LIGHT EMITTING DIODE SPECIFICATION DESCRIPTION: XT3-3535BCMY-QZ REVISION: V1.1 ISSUE DATE: 2012/10/20 1 / 11
Revision Note Date Revision Page Vision 2012/09/12 Initiate Document 1~10 V1.0 2012/10/20 Specification updated 1~11 V1.1 2 / 11
Lighting LED Specification Autman XT3-3535BCMY-QZ Cool - White LED Specification Features Feature of the device: Small package with high efficiency Typical color temperature: 5700 K. Typical view angle: 120 Typical light flux output: 110 lm@ 350mA. ESD protection. Soldering methods: SMT Grouping parameter: Brightness, Forward Voltage and Chromaticity. Color rendering Index: 75 (min.) The product itself will remain within RoHS compliant version. Applications Spot light, Par 30 light bulb Tiny illumination, Indicator Materials Items Description Substrate Housing Encapsulating Resin Electrodes Die attach Chip PPA with Metal Heat Sink Heat resistant polymer Silicone resin Ag plating copper alloy Die paste InGaN 3 / 11
Dimensions Note. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ± 0.1mm. 3. Polar illustration is the only symbol for circuit design. 4 / 11
Absolute Maximum Ratings (T A =25 ) Parameter Symbol Rating Unit DC Forward Current I F 700 ma Peak Pulse Current (tp 10ms,Duty cycle=1/10) I PF 1000 ma Junction Temperature T J 110 C Operating Temperature T op. -40 ~ +70 C Storage Temperature T stge. -40 ~ +100 C Maximum Pulse Power Dissipation P d 3 W Electrical-Optical Characteristics For Individual LED (T A =25 ) Parameter Bin Symbol Min Typ. Max Unit Condition G3 100 ---- 110 Brightness (1) G4 110 ---- 120 Ф v G5 120 ---- 130 lm G6 130 ---- 140 2 3.1 ---- 3.2 I F =350mA 3 3.2 ---- 3.3 Forward Voltage (2) 4 3.3 ---- 3.4 V F V 5 3.4 ---- 3.5 6 3.5 ---- 3.6 Note. 1. Luminous flux is measured with an accuracy of ± 10%. 2. Forward Voltage measurement tolerance: ± 0.1V. 5 / 11
Relative Luminous Intensity Relative Luminous Intensity Forward Current (ma) Relative Luminous Intenstiy Forward Voltage (V) Typical Electro-Optical Characteristics Curves Relative Spectrum Distribution IF=350mA, T Ambient =25 Forward Voltage vs Forward Current T Ambient =25 1.0 3.6 0.8 3.4 0.6 0.4 0.2 3.2 3.0 2.8 2.6 0.0 400 500 600 700 800 Wavelength(nm) Relative Luminous Intensity vs Forward Current, T Ambient =25 2.4 0 100 200 300 400 500 600 700 Forward Current(mA) Forward Current Derating Curve Derating based on Tjmax = 110 1.8 1.6 400 350 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 100 200 300 400 500 600 700 Forward Current(mA) 300 250 200 150 100 50 0 0 25 50 75 100 125 Soldering Temperature ( o C) Typical Representative Spatial Radiation Pattern 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Note. 1. 2θ 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. View angle tolerance is ± 5 0.0-80 -60-40 -20 0 20 40 60 80 Degree (2 ) 6 / 11
Chromaticity Coordinate Groups Cool White 6500K Rank CIE-X CIE-Y Rank CIE-X CIE-Y Rank CIE-X CIE-Y Rank CIE-X CIE-Y 0.3005 0.3415 0.3028 0.3304 0.3048 0.3207 0.3068 0.3113 65A 0.3099 0.3509 0.3115 0.3391 0.313 0.329 0.3144 0.3186 65B 65C 65D 0.3115 0.3391 0.313 0.329 0.3144 0.3186 0.3161 0.3059 0.3028 0.3304 0.3048 0.3207 0.3068 0.3113 0.3093 0.2993 0.3099 0.3509 0.3115 0.3391 0.313 0.329 0.3144 0.3186 65E 0.3196 0.3602 0.3205 0.3481 0.3213 0.3373 0.3221 0.3261 65F 65G 65H 0.3205 0.3481 0.3213 0.3373 0.3221 0.3261 0.3231 0.312 0.3115 0.3391 0.313 0.329 0.3144 0.3186 0.3161 0.3059 7 / 11
