UM UBA2213 demo board for 230 V 7 W CFL. Document information

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Rev. 1 9 February 2012 User manual Document information Info Keywords Abstract Content UBA2213, Demo board, CFL, Boost The UBA2213 family of integrated circuits is a range of high-voltage monolithic ICs for driving Compact Fluorescent Lamps (CFL) in half-bridge configuration.

Revision history Rev Date Description v.1 20120209 draft Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 2 of 33

1. Introduction WARNING Lethal voltage and fire ignition hazard The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. This product shall never be operated unattended. 2. Specification The UBA2213 family of integrated circuits is a range of high-voltage monolithic ICs for driving Compact Fluorescent Lamps (CFL) in half-bridge configuration. It derived from UBA2211 with boost feature, which could boost the lamp current in a certain time after ignition and results in a fast warm-up. Run-up time is one of the key requirements for CFL. Run-up is the time measurement from lamp-on until the 80 % light output is reached. If high temperature amalgam burners are used, or the lamp is ignited in cold-weather run-up time are long. The UBA2213 is designed for both indoor and outdoor applications. In addition to the boost feature, the UBA2213 has integrated other features for a CFL including: Preheat current control RMS current control Saturation Current Protection (SCP) OverTemperature Protection (OTP) Capacitor Mode Protection (CMP) This user manual is intended for 230 V applications of a 7 W demo board based on UBA2213AT. Ref. 1 provides additional information on the UBA2213. The UBA2213B demo boards are set up to drive a 7 W burner. The specification is as follows: Mains Input: AC line input voltage: 170 V (AC) to 254 V (AC) Remark: Board optimized for 230 V (AC) 50 Hz. Steady state: Lamp voltage: 56 V Lamp current: 100 ma Working frequency: 42 khz Power Factor (PF): > 0.58 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 3 of 33

3. Circuit diagram Remark: Values measured at 230 V (AC) mains, Baishi T2 7 W burner. See Table 1 Preheat state: Preheat current: 340 ma Preheat time: 1.1 s Remark: constant preheat current at 170 V (AC) to 230 V (AC). See Table 1. Boost state: Lamp current: 160 ma Boost time: 50 s Transition time (boost > RMS): 0.5 s Remark: Measured at 230 V (AC) mains. see Figure 5 and Table 1 Figure 1 shows a typical application circuit diagram. Lfil D1 D4 CBUF CHB1 Cdvdt U1 OUT 14 1 SGND L_N BURNER Lla CFS SGND SENSE 13 12 2 3 SGND HV AC input C0 Cla FS 11 UBA2213T 4 PG L_L Rfuse SGND SGND SW 10 5 DVDT 9 8 V DD 6 RC 7 R OSC D2 D3 CHB2 RSENSE CSW COSC CVDD aaa-001542 Fig 1. Typical UBA2213 application circuit for a CFL 4. Applications Figure 2 shows a typical 7 W CFL application using the UBA2213 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 4 of 33

aaa-001543 Fig 2. 7 W UBA2213 CFL application 5. Circuit description The 7 W demo board is based on the UBA2213 IC. The demo board has all the necessary functions to operate CFL lamps efficiently including preheat, ignition, boost and on-state operation. Several protection features safeguard the correct functioning of the CFL and controller. Figure 3 shows the typical timing of the system. Each phase is identical as for the UBA2211 except for the inserted boost state. V lamp 2.5 x f osc(nom) f osc(nom) f osc(int) f osc(boost) V SW HIGH V SW boosth V SWinter boost...... 0.6 x V H(RC) V SW V SW boostl V SW(ph) preheat ignition boost transision RMS aaa-001544 Fig 3. Application timing sequence All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 5 of 33

6. Measured results During preheat, SW sweeps for preheat timing, when preheat time ends SW and preheat-out are short together and lift to 0.6 VH(RC). As a result, frequency sweeping crosses the resonant frequency and ignites the lamp. After ignition, the SW voltage sweeps up and down for boost timing, boost ends after 63 cycles of SW sweeping. SW then sweeps down to 3 V for RMS frequency control. Boost time and transition time are related to preheat time, this means C SW determines preheat time, boost time and transition time. The current source for charging/discharging SW for boost timing is 1.4 ma and 300 na for discharging SW during transition. Preheat-out voltage, V SW(ph) see Figure 3 determines the preheat and boost frequency separately for preheat and boost stages. Figure 4 and Figure 5 show the measured results using a typical 7 W lamp. The results show that the boost effect is clearly visible when the light is on. This state is true for the same lamp types without the boost feature. Figure 4 and Figure 5 waveforms show the states after power-on. where preheat, ignition, boost, transition and RMS stage can be seen. The preheat and transition stages are zoomed (lower trace) for clarity. aaa-001547 (1) Green: SW signal timing for preheat, boost and transition (2) Dark blue: HB current, also preheat current at preheat stage Fig 4. Time sequence for a boost lamp with preheat stage (zoomed out) All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 6 of 33

