Applications. Part Number Part Marking Package Type Standard Package PAM8003DR PAM8003 XATYWWLL

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FILTERLESS 2.5W CLASS-D STEREO AUDIO AMPLIFIER Description Pin Assignments The is a 2.5W, Class-D audio amplifier. It offers low THD+N, allowing it to achieve high-quality sound reproduction. The new filterless architecture allows the device to drive the speaker directly, requiring no low-pass output filters, thus saving the system cost and PCB area. With the same numbers of external components, the efficiency of the is much better than that of class-ab cousins. It can extend the battery life, making it ideal for portable applications. The is available in SO-16 package. Features Applications 2.5W Output at 10% THD with a 5Ω Load and 5V Power Supply Filterless, Low Quiescent Current and Low EMI Low THD+N 64-Step DC Volume Control Superior Low Noise Short Circuit Protection Thermal Shutdown Few External Components to Save the Space and Cost RoHS Pass and Green Package Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) LCD Monitors / TVs Notebook Computers Portable Speakers Portable DVD Players, Game Machines Ordering Information Part Number Part Marking Package Type Standard Package DR XATYWWLL SO-16 2,500 Units/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See https:///quality/lead-free/ for more information about Diodes Incorporated s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 1 of 12

Typical Applications Circuit Pin Descriptions Pin Number Pin Name 1 PVDDL Left Channel Power Supply 2 -OUTL Left Channel Negative Output 3 PGNDL Left Channel Power GND 4 +OUTL Left Channel Positive Output 5 SHDN Shutdown Control Input (active low) Function 6 VREF Internal Analog Reference, Connect a Bypass Capacitor from VREF to GND 7 INL Left Channel Input 8 GND Analog Ground 9 VDD Analog Power Supply 10 INR Right Channel Input 11 NC Not Connected 12 VOLUME DC Volume Control to Set the Gain of Class-D 13 +OUTR Right Channel Positive Output 14 PGNDR Right Channel Power GND 15 -OUTR Right Channel Negative Output 16 PVDDR Right Channel Power Supply 2 of 12

Functional Block Diagram Absolute Maximum Ratings (@T A = +25 C, unless otherwise specified.) These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for prolonged time periods may affect device reliability. All voltages are with respect to ground. Parameter Rating Unit Supply Voltage 6.0 Input Voltage -0.3 to V DD +0.3 Maximum Junction Temperature 150 Storage Temperature -65 to +150 Soldering Temperature 300, 5 sec V C Recommended Operating Conditions (@T A = +25 C, unless otherwise specified.) Parameter Rating Unit Supply Voltage Range 2.5 to 5.5 V Operation Temperature Range -40 to +85 C Junction Temperature Range -40 to +125 C Thermal Information Parameter Package Symbol Max Unit Thermal Resistance (Junction to Ambient) SO-16 θ JA 110 C/W Thermal Resistance (Junction to Case) SO-16 θ JC 23 3 of 12

