TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT GT60N321

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GTN3 TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT GTN3 High-Power Switching Applications Fourth Generation IGBT Unit: mm FRD included between and collector Enhancement mode type High speed IGBT : t f =.5 μs (typ.) (I C = A) FRD : t rr =. μs (typ.) (di/dt = A/μs) Low saturation voltage: V CE (sat) =.3 V (typ.) (I C = A) Absolute Maximum Ratings (Ta = 5 C) Characteristics symbol Rating Unit Collector-Emitter Voltage V CES V Gate-Emitter Voltage V GES ±5 V Collector Current DC I C ms I CP A Emitter-Collector Forward Current Collector Power Dissipation (Tc = 5 C) DC I ECF 5 ms I ECFP P C 7 W Junction Temperature T j 5 C Storage Temperature T stg 55 to 5 C A JEDEC JEITA TOSHIBA -FC Weight: 9.75 g (typ.) Screw Torque. N m Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ( Handling Precautions / Derating Concept and Methods ) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Equivalent Circuit Marking Gate Collector Emitter TOSHIBA GTN3 JAPAN Part No. (or abbreviation code) Note line under a Lot No. identifies the indication of product Labels. Lot No. Not underlined: [[Pb]]/INCLUDES > MCV Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] Note Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive /5/EU of the European Parliament and of the Council of June on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Start of commercial production -3 3--

GTN3 Electrical Characteristics (Ta = 5 C) Characteristic Symbol Test Condition Min Typ. Max Unit Gate Leakage Current I GES V GE = ±5 V, V CE = ±5 na Collector Cut-off Current I CES V CE = V, V GE =. ma Gate-Emitter Cut-off Voltage V GE (OFF) I C = ma, V CE = 5 V 3.. V Collector-Emitter Saturation Voltage V CE (sat) () I C = A, V GE = 5 V..3 V Collector-Emitter Saturation Voltage V CE (sat) () I C = A, V GE = 5 V.3. V Input Capacitance C ies V CE = V, V GE =, f = MHz pf Rise Time t r.3 Switching Time Turn-on Time t on 5 Ω.33 Fall Time t f.5. 5 V V Turn-off Time t off 5 V.7 Ω μs Emitter-Collector Forward Voltage V ECF I EC = 5 A, V GE =..9 V Reverse Recovery Time t rr I F = 5 A, V GE =, di/dt = A/μs..5 μs Thermal Resistance(IGBT) R th(j-c).7 C/W Thermal Resistance(Diode) R th(j-c). C/W 3--

GTN3 I C V CE V CE V GE 5 V V V 5 V VGE = 7 V Tc = 5 C Collector- voltage VCE (V) 3 IC = A Tc = C 3 5 Collector- voltage VCE (V) 5 5 5 Gate- voltage VGE (V) V CE V GE V CE V GE Collector- voltage VCE (V) 3 IC = A Tc = 5 C Collector- voltage VCE (V) 3 IC = A Tc = 5 C 5 5 5 5 5 5 Gate- voltage VGE (V) Gate- voltage VGE (V) I C V GE V CE (sat) Tc Emitter VCE = 5 V 5 Collector- saturation voltage VCE (sat) (V) 3 VGE = 5 V 3 IC = A TC = 5 C Gate- voltage VGE (V) Case temperature Tc ( C) 3 3--

GTN3 Collector- voltage VCE (V) ( V) Gate- voltage VGE (V) V CE, V GE Q G VCE = 5 V V 5 V RL =.5 Ω TC = 5 C Switching time (μs) Switching time R G VCC = V IC = A VGG = ±5 V TC = 5 C toff ton tr tf 5 5 5 3 35. Gate charge QG (nc) Gate resistance RG (Ω) Switching time (μs) VCC = V RG = 5 Ω VGG = ±5 V TC = 5 C Switching Time I C toff ton Capacitance C (pf) C V CE Cies VGE = V f = MHz TC = 5 C Coes tf Cres tr. Collector- voltage VCE (V) Safe Operating Area 3 Reverse Bias SOA Tj 5 C VGE = ±5 V RG = Ω IC max (Pulsed)* IC max (Continuous) DC Operation ms* μs* μs* * Single ms* non-repetitive pulse Tc = 5 C Curves must be derated linearly with increase in temperature. 3 5 3 5 3 3 3 3 Collector- voltage VCE (V) Collector- voltage VCE (V) 3--

GTN3 Transient thermal impedance Rth (t) ( C/W) 3 R th (t) t w Tc = 5 C Diode Stage IGBT Stage Emitter-collector forward current IECF (A) コレクタ接地 collector I ECF V ECF 3 5 3 Tc = 5 C 5..5..5..5 Pulse width tw (s) Collector- forward voltage VECF (V) I rr, t rr I ECF 5 I rr, t rr di/dt Peak reverse recovery current Irr (A) 9 7 di/dt = A/μs Tc = 5 C trr Irr.... Reverse recovery time trr (μs) Peak reverse recovery current Irr (A) 3 trr IECF = A Tc = 5 C.... Reverse recovery time trr (μs) 5 5 5 5 Emitter-collector forward current IECF (A) di/dt (A/μs) 5 3--

GTN3 RESTRICTIONS ON PRODUCT USE Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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