PRINTED ELECTRONICS 3

PRINTED ELECTRONICS 3

4 INKTEC PRINTED ELECTRONICS 5

6 INKTEC PRINTED ELECTRONICS 7

InkTec Leads New Paradigm in Printed Electronic Materials Applications OTFT, Memory Cell, Display, RFID and so on Product Features _ Sub-nano particle size _ Jetting stability & Compatibility with various kinds of print heads _ Short Firing Time in Low-temperature (under 130 C/ 5~10min.) _ Fine Pattern & Evenly Thin Layer *Compatible with ITO coated substrates (Bulk Silver resistivity : 1.6 x 10-6 Ωcm) TEC-IJ-010(for Dimatix 1pl Cartridge) Printed Image Nozzle Size : 9µm, 1pl Line width : under 30µm * Available to print finer line according to the substrate and printing pattern Drop size 16µm Element ID : 3 Element Type : M4 - Circle CR Element Label : Feature Actual X_Crd = 2.9098 Y_Crd = -0.0395 D = 0.0325 R = 0.0163 Circular = 0.0000 8 INKTEC PRINTED ELECTRONICS 9

InkTec Leads New Paradigm in Printed Electronic Materials Applications Flexible electronic materials such as memory, display electrode and Functional films and so on. Product Features _ Evenly thin layer with high conductivity _ High productivity by wide and fast roll to roll printing _ Optimized inks for Flexible substrate 10 INKTEC PRINTED ELECTRONICS 11

Printed Products Printed electronic materials manufacturer, InkTec InkTec provides the fitted printed electronic products for customers products using our superior printing facilities and our own electronic inks. >>> 01 Antenna 02 Functional Film 03 Flexible Electrode Facilities Our production line is optimized for mass production in faster time. For maximizing customer satisfaction, we adopted various roll to roll printing facilities & intelligent environmental system. Owing to the lasted facilities, InkTec can meet customer s order in shorter lead time with much better quality than other printable electronic material manufacturers. Applications Classification Application Antenna RFID Tag Antenna (HF, UHF) NFC Antenna Smart Card & Ticket etc. (Mobile, DMB and so on) Functional film Flexible electrodes Reflective film (for LCD, Fluorescent and so on) Transparent conductive film (Half mirror, Resistance and thermal and so on ) Printable FPCB Various industry such as fiber, display, toys, novelties and so on EMI Shielding film etc. (Thermal shielding, Decoration and so on) Sensor (Smart Packaging, Bio sensor and so on) Capacity Spec Line1 Line2 Line3 Max width of printing(mm) ~ 350 ~ 1,600 ~ 1,600 Annual production capacity(m 2 /yr) Length of draying machine ~ 1,800,000 ~ 10,000,000 ~ 10,000,000 12m 25m 25m Available printing Direct Gravure Micro Gravure Rotary Screen S-knife/ Comma Flexography Micro Gravure S-knife/ Comma Direct Gravure Micro Gravure Rotary Screen PRINTED ELECTRONICS 13

InkTec Leads New Paradigm in Printed Electronic Materials Antenna Functional film InkTec has focused on the printed antenna which can materialize the highest volume and lowest cost by flexible substrate and electronic materials. Antenna can be applied in the packaging, textiles and smart card industries and printable electronics avoids photolithographic patterning and many of its limitations. InkTec has been developing various functional films such as reflective film, EMI shielding and half conductive film etc. by our own electronic materials and roll to roll facilities. These films are applying display, signage and architectural industry as a decoration or functional parts. According to enlargement of product range, its application will be continuously extended. Kinds of products Reflective film Substrates Production method Classification Paper PET/PEN Poly Imide Printing Printing+Plating RFID-HF V V V Usage Electronic cash, Near-Field Networking SEM image of the surface Thickness (Total / µm) 38~220 (±10%) Layer Structure 1 PET + anchor + Ag + Top coat 2 White coat + PET + anchor + Ag + Top coat 3 White coat + PET + anchor + Ag + Top coat + Top coat Feature/ usage Reflectance-96~98% / For LCD BLU RFID-UHF V V V Logistics, USN Smart Card & Ticket V V V V Game card, Tickets, Passes 38~80 (±10%) Release Paper + Glue + PET + anchor + Ag + Top coat Reflectance-92~96% / For Fluorescent NFC V V V Electronic cash, Near-Field Networking EMI Shielding film etc. V V V V Mobile, DMB Antenna and so on Printing methods : Screen (Flat or Rotary), Gravure, Flexography Printing Structure Total Thickness(µm) Sheilding Performance(dB) Advantage Application Layer Structure Protection Layer (Release Film) + Insulation Layer + Cunductive Layer +Protection Layer (Release Film) Adjustable 1 Less than 10µm 212~15µm 319~22µm 45~60 Thermal Resistance Cunductivity Chemical Resistance PCB (FPCB & R-PCB) Printed Antenna Customizing possible (Pitch, line width, shielding rate and so on) Transparent conductive film Printing + Plating Transparency(%) Sheet resistancy (Ω/ ㅁ ) Transmittance (%) - ISO 9050 (2003) Light transmissivity IR Shielding rate UV Shielding rate 5 ~ 10 1~2 9.76 92.84 71.72 20 2~3 19.29 64.99 85.77 30 3~5 23.57 56.83 82.67 40 10~15 38.20 47.29 65.41 Usage EMI shielding, Half mirror & Decoration 50 ~ 80-40~85 35~20 50~14 Decoration InkTec can provides customized products according to customer drawing and requirements. 14 INKTEC PRINTED ELECTRONICS 15

Flexible Electrode Printing process is the highest volume and lowest cost manufacturing process and it also avoids photolithographic patterning and many of its limitations. From this light, InkTec has been developing new materials and trying to materialize its advantages by roll to roll processes which are considered from economics, capability and suitability. Comparison Classification Etching process(conventional method) Printing process(inktec) Manufacturing process Dry film laminating Exposure Development Etching Cleaning Type 1 : (Printing Firing) Repeat Type 2 : Printing Firing Plating Expected process reduction and Improvement (comparison with etching) Layer Structure Classification Structure Single side FPCB _ Process : Printing Firing Plating _ Applications : Loop antenna Double side FPCB Type 1 _ Process : Printing Firing Plating _ Applications : Bio sensor, FPCB for TSP, Intenna and so on Type 2 _ Process : Printing Firing Plating _ Applications : Key pad for Mobile phone, Navigation key and so on FPCB Layer structure is decided by customer s product design condition or requirement. 16 INKTEC