aaa-001548 (1) Green: SW signal timing for preheat, boost and transition (2) Dark blue: HB current, also preheat current at preheat stage Fig 5. Time sequence for a boost lamp with boost to RMS transition (zoomed out) Figure 6 shows the lamp discharge current and the boost lamp current. During normal operation, the boost current is 1.8 the lamp current. The light output measurement shown in Figure 7 proves the effectiveness of the boost. A 7 W amalgam lamp was used for the measurements. All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 7 of 33

aaa-001549 (1) Green: SW signal (2) Dark blue: Lamp current Fig 6. Boost lamp current measurement Figure 7 shows the measured light output versus time, boost and non-boost based on 12 W amalgam lamp. Figure 7 shows that lumen run-up is faster with boost then without. (lumen) 140% 120% 100% 80% 60% 40% 20% 0% 0:00 0:17 0:35 0:52 1:09 1:26 1:44 2:01 2:18 (s) 2:36 aaa-001545 (1) Dark curve: Lumen run-up with boost (boost ratio 1.8) (2) Blue curve: Non-boost (boost ratio 1) Fig 7. Lumen output versus time, boost and non-boost All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 8 of 33

Electrical parameters measured are listed in Table 1 Table 1. Electric parameters 7 W boost lamp (UBA2213AT) Pin (W) PF V lamp (V) I Iamp I h I t P lamp (W) f osc The boost feature helps to reach a fast run-up time. When a hot lamp is used, boost is not normally required however, under some circumstances boost is required for a short duration. Considering the working temperature of most amalgam lamps and the UBA2213, set the boost overtemperature (T boost(otp) ). The IC detects the die temperature and ends the boost state when the temperature is above the trigger. The lamp then switches directly to the RMS stage. Figure 8 shows the results of measurements where the lamps remained burning for long periods where a high mains input of 270 V was used. Switching the lamp off and on quickly showed that the lamp transition to RMS took about 5 s of boost because of triggering the boost OTP. From the measured waveform in Figure 8, SW took 8 cycles where normally SW sweeps 63 cycles if no OTP occurs. T ph (s) I ph 6.3 0.609 56 100 90 139 5.6 42 1.1 340 8.4 0.645 45 160 70 185 7.2 27 - - aaa-001550 (1) Yellow: SW signal (2) Green: RC signal (3) Dark blue: HB current (4) Purple: HB voltage Fig 8. Boost OTP triggered All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 9 of 33

7. Boost lamp with high lamp voltage Lamps consume more power during the boost stage, as a result the half-bridge voltage valley value is pulled low and capacitive mode/hard-switch is started. This condition is true when a lamp with a high lamp voltage used for low mains input. The UBA2213 detects switch operation through an internal active Zero-Voltage Switching (ZVS) control circuit to prevent stress on MOSFETs. In capacitive mode, the internal current source discharges the internal capacitor. As a result, the preheat-out voltage is lower and the preheat-out controlled boost frequency voltage increases. This condition continues until the system moves to the border of ZVS. Figure 9 shows the CMP response at boost stage. aaa-001551 (1) Yellow: RC signal (2) Green: half-bridge voltage (3) Blue: lamp current (4) Purple: half-bridge current Fig 9. Capacitor mode at boost stage Figure 9 shows that the RC peak value decreases (frequency increase) at the lowest half-bridge voltage valley and increases at a higher half-bridge voltage. In addition, due to CMP, the boost frequency is not at the lowest boost frequency. As a consequence the boost ratio, boosted lamp current to RMS lamp current is lower. Where a significant boost effect is required some system parameters need adjusted. For example, a bigger lamp capacitor alleviates capacitive mode resulting in a higher boost ratio. However, this leads to a large filament current which leads to low-power efficiency and a narrower RMS operation range. All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 10 of 33