Electrical Characteristics (@T A = +25 C, V DD = 5V, Gain = 24dB, R L = 8Ω, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Units V IN Supply Power - - 2.5-5.5 V P O THD+N PSRR C S Output Power Total Harmonic Distortion Plus Noise Power Supply Ripple Rejection Crosstalk THD+N = 10%, f = 1kHz, R L = 4Ω V DD = 5.0V - 2.5 - W THD+N = 1%, f = 1kHz, R L = 4Ω V DD = 5.0V - 2.2 - W THD+N = 10%, f = 1kHz, R L = 8Ω V DD = 5.0V - 1.65 - W THD+N = 1%, f = 1kHz, R L = 8Ω V DD = 5.0V - 1.3 - W V DD = 5.0V, Po = 0.5W, R L = 8Ω - 0.16 - f = 1kHz V DD = 3.6V, Po = 0.5W, R L = 8Ω - 0.12 - V DD = 5.0V, Po = 1W, R L = 4Ω - 0.17 - f = 1kHz V DD = 3.6V, Po = 1W, R L = 4Ω - 0.26 - V DD = 5.0V, Inputs AC-Grounded with C IN = 0.47μF, Gv = 6dB V DD = 5V, Po = 0.5W, R L = 8Ω, Gv = 20dB f = 1kHz - -70 - db f = 1kHz - -93 - db SNR Signal-to-Noise V DD = 5V, Gv = 6dB f = 1kHz - 86 - db V N η I Q Output Noise Efficiency Quiescent Current V DD = 5V, Inputs AC-Grounded with C IN = 0.47μF, G V = 6dB A-weighting - 33 - No A-weighting - 50 - R L = 8Ω, THD = 10% - 87 - f = 1kHz R L = 4Ω, THD = 10% - 79 - V DD = 5.0V - 4.5 7.0 V DD = 3.6V No load - 4.0 6.5 V DD = 3.0V - 3.7 5.5 I SD Shutdown Current V DD = 2.5V to 5.5V - - - 1 µa R DS(ON) Static Drain-to-Source On-State Resistor I DS = 500mA,V GS = 5V PMOS - 0.41 - NMOS - 0.27 - fsw Switching Frequency V DD = 3V to 5V - - 210 - khz V OS Output Offset Voltage V IN = 0V, V DD = 5V - - 10 - mv V IH Enable Input High Voltage V DD = 5.0V - 1.5 - - V IL Enable Input Low Voltage V DD = 5.0V - - - 0.4 OTP Over-temperature Protection - 150 - No Load, Junction Temperature V DD = 5V OTH Over-temperature Hysterisis - 30 - % % µv % ma mω V C 4 of 12

Typical Performance Characteristics (@T A = +25 C, unless otherwise specified.) 5 of 12

Typical Performance Characteristics (continued) (@T A = +25 C, unless otherwise specified.) 6 of 12

Typical Performance Characteristics (cont.) (@T A = +25 C, unless otherwise specified.) STEP Gain (db) STEP Gain (db) 0-75 32 11.6 1-40 33 12.0 2-34 34 12.4 3-28 35 12.8 4-22 36 13.2 5-16 37 13.6 6-10 38 14.0 7-7.5 39 14.4 8-5 40 14.8 9-2.5 41 15.2 10 0 42 15.6 11 1.5 43 16.0 12 3.0 44 16.4 13 4.0 45 16.8 14 4.4 46 17.2 15 4.8 47 17.6 16 5.2 48 18.0 17 5.6 49 18.4 18 6.0 50 18.8 19 6.4 51 19.2 20 6.8 52 19.6 21 7.2 53 20.0 22 7.6 54 20.4 23 8.0 55 20.8 24 8.4 56 21.2 25 8.8 57 21.6 26 9.2 58 22.0 27 9.6 59 22.4 28 10.0 60 22.8 29 10.4 61 23.2 30 10.8 62 23.6 31 11.2 63 24.0 7 of 12

Application Information 1. When the PAM8803 works with LC filters, it should be connected with the speaker before it s powered on, otherwise it will risk being damaged easily. 2. When the works without LC filters, it s better to add a ferrite chip bead at the outgoing line of speaker for suppressing the possible electromagnetic interference. 3. The recommended operating voltage is 5.5V. When the is powered with four battery cells, it should be noted that the voltage of four new dry or alkaline batteries is over 6.0V, higher that its operation voltage, which will probably damage the device. Therefore, its recommended to use either four Ni-MH (Nickel Metal Hydride) rechargeable batteries or three dry or alkaline batteries. 4. One should not make the input signal too large. Large signal can cause the clipping of output signal when increasing the volume. This will damage the device because of big gain of the PAM8004. 5. When testing the PAM8803 without LC filters by using resistor instead of speakers as the output load, the test results, e.g. THD or efficiency, will be worse than those of using speaker as load. Test Setup for Performance Testing Notes: 4. The AP AUX-0025 low pass filter is necessary for class-d amplifier measurement with AP analyzer. 5. Two 22μH inductors are used in series with load resistor to emulate the small speaker for efficiency measurement. Power Supply Decoupling The is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure the output THD and PSRR as low as possible. Power supply decoupling affects low frequency response. Optimum decoupling is achieved by using two capacitors of different types of noise on the power supply leads. For higher frequency transients, spikes, or digital hash on the line, a good low equivalentseries-resisitance (ESR) ceramic capacitor, typically 1.0µF, works best, placing it as close as possible to the device V DD terminal. For filtering lower-frequency noise signals, a large capacitor of 20µF (ceramic) or greater is recommended, placing it near the audio power amplifier. Input Capacitor (C I) Large input capacitors are both expensive and space hungry for portable designs. Clearly, a certain sized capacitor is needed to couple in low frequencies without severe attenuation. But in many cases the speakers used in portable systems, whether internal or external, have little ability to reproduce signals below 100Hz to 150Hz. Thus, using a large input capacitor may not increase actual system performance. In this case, input capacitor (CI) and input resistance (RI) of the amplifier form a high-pass filter with the corner frequency determined by equation below. In addition to system cost and size, click and pop performance is affected by the size of the input the coupling capacitor, C I. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (nominally ½ V DD). This charge comes from the internal circuit via the feedback and is apt to create pops upon device enable. Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be minimized. 1 fc 2 RI CI 8 of 12

