74ACT11374 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS

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Eight D-Type Flip-Flops in a Single Package -State Bus Driving True s Full Parallel Access for Loading Inputs Are TTL-Voltage Compatible Flow-Through Architecture Optimizes PCB Layout Center-Pin V CC and Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) -m Process 500-mA Typical Latch-Up Immunity at 25 C Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, and Standard Plastic 00-mil DIPs (NT) DB, DW, OR NT PACKAGE (TOP VIEW) Q 2Q Q 4Q 5Q 6Q 7Q 8Q 2 4 5 6 7 8 9 0 2 24 2 22 2 20 9 8 7 6 5 4 2D D 4D V CC V CC 5D 6D 7D 8D description This 8-bit flip-flop features -state outputs designed specifically for driving highly-capacitive or relatively low-impedance loads. It is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. The eight flip-flops of the 74ACT74 are edge-triggered D-type flip-flops. On the positive transition of the clock () input, the Q outputs are set to the logic levels set up at the data (D) inputs. An output-enable () input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance third state provides the capability to drive bus lines in a bus-organized system without need for interface or pullup components. does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. The 74ACT74 is characterized for operation from 40 C to 85 C. FUNCTION TABLE (each flip-flop) INPUTS OUTPUT D Q L H H L L L L L X Q0 L H X Q0 L X Q0 H X X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments Incorporated. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 996, Texas Instruments Incorporated POST OFFICE BOX 6550 DALLAS, TEXAS 75265

logic symbol 24 EN 2D D 4D 5D 6D 7D 8D 2 22 2 20 7 6 5 4 2 4 9 0 2 Q 2Q Q 4Q 5Q 6Q 7Q 8Q This symbol is in accordance with ANSI/IEEE Std 9-984 and IEC Publication 67-2. logic diagram (positive logic) 24 2 Q 2D 22 2 2Q D 2 Q 4D 20 4 4Q 5D 7 9 5Q 6D 6 0 6Q 7D 5 7Q 8D 4 2 8Q 2 POST OFFICE BOX 6550 DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, V CC.......................................................... 0.5 V to 7 V Input voltage range, V I (see Note )........................................... 0.5 V to V CC + 0.5 V voltage range, V O (see Note )........................................ 0.5 V to V CC + 0.5 V Input clamp current, I IK (V I < 0 or V I > V CC )................................................ ±20 ma clamp current, I OK (V O < 0 or V O > V CC )............................................ ±50 ma Continuous output current, I O (V O = 0 to V CC ).............................................. ±50 ma Continuous current through V CC or.................................................. ±200 ma Maximum power dissipation at T A = 55 C (in still air) (see Note 2): DB package.................. 0.65 W DW package...................7 W NT package.................... W Storage temperature range, T stg.................................................... 65 C to 50 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES:. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 50 C and a board trace length of 750 mils, except for the NT package, which has a trace length of zero. recommended operating conditions VCC Supply voltage 4.5 5.5 V VIH High-level input voltage 2 V VIL Low-level input voltage 0.8 V VI Input voltage CC V VO voltage CC V IOH High-level output current 24 ma IOL Low-level output current 24 ma t/v Input transition rise or fall rate 0 0 ns/v TA Operating free-air temperature 40 85 C POST OFFICE BOX 6550 DALLAS, TEXAS 75265

electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = 50 A IOH = 24 ma TA = 25 C MIN TYP MAX 4.5 V 4.4 4.4 5.5 V 5.4 5.4 4.5 V.94.8 V 5.5 V 4.94 4.8 IOH = 75 ma 5.5 V.85 IOL =50A IOL =24mA 4.5 V 0. 0. 5.5 V 0. 0. 4.5 V 0.6 0.44 V 5.5 V 0.6 0.44 IOL = 75 ma 5.5 V.65 IOZ VO = VCC or 5.5 V ±0.5 ±5 A II VI = VCC or 5.5 V ±0. ± A ICC VI = VCC or, IO = 0 5.5 V 8 80 A ICC One input at.4 V, Other inputs at or V CC 5.5 V 0.9 ma Ci VI = VCC or 5 V 4 pf Co VO = VCC or 5 V 0 pf Not more than one output should be tested at a time, and the duration of the test should not exceed 0 ms. This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than or VCC. timing requirements over recommended ranges of supply voltages and operating free-air temperature (unless otherwise noted) (see Figure ) TA = 25 C MIN MAX fclock Clock frequency 0 55 0 55 MHz tw Pulse duration, low or high 9 9 ns tsu Setup time, data before ns th Hold time, data after 5.5 5.5 ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure ) PARAMETER FROM TO TA = 25 C (INPUT) (OUTPUT) MIN TYP MAX fmax 55 70 55 MHz tplh tphl tpzh tpzl tphz tplz Any Q Any Q Any Q.5 8.5 0.7.5 2.4.5 8.5..5.5 7.5.5 2..5 7.5.5 2..5 2.7.5.2.5 8 0.5 0.8 ns ns ns 4 POST OFFICE BOX 6550 DALLAS, TEXAS 75265

operating characteristics, V CC = 5 V, T A = 25 C Cpdd PARAMETER TEST CONDITIONS TYP UNIT s enabled 07 Power dissipation capacitance per flip-flop flop CL =50pF pf, f=mhz pf s disabled 96 PARAMETER MEASUREMENT INFORMATION 2 VCC From Under Test CL = 50 pf (see Note A) 500 Ω 500 Ω S Open TEST tplh/tphl tplz/tpzl tphz/tpzh S Open 2 VCC LOAD CIRCUIT Timing Input Input tw Data Input tsu th Input In-Phase Out-of-Phase tplh tphl tphl tplh Control (low-level enabling) Waveform S at 2 VCC (see Note B) Waveform 2 S at (see Note B) tpzl tpzh tplz tphz 20% VCC 80% VCC VCC NOTES: A. CL includes probe and jig capacitance. B. Waveform is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR MHz, ZO = 50 Ω, tr = ns, tf = ns. D. The outputs are measured one at a time with one input transition per measurement. Figure. Load Circuit and Voltage Waveforms POST OFFICE BOX 6550 DALLAS, TEXAS 75265 5

IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ( CRITICAL APPLICATIONS ). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER S RISK. In order to minimize risks associated with the customer s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI s publication of information regarding any third party s products or services does not constitute TI s approval, warranty or endorsement thereof. Copyright 998, Texas Instruments Incorporated