8. Ratio of preheat current and RMS current Resistor R SENSE set the preheat current and steady state half-bridge (lamp) currents. The result is the ratio between these two currents is fixed at 1.2 which is ideal for most burners. However, for an extended burner, adding resistor (R SW ) across C SW extends the ratio. Table 2 lists the typical settings. To prevent malfunctioning of the preheat timer, do not use a resistor smaller than 10 M. A resistor connected between V DD and SW would result in a smaller ratio between preheat current and RMS current. Table 2. Typical ratio setting of I preheat /I RMS R SW (M I ph /I RMS none 1.2 25 1.3 20 1.4 15 1.5 11 1.7 However, R SW has impact on boost and transition time, for instance when R SW shunt with C SW : For preheat and boost time: T with R SW / T without R SW = 1 / (1 2 ) Where equals to the ratio of external current source and internal current source, external current source is roughly: I external =(V high +V low )/(2 R SW ) Where, V high and V low are the high and low limit of the sawtooth signal. For transition time: T with R SW / T without R SW =1/(1 ) Where, C SW = 100 nf and R SW is 10 M, preheat time is increased from 1.6 s to 2.47 s. In addition, boost time increases from 1.11 s/cycles to 1.37 s/cycles. Transition time is decreased from 1.08 s to 0.42 s. 9. OverTemperature Protection (OTP) OTP is active in all states. When the die temperature has reached the OTP trigger level, the oscillator is stopped. As a result, LS switch remains in the on-state and HS switch remains off. Inductor energy can now resonate and damp out gradually. As the oscillator is stopped, the dv/dt supply current is not generated. The V DD voltage now gradually decreases and the start-up state is entered when V DD < V DD(stop). The OTP is reset when T < OTP reset. All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 11 of 33

(1) (2) (3) aaa-001552 (1) V HB (2) I I (3) V RC Fig 10. OTP function 10. Saturation Current Protection (SCP) A critical parameter in the design of the lamp inductor is its saturation current. Saturation of the lamp inductor occurs in cost effective and miniaturized CFLs. The UBA2213 internally monitors the power transistor current. When this current exceeds the capability of the internal half-bridge power transistors, their conduction time is reduced. As a result, the application balances itself on the edge of the current capability of the internal power switches. Figure 11 shows the SCP in a real application using a saturated inductor. Due to this saturation control the burner can ignite despite the inductor saturating effect. However, when the same parameters were setup with an IC without this protection function the IC failed during the ignition. All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 12 of 33

(1) (2) (3) aaa-001553 (1) V HB (2) I I (3) V RC Fig 11. IC results with saturated inductor at ignition 11. Capacitive Mode Protection (CMP) UBA2213 detects switch operation through an internal active ZVS control circuit and prevents stress on MOSFETs. When capacitive mode is detected, the C SW capacitor is discharged and the frequency is increased. The system moves to the border of ZVS. CMP is active in the ignition and steady state (see Figure 12). All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 13 of 33

(1) (2) (3) aaa-001554 (1) V HB (2) I I (3) V RC Fig 12. CMP at RMS state 12. Bill of Materials (BOM) The BOM for the 230 V reference board is shown in Table 3 Table 3. BOM UBA2213 demo board (SO14) Reference Component Package Remarks R fuse D1, D2, D3, D4 M7 C1 2.7 F; 400 V; 105 C; 10 16 C BUF C5 10 nf; 50 V; 0805 C FS C6 100 nf; 50 V; 0805 C SW C7 220 pf; 50 V; 0805 C osc C8 100 nf; 50 V; 0805 C VDD C9 220 pf; 500 V: 0805 C dvdt C0, C2, C3 100 nf; 400 V: CL21 C0, C HB1, C HB2 C4 2.2nF; 1KV; CBB28 C la L1 LGB 3 mh L fil L2 3 mh; EE13; PC40 L la R1 100 k ; 1 %; 0805 R OSC All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 14 of 33

Table 3. BOM UBA2213 demo board (SO14) Reference Component Package Remarks R2 1.8 1 W; 1% R SENSE PCB UBA2213-1; UBA2213-8 IC UBA2213BT Burner 3U-12W; 2700 k 13. PCB layout aaa-001546 Fig 13. Mother and daughter PCB boards 14. Lamp measurements Other amalgam lamps were measured in the laboratory including 5 W, 8 W, 11 W, 15 W and 20 W. The results of these measurements including the component lists, start-up-to-burn scope graphic and electrical parameters are detailed in Section 14.1 to Section 14.10. All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 15 of 33

