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ICs for Audio Common Use AN9 Dual.W Audio Power Amplifier Overview The AN9 is an integrated circuit designed for low distortion, low noise and low power dissipation audio set of.w (.V, Ω) output. Stereo operation is enabled due to incorporating two amplifiers on one chip. -pin SIL package enabled compact and high integrated set. Thermal protection, short protection and excessive voltage protection circuits are built in. Features Highly stable operation Low distortion Low quiescent current Low noise Low shock noise from power ON/OFF operation Built-in muting circuit Fewer external components Incorporating protection circuits Block Diagram Pin Descriptions Pin No. Pin Name NFB Ch. Ch. Ripple Filter GND () Ch. NFB Ch. Driver Driver Over Voltage Over Current Over Temperature Protection.9±..±..±. ø. 9.9±..±..±..±. R...±......±. -Lead SIP Package with Fin (HSIP-P-A) Output Output Pin No. 9 Pin Name Output Ch. Bootstrap Ch. GND (Output) Bootstrap Ch. Output Ch. VCC Unit : mm includes following four Product lifecycle stage. 9.±. 9 GND () GND (Output)

AN9 ICs for Audio Common Use Absolute Maximum Ratings (Ta= C) Parameter Symbol Rating Unit Supply Voltage Supply Current Power Dissipation Peak Supply Voltage Operating Ambient Temperature Storage Temperature I CC P D (surge) T opr T stg.. Note ) Note ) ~ ~ V A W V C C Note ) R θ j c = C/W Note ) Voltage applied time =.s Electrical Characteristics ( =.V, f = khz, R L= Ω, Ta= C) Parameter Symbol Condition min. typ. max. Unit Quiescent Current Voltage Gain Total Harmonic Distortion Maximum Output I CQ G V P O V i= mv P O=.W P O=.W, f= khz P O=.W, f= Hz P O=.W, f= khz = % = %, R L= Ω = %, R L= Ω......9. 9. ma % W Output Noise Voltage V no R g= kω, pf, f= Hz ~ khz, /OCT.. R g= kω, pf, Without Filter. mv Channel Balance CB P O=.W. Channel Separation Ripple Rejection Ratio CS RR P O=.W P O=.W, V ripple = mv rms, f ripple = Hz Sine wave Offset Voltage V O (offset) V i= mv mv Power Dissipation PD (W) () () () () P D Ta () Tc = Ta (θj c = C/W) () With a cm mm Al heat sink (black color coated) or a cm mm Al heat sink (not lacquered) () With a cm mm Al heat sink (not lacquered) () Without heat sink includes following four Product lifecycle stage. Ambient Temperature Ta ( C)

ICs for Audio Common Use AN9 Quiecent Current ICQ (ma) Power Consumption PC (W) P O P O, V i, G V f = % VCC =.V f = khz GV PO VCC =.V PO =.W.......... k k k I CQ, I CC (Single Channel) P O f = khz Rg = Ω VCC =.V, Rg = Ω, f = khz = %. ICQ RL = Ω RL = Ω... P C P O (Single Channel) P O f V no R g., f = khz VCC =.V VCC =.V.... f = khz PO =.W Total Harmonic Distortion (%), Total Harmonic Distortion (%) Supply Current ICC (ma) Output Voltage PO (W) Voltage V i (mv) RL = Ω % % k k k Frequency f (Hz) Total Harmonic Distortion (%) Output Noise Voltage Vno (mv)............ Frequency f (Hz).. Total Harmonic Distortion (%), Voltage Gain Response GV () FLAT VCC =.V includes following four Product lifecycle stage.. DIN AUDIO k k k Source Resistance Rg (Ω)

AN9 ICs for Audio Common Use Application s DUAL MODE µf µf VCC BTL MODE µf Ch. Ch. µf.µf Ω Printed Board Layout µf AN9 GND.µF µf AN9 (Dual mode) µf 9 µf AN9 (BTL mode) 9.µF µf µf µf µf.ω µf.ω.µf µf µf µf µf Output Output µf µf GND.Ω µf Ω µf Ω.µF.Ω.µF.Ω µf µf.µf.ω Scale : / includes following four Product lifecycle stage. Ω or Ω

Request for your special attention and precautions in using the technical information and semiconductors described in this book () If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. () The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. () The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. () The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. () When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. () Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. () This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. includes following four Product lifecycle stage.