Application Information (continued) Analog Reference Bypass Capacitor (C BYP) The Analog Reference Bypass Capacitor (C BYP) is the most critical capacitor and serves several important functions. During start-up or recovery from shutdown mode, C BYP determines the rate at which the amplifier starts up. The second function is to reduce noise caused by the power supply coupling into the output drive signal. This noise is from the internal analog reference to the amplifier, which appears as degraded PSRR and THD+N. A ceramic bypass capacitor (C BYP) with values of 0.1μF to 1.0μF is recommended for the best THD and noise performance. Increasing the bypass capacitor reduces clicking and popping noise from power on/off and entering and leaving shutdown. Undervoltage Lock-Out (UVLO) The incorporates circuitry designed to detect low supply voltage. When the supply voltage drops to 2.0V or below, the outputs are disabled, and the device comes out of this state and starts to normal function when V DD 2.2V. Short Circuit Protection (SCP) The has short circuit protection circuitry on the outputs to prevent damage to the device when output-to-output or output-to-gnd short occurs. When a short circuit is detected on the outputs, the outputs are disabled immediately. If the short was removed, the device activates again. Over-temperature Protection Thermal protection on the prevents the device from damage when the internal die temperature exceeds +140 C. There is a 15 tolerance on this trip point from device to device. Once the die temperature exceeds the thermal set point, the device outputs are disabled. This is not a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 30 C. This large hysteresis will prevent motor boating sound well and the device begins normal operation at this point without external system intervention. How to Reduce EMI (Electro Magnetic Interference) A simple solution is to put an additional capacitor 1000μF at power supply terminal for power line coupling if the traces from amplifier to speakers are short (< 20cm). Most applications require a ferrite bead filter as shown in Figure 2. The ferrite filter reduces EMI of around 1 MHz and higher. When selecting a ferrite bead, choose one with high impedance at high frequencies, and low impedance at low frequencies. Figure 2. Ferrite Bead Filter to Reduce EMI 9 of 12

Marking Information Package Outline Dimensions Please see http:///package-outlines.html for the latest version. SO-16 E1/2 E1 PIN 1 X e Ø0.760 Depth 0.050±0.02 A2 A Y D b E/2 E A1 SEATING PLANE GAUGE PLANE SEATING PLANE h h DETAIL 'A' L c SEE DETAIL 'A' L1 01(8x) 02 R1 R L2 0 SO-16 Dim Min Max Typ A -- 1.260 -- A1 0.10 0.23 -- A2 1.02 -- -- b 0.31 0.51 -- c 0.10 0.25 -- D 9.80 10.00 -- E 5.90 6.10 -- E1 3.80 4.00 -- e 1.27 BSC h 0.15 0.25 0.20 L 0.40 1.27 -- L1 1.04 REF L2 0.25 BSC R 0.07 -- -- R1 0.07 -- -- X 3.945 REF Y 0.661 REF θ 0 8 -- θ1 5 15 -- θ2 0 -- -- All Dimensions in mm 10 of 12

Suggested Pad Layout Please see http:///package-outlines.html for the latest version. SO-16 X1 Y Value Dimensions (in mm) C 1.270 X 0.670 X1 9.560 Y 1.450 Y1 6.400 X C 11 of 12

IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright 2017, Diodes Incorporated 12 of 12