Table 4. V IN (V) I I 14.1 5 W Spiral lamp 5 W Spiral lamp (UBA2213AT N1B) P in (W) PF V lamp (V) I lamp I h I t P lamp (W) f osc 230 32 5 0.66 49 90 30 95 4.3 43 0.8 102 T ph (s) I ph f ph Remark 42 6.8 0.68 42 142 18 142 5.6 27 T boost T trans Boost ratio 1.6 38 s (63 cycles) 0.5 s aaa-001557 (1) Dark blue: lamp current (2) Purple: half-bridge current (3) Yellow: SW signal Fig 14. 5 W Spiral lamp measurements Table 5. Component list No Part Value Remarks 1 R osc 100 k 1 2 C osc 220 pf 1 3 C dvdt 220 pf 1 4 C SW 68 nf 1 6 C FS 10 nf 1 7 R SENSE 3.0 1 8 C lamp 2.2 nf 1 9 L lamp 5mH 1 10 C HB 100 nf 2 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 16 of 33

Table 5. Component list No Part Value Remarks 11 E lcap 1µF 1 12 R fuse 10 1 13 Burner 5 W, spiral 1 14 L fil 1mH 1 15 IC UBA2213AT 1 16 Connector 2 Table 6. V IN (V) I I 14.2 8 W Spiral lamp 8 W Spiral lamp (UBA2213BT N1B) P in PF V lamp I lamp (W) (V) I h I t P lamp (W) f osc T ph (s) I ph f ph Remark 230 58 8.6 0.63 77 96 57 114 7.3 43.2 0.8 129 66 10 0.65 54.5 158 30 160 8.2 27 T boost T trans Boost ratio 1.6 38 s (63 cycles) 0.5 s aaa-001558 (1) Dark blue: lamp current (2) Purple: half-bridge current (3) Yellow: SW signal Fig 15. 8 W Spiral lamp measurements All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 17 of 33

Table 7. Component list No Part Value Remarks 1 R osc 100 k 1 2 C osc 220 pf 1 3 C dvdt 220 pf 1 4 C SW 68 nf 1 6 C FS 10 nf 1 7 R SENSE 2.4 1 8 C lamp 2.7 nf 1 9 L lamp 4.5 mh 1 10 C HB 100 nf 2 11 E lcap 2.2 µf 1 12 R fuse 10 1 13 Burner 8 W, spiral 1 14 L fil 1mH 1 15 IC UBA2213BT 1 16 Connector 2 Table 8. V IN (V) I I 14.3 11 W 3U lamp 11 W 3U lamp (UBA2213BT N1B) P in PF V lamp I lamp (W) (V) I h I t P lamp (W) f osc T ph (s) I ph f ph Remark 230 74 11.5 0.67 86.7 119 64 139 10.2 43.5 0.8 187 85 13.5 0.68 66.8 187 34 192 11.8 27 T boost T trans Boost ratio 1.6 38 s (63 cycles) 0.5 s All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 18 of 33

aaa-001560 (1) Dark blue: lamp current (2) Purple: half-bridge current (3) Yellow: SW signal Fig 16. 11 W 3U lamp measurements Table 9. Component list No Part Value Remarks 1 R osc 100 k 1 2 C osc 220 pf 1 3 C dvdt 220 pf 1 4 C SW 68 nf 1 6 C FS 10 nf 1 7 R SENSE 1.8 1 8 C lamp 2.7 nf 1 9 L lamp 3.5 mh 1 10 C HB 100 nf 2 11 E lcap 2.2 µf 1 12 R fuse 10 1 13 Burner 11 W, 3U 1 14 L fil 1mH 1 15 IC UBA2213BT 1 16 Connector 2 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 19 of 33

Table 10. V IN (V) I I 14.4 12 W Spiral lamp 12 W Spiral lamp (UBA2213BT N1B) P in (W) PF V lamp (V) I lamp I h I t P lamp (W) f osc 230 76 11.7 0.67 89 119 65 137 10.3 43 0.8 165 T ph (s) I ph f ph Remark 85 13.5 0.68 75 174 41 179 11.9 28 T boost T trans Boost ratio 1.6 38 s (63 cycles) 0.5 s aaa-001563 (1) Dark blue: lamp current (2) Purple: half-bridge current (3) Yellow: SW signal Fig 17. 12 W Spiral lamp measurements Table 11. Component list No Part Value Remarks 1 R osc 100 k 1 2 C osc 220 pf 1 3 C dvdt 220 pf 1 4 C SW 68 nf 1 6 C FS 10 nf 1 7 R SENSE 1.8 1 8 C lamp 2.7 nf 1 9 L lamp 3.5 mh 1 10 C HB 100 nf 2 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 20 of 33