5700K Rank CIE-X CIE-Y Rank CIE-X CIE-Y Rank CIE-X CIE-Y Rank CIE-X CIE-Y 0.3196 0.3602 0.3207 0.3462 0.3215 0.335 0.3222 0.3243 57A 0.329 0.369 0.329 0.3538 0.329 0.3417 0.329 0.33 57B 57C 57D 0.329 0.3538 0.329 0.3417 0.329 0.33 0.329 0.318 0.3207 0.3462 0.3215 0.335 0.3222 0.3243 0.3231 0.312 0.329 0.369 0.329 0.3538 0.329 0.3417 0.329 0.33 57E 0.3381 0.3762 0.3376 0.3616 0.3371 0.349 0.3366 0.3369 57F 57G 57H 0.3376 0.3616 0.3371 0.349 0.3366 0.3369 0.3361 0.3245 0.329 0.3538 0.329 0.3417 0.329 0.33 0.329 0.318 5000K Rank CIE-X CIE-Y Rank CIE-X CIE-Y Rank CIE-X CIE-Y Rank CIE-X CIE-Y 50A 50E 0.3381 0.3762 0.3376 0.3616 0.3371 0.349 0.3366 0.3369 0.348 0.384 0.3463 0.3687 0.3451 0.3554 0.344 0.3428 50B 50C 50D 0.3463 0.3687 0.3451 0.3554 0.344 0.3427 0.3429 0.3307 0.3376 0.3616 0.3371 0.349 0.3366 0.3369 0.3361 0.3245 0.348 0.384 0.3463 0.3687 0.3451 0.3554 0.344 0.3428 0.3571 0.3907 0.3551 0.376 0.3533 0.362 0.3515 0.3487 50F 50G 50H 0.3551 0.376 0.3533 0.362 0.3515 0.3487 0.3495 0.3339 0.3463 0.3687 0.3451 0.3554 0.344 0.3427 0.3429 0.3307 Note. 1. CIE-X Y measure tolerance: ± 0.01 8 / 11
Carrier Tape Dimensions Reel Specification 9 / 11
Reliability Test Items and Results Stress Test Stress Condition Stress Duration Room Temperature Operation Life, RTOL Ta=25, If=350mA 1000 hours High Temperature Operation Life, HTOL Ta=65, If=350mA 1000 hours Low Temperature Operation Life, LTOL Ta=-40, If=350mA 1000 hours High Temperature/High Humidity Operation Life, WHTOL Ta=85, RH=85%, If=350mA 1000 hours Thermal Shock -40~125, 30min~30min 100 cycles Failure Criteria: 1. Light output has more than 30% degradation than initial light output. 2. Forward voltage variation more than ± 20%. Storage (1) Do not open moisture proof bag before the products are ready to use. (2) Before open the package. The LEDs should kept at 30 and 90%RH or less (3) After open the package, the SMD LED should be kept at 28, 60%RH or less. (4) If the moisture absorbent material has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 60 for 24 hours Soldering Manual Soldering (We do not recommend this method strongly) Soldering tin material: tin 6/4 alloy or contained Ag. To prevent cracking, please bake before manual soldering. Keep the temperature on the edge of iron at 300 Max.(25W)and apply for 3 seconds. If the temperature becomes higher, apply in a shorter time (1sec). In manual soldering, take care not to damage the package especially terminal or resin.(do not give stress to the product when soldering) Do not use again if you remove the soldered product. It is recommended using an iron with a temperature control. 10 / 11
Reflow Soldering Recommend tin glue specifications: Melting temperature: 150~260 Contains: Sn96.5%,Ag3.0%,Cu 0.5% JIS Z 3282 TEST Never take next process until the component is cooled down to room temperature after reflow The recommended reflow soldering profile (measuring on the surface of the LED resin) is following Cleaning The conditions of cleaning after soldering: An alcohol-based solvent such as Isopropyl Alcohol (IPA) is recommended. Temperature Time :< 50 30sec, or <30 3min Ultra sonic cleaning :< 15W/bath volume: 1 liter max Curing: 100 max,<3min Cautions of Pick and Place It should be avoided to load stress on the resin during high temperature. Avoid rubbing or scraping the resin by any object. Electric-static may cause damage to the component. Please confirm that the equipment is grounding well. Using an ionizer fan is recommended. Cautions of Design and Applications It should be done to connect with a current-limiting serial resistor. Avoid to drive reverse voltage over the specifications on LED when ON/OFF Any application should refer to the specifications of absolute maximum ratings. The dimensions of the recommended soldering pattern may not meet every user. Please confirm and study first before designing the soldering pattern in order to obtain the best performance of soldering. Do not contact with any component on the assembly board. 11 / 11