 Load Current (A) Typical Load Current vs. Load Voltage ( =1mA, T A =2ºC).2.1.1.. -. -.1 -.1 -.2-1. -1. -... 1. 1. Load Voltage (V) 94 Blocking Voltage (Pins & ) 12 Leakage Current Measured Between Pins & (V L =7V) 1 Energy Rating Curve Blocking Voltage (V P ) 92 9 88 8 Leakage Current ( A) 1 8 4 2 Load Current (ma) 8 4 2 84-4 -2 2 4 8 1-4 -2 2 4 8 1 1 s 1 s 1ms 1ms 1ms 1s 1s 1s Time TVS Breakdown Voltage (V) 2 1 49 48 47 4 TVS Diode Breakdown Voltage (Pins 7 & 8) 4-4 -2 2 4 8 1 Leakage Current (na) 2 2 1 1 TVS Diode Leakage (Pins 7 & 8) (V L =4V) -4-2 2 4 8 1 Peak Pulse Power (% P PP @ 2ºC) TVS Derating Curve 12 1 8 4 2-4 -2 2 4 8 1 P PP - Peak Pulse Current (% I PP ) 11 1 9 8 7 4 3 2 1 1 TVS Pulse Waveform 1/1 ( s) 1 1 1 1 4 1 1 Time ( s) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R 4 www.ixysic.com
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Rating P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-2. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device P Maximum Temperature x Time 2ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb e3 R www.ixysic.com
MECHANICAL DIMENSIONS P 2.4 ±.127 (.1 ±.).3 ±.127 (.2 ±.) Pin 1 9.398 ±.127 (.37 ±.) 9.2 ±.381 (.38 ±.1) 2.19 ±.2 (.8 ±.1) MIN /.12 MAX ( MIN /.4 MAX) 7.2 ±.24 (.3 ±.1).23 ±.13 (.8 ±.) 2.28 MAX. (.9 MAX.).3 ±.127 (.2 ±.) 1. (.1) PCB Land Pattern. (.2) 2.4 (.1) 8.7 (.342).47 ±.7 (.18 ±.3).84 ±.12 (.34 ±.4) Dimensions mm (inches) PTR Tape & Reel 33.2 DIA. (13. DIA.) 2. (.79) 4. (.17) Top Cover Tape Thickness.12 MAX. (.4 MAX.) 7. (.29) W = 1. (.3) Bo = 1.3 (.4) Embossed Carrier K = 2.7 (.1) K 1 = 2. (.79) P = 12. (.472) User Direction of Feed Ao = 1.3 (.4) Dimensions mm (inches) Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all Notes for constant dimensions listed on page of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS--R Copyright 212, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/1/212