Table 11. Component list No Part Value Remarks 11 E lcap 2.2 µf 1 12 R fuse 10 1 13 Burner 12 W, spiral 1 14 L fil 1mH 1 15 IC UBA2213BT 1 16 Connector 2 Table 12. V IN (V) 14.5 14 W Spiral lamp 14 W Spiral lamp (UBA2213BT N1B) I I P in PF V lamp I lamp I h (W) (V) I t P lamp (W) f osc T ph (s) I ph f ph Remark 230 92 13.6 0.64 98 123 73 147 11.9 43 0.8 187 106 16.3 0.66 64 185 41 191 14.2 27 T boost T trans Boost ratio 1.6 38 s (63 cycles) 0.5 s aaa-001565 (1) Dark blue: lamp current (2) Purple: half-bridge current (3) Yellow: SW signal Fig 18. 14 W Spiral lamp measurements All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 21 of 33

Table 13. Component list No Part Value Remarks 1 R osc 100 k 1 2 C osc 220 pf 1 3 C dvdt 220 pf 1 4 C SW 68 nf 1 6 C FS 10 nf 1 7 R SENSE 1.6 1 8 C lamp 2.7 nf 1 9 L lamp 3.5 mh 1 10 C HB 100 nf 2 11 E lcap 3.3 µf 1 12 R fuse 10 1 13 Burner 14 W, spiral 1 14 L fil 1mH 1 15 IC UBA2213BT 1 16 Connector 2 Table 14. V IN (V) 14.6 15 W Spiral lamp 15 W Spiral lamp (UBA2213BT N1B) I I P in PF V lamp I lamp I h (W) (V) I t P lamp (W) f osc T ph (s) I ph f ph Remark 230 83 12.2 0.62 85 127 63 145 10.8 43 0.8 188 97 14.6 0.65 64 207 34 212 12.7 27 T boost T trans Boost ratio 1.6 38 s (63 cycles) 0.5 s All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 22 of 33

aaa-001567 (1) Dark blue: lamp current (2) Purple: half-bridge current (3) Yellow: SW signal Fig 19. 15 W Spiral lamp measurements Table 15. Component list No Part Value Remarks 1 R osc 100 k 1 2 C osc 220 pf 1 3 C dvdt 220 pf 1 4 C SW 68 nf 1 6 C FS 10 nf 1 7 R SENSE 1.6 1 8 C lamp 2.7 nf 1 9 L lamp 3.5 mh 1 10 C HB 100 nf 2 11 E lcap 3.3 µf 1 12 R fuse 10 1 13 Burner 15 W spiral 1 14 L fil 1mH 1 15 IC UBA2213BT 1 16 Connector 2 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 23 of 33

Table 16. V IN (V) I I 14.7 15 W Spiral lamp 15 W Spiral lamp (UBA2213BT N1B) P in (W) PF V lamp (V) I lamp I h I t P lamp (W) f osc 230 102 15.5 0.65 118 118 86 150 13.9 43 0.8 199 T ph (s) I ph f ph Remark 107 16.7 0.66 107 152 63 166 15.1 32 T boost T trans Boost ratio 1.6 38 s (63 cycles) 0.5 s aaa-001569 (1) Dark blue: lamp current (2) Purple: half-bridge current (3) Yellow: SW signal Fig 20. 15 W Spiral lamp measurements Table 17. Component list No Part Value Remarks 1 R osc 100 k 1 2 C osc 220 pf 1 3 C dvdt 220 pf 1 4 C SW 68 nf 1 6 C FS 10 nf 1 7 R SENSE 1.6 1 8 C lamp 2.7 nf 1 9 L lamp 3.5 mh 1 10 C HB 100 nf 2 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 24 of 33

Table 17. Component list No Part Value Remarks 11 E lcap 3.3 µf 1 12 R fuse 10 1 13 Burner 15 W spiral 1 14 L fil 1mH 1 15 IC UBA2213BT 1 16 Connector 2 Table 18. V IN (V) 14.8 20 W Spiral lamp 20 W Spiral lamp (UBA2213CT N1B) I I P in PF V lamp I lamp I h (W) (V) I t P lamp (W) f osc T ph (s) I ph f ph Remark 230 139 20.6 0.65 117 161 107 198 18.2 44 0.8 250 143 22.1 0.66 102 211 76 228 20 32 T boost T trans Boost ratio 1.3 38 s (63 cycles) 0.5 s aaa-001571 (1) Dark blue: lamp current (2) Purple: half-bridge current (3) Yellow: SW signal Fig 21. 20 W Spiral lamp measurements All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 25 of 33

Table 19. Component list No Part Value Remarks 1 R osc 100 k 1 2 C osc 220 pf 1 3 C dvdt 220 pf 1 4 C SW 68 nf 1 6 C FS 10 nf 1 7 R SENSE 1.2 1 8 C lamp 3.3 nf 1 9 L lamp 2.5 mh 1 10 C HB 100 nf 2 11 E lcap 4.7 µf 1 12 R fuse 10 1 13 Burner 20 W spiral 1 14 L fil 1mH 1 15 IC UBA2213CT 1 16 Connector 2 Table 20. V IN (V) 14.9 20 W Spiral lamp 20 W Spiral lamp (UBA2213CT N1B) I I P in PF V lamp I lamp I h (W) (V) I t P lamp (W) f osc T ph (s) I ph f ph Remark 230 134 19.7 0.64 104 169 97 199 17.1 44 0.8 296 144 22.1 0.66 77.5 274 51 279 19.8 27 T boost T trans Boost ratio 1.6 38 s (63 cycles) 0.5 s All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 26 of 33

aaa-001572 (1) Dark blue: lamp current (2) Purple: half-bridge current (3) Yellow: SW signal Fig 22. 20 W Spiral lamp measurements Table 21. Component list No Part Value Remarks 1 R osc 100 k 1 2 C osc 220 pf 1 3 C dvdt 220 pf 1 4 C SW 68 nf 1 6 C FS 10 nf 1 7 R SENSE 1.2 1 8 C lamp 3.3 nf 1 9 L lamp 2.5 mh 1 10 C HB 100 nf 2 11 E lcap 4.7 µf 1 12 R fuse 10 1 13 Burner 20 W spiral 1 14 L fil 1mH 1 15 IC UBA2213CT 1 16 Connector 2 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 27 of 33

Table 22. V IN (V) I I 14.10 20 W T3 lamp 20 W T3 lamp (UBA2213CT N1B) P in (W) PF V lamp (V) I lamp I h I t P lamp (W) f osc T ph (s) I ph 230 143 20.6 0.62 108 173 105 208 18.5 45 0.8 250 83 f ph Remark 143 20.4 0.62 63 291 45 296 18 28 T boost T trans Boost ratio 1.7 38 s (63 cycles) 0.5 s aaa-001573 (1) Dark blue: lamp current (2) Purple: half-bridge current (3) Yellow: SW signal Fig 23. 20 W T3 lamp measurements Table 23. Component list No Part Value Remarks 1 R osc 100 k 1 2 C osc 220 pf 1 3 C dvdt 220 pf 1 4 C SW 68 nf 1 6 C FS 10 nf 1 7 R SENSE 1.2 1 8 C lamp 3.3 nf 1 9 L lamp 2.5 mh 1 10 C HB 100 nf 2 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 28 of 33

Table 23. Component list No Part Value Remarks 11 E lcap 6.8 µf 1 12 R fuse 10 1 13 Burner 20 W T3 1 14 L fil 1mH 1 15 IC UBA2213CT 1 16 Connector 2 15. Abbreviations Table 24. Acronym CFL CMP MOSFET OTP PCB PF RMS SCP ZVS Abbreviations Description Compact Fluorescent Lamps Capacitive Mode Protection Metal-Oxide Semiconductor Field-Effect Transistor OverTemperature Protection Printed-Circuit Board Power Factor Root Mean Squared Saturation Current Protection Zero Voltage Switching 16. References [1] UBA2213 Data sheet: Half-bridge power IC family for CFL lamps All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 29 of 33

17. Legal information 17.1 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 17.2 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Safety of high-voltage evaluation products The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel that is qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. The product does not comply with IEC 60950 based national or regional safety standards. NXP Semiconductors does not accept any liability for damages incurred due to inappropriate use of this product or related to non-insulated high voltages. Any use of this product is at customer s own risk and liability. The customer shall fully indemnify and hold harmless NXP Semiconductors from any liability, damages and claims resulting from the use of the product. Evaluation products This product is provided on an as is and with all faults basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. 17.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 30 of 33

18. Tables Table 1. Electric parameters 7 W boost lamp (UBA2213AT)...........................9 Table 2. Typical ratio setting of I preheat /I RMS.......... 11 Table 3. BOM UBA2213 demo board (SO14)........14 Table 4. 5 W Spiral lamp (UBA2213AT N1B).........16 Table 5. Component list.........................16 Table 6. 8 W Spiral lamp (UBA2213BT N1B).........17 Table 7. Component list.........................18 Table 8. 11 W 3U lamp (UBA2213BT N1B)..........18 Table 9. Component list.........................19 Table 10. 12 W Spiral lamp (UBA2213BT N1B)........20 Table 11. Component list.........................20 Table 12. 14 W Spiral lamp (UBA2213BT N1B)........21 Table 13. Component list.........................22 Table 14. 15 W Spiral lamp (UBA2213BT N1B)........22 Table 15. Component list.........................23 Table 16. 15 W Spiral lamp (UBA2213BT N1B)........24 Table 17. Component list.........................24 Table 18. 20 W Spiral lamp (UBA2213CT N1B)........25 Table 19. Component list.........................26 Table 20. 20 W Spiral lamp (UBA2213CT N1B)........26 Table 21. Component list.........................27 Table 22. 20 W T3 lamp (UBA2213CT N1B)..........28 Table 23. Component list.........................28 Table 24. Abbreviations..........................29 continued >> All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 31 of 33

19. Figures Fig 1. Typical UBA2213 application circuit for a CFL....4 Fig 2. 7 W UBA2213 CFL application...............5 Fig 3. Application timing sequence.................5 Fig 4. Time sequence for a boost lamp with preheat stage Fig 5. (zoomed out).............................6 Time sequence for a boost lamp with boost to RMS transition (zoomed out).....................7 Fig 6. Boost lamp current measurement.............8 Fig 7. Lumen output versus time, boost and non-boost..8 Fig 8. Boost OTP triggered.......................9 Fig 9. Capacitor mode at boost stage..............10 Fig 10. OTP function............................12 Fig 11. IC results with saturated inductor at ignition....13 Fig 12. CMP at RMS state........................14 Fig 13. Mother and daughter PCB boards............15 Fig 14. 5 W Spiral lamp measurements..............16 Fig 15. 8 W Spiral lamp measurements..............17 Fig 16. 11 W 3U lamp measurements...............19 Fig 17. 12 W Spiral lamp measurements.............20 Fig 18. 14 W Spiral lamp measurements.............21 Fig 19. 15 W Spiral lamp measurements.............23 Fig 20. 15 W Spiral lamp measurements.............24 Fig 21. 20 W Spiral lamp measurements.............25 Fig 22. 20 W Spiral lamp measurements.............27 Fig 23. 20 W T3 lamp measurements...............28 continued >> All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. User manual Rev. 1 9 February 2012 32 of 33

20. Contents 1 Introduction............................ 3 2 Specification............................ 3 3 Circuit diagram......................... 4 4 Applications............................ 4 5 Circuit description....................... 5 6 Measured results........................ 6 7 Boost lamp with high lamp voltage........ 10 8 Ratio of preheat current and RMS current.. 11 9 OverTemperature Protection (OTP)........ 11 10 Saturation Current Protection (SCP)....... 12 11 Capacitive Mode Protection (CMP)........ 13 12 Bill of Materials (BOM)................... 14 13 PCB layout............................ 15 14 Lamp measurements.................... 15 14.1 5 W Spiral lamp....................... 16 14.2 8 W Spiral lamp....................... 17 14.3 11 W 3U lamp......................... 18 14.4 12 W Spiral lamp...................... 20 14.5 14 W Spiral lamp...................... 21 14.6 15 W Spiral lamp...................... 22 14.7 15 W Spiral lamp...................... 24 14.8 20 W Spiral lamp...................... 25 14.9 20 W Spiral lamp...................... 26 14.10 20 W T3 lamp......................... 28 15 Abbreviations.......................... 29 16 References............................ 29 17 Legal information....................... 30 17.1 Definitions............................ 30 17.2 Disclaimers........................... 30 17.3 Trademarks........................... 30 18 Tables................................ 31 19 Figures............................... 32 20 Contents.............................. 33 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 February 2012 Document identifier: