CPC32 Dual Optocoupler High-Voltage Darlington Output Parameter Rating Units Breakdown Voltage - BO 35 V P Current Transfer Ratio - CTR -8 % Features 35V P Breakdown Voltage 375V rms Input/Output Isolation Machine Insertable, Wave Solderable Surface Mount Tape & Reel Version Available Applications Telecom Switching Tip/Ring Circuits Hook Switch Modem Switching (Laptop, Notebook, Pocket Size Loop Detect Ringing Detect Current Sensing Description The CPC32 is a dual optocoupler with two identical, independent channels, each having a unidirectional input and a high-voltage Darlington output. Light output from the highly efficient GaAlAs infrared LED activates its associated, optically coupled silicon NPN photo-darlington output transistor. The input LED and the output transistor are separated by a 375V rms isolation barrier. With a LED current of only ma, a current transfer ratio of % to 8% is guaranteed at the collector of the 35V Darlington output transistor. The CPC32's low input current capability with high current transfer ratios, output voltage capability, and isolation barrier rating make it ideal for many applications such as telecom, industrial, and power control. Approvals UL 577 Approved Component: File E7627 CSA Certified Component: Certificate 727 EN 695 Certified Component: TUV Certificate B 5 494 6 Ordering Information Part Number CPC32G CPC32GS CPC32GSTR Description 8-Pin DIP (5/Tube 8-Pin Surface Mount (5/Tube 8-Pin Surface Mount (/Reel Pin Configuration A 8 C 2 K 3 A 7 E 6 C 4 K 5 E Pb e3 DS-CPC32-R6 www.ixysic.com
CPC32 Absolute Maximum Ratings @ 25ºC Parameter Ratings Units Breakdown Voltage, BO 35 V P Reverse Input Voltage 5 V Input Control Current 5 ma Peak (ms A Input Power Dissipation (Each 5 mw Phototransistor Power Dissipation 2 (Each 5 mw Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Isolation Voltage, Input to Output 375 V rms Operational Temperature -4 to +85 C Storage Temperature -4 to +25 C Derate linearly.33 mw / o C 2 Derate linearly.5 mw / o C Electrical Characteristics @ 25ºC Parameters Conditions Symbol Min Typ Max Units Output Characteristics Phototransistor Breakdown Voltage I CEO =µa BO 35 - - V P Emitter-Collector Breakdown Voltage I E =.ma BV ECO.3 - - V Phototransistor Output (Dark Current O =2V, =ma I CEO - - na Saturation Voltage I C =ma, =ma - - V V I CE(sat C =ma, =ma - -.2 V Current Transfer Ratio =ma, =V CTR 55 8 % Output Capacitance O =5V, f=mhz C OUT - 3 - pf Input Characteristics Input Control Current I C =ma, =V -.7 ma Input Voltage Drop =5mA V F.9.2.4 V Input Reverse Current V R =5V I R - - µa Common Characteristics Input to Output Capacitance - C I/O - 3 - pf Switching Characteristics @ 25ºC Characteristic Symbol Test Condition Typ Units Rise Time t R 4 Fall Time t F V =V CC 5 Turn-On Time t on =ma 5 Storage Time t S R L = 2 Turn-Off Time t off 6 s Turn-On Time t on V CC =V Storage Time t S =6mA 4 Turn-Off Time t off R L =8 8 t F t R 9% % t on t S Switching Time Test Circuit t off V CC R L Pulse Width=5ms Duty Cycle=5% R6 2 www.ixysic.com
CPC32 PERFORMANCE DATA* 5 LED Current ( vs. LED Forward Voltage (V F =25ºC LED Current ( vs. LED Forward Voltage (V F =25ºC.6 LED Forward Voltage vs. Temperature LED Current (ma 4 3 2..5.2.25.3.35.4.45.5.55 LED Forward Voltage (V LED Current (ma...5.2.25.3.35.4.45.5.55 LED Forward Voltage (V LED Forward Voltage (V.5 =5mA.4.3 =2mA.2 =ma. =5mA =2mA. -4-2 2 4 6 8 Temperature (ºC CTR (% CTR vs. LED Current ( (T = 25ºC A =.V =.5V. LED Current (ma Collector Current I C (ma Collector Current vs. LED Current ( = 25ºC. =.5V =.V. LED Forward Current (ma Collector Current I C (ma 375 3 225 5 75 Collector Current vs. Temperature ( =.2V =ma =5mA =ma =.5mA -4-2 2 4 6 8 Temperature (ºC Collector Current I C (ma 8 6 4 2 8 6 4 2 Collector Current vs. Collector-Emitter Voltage =25ºC = ma = 5mA = 2mA = ma =.5mA.2.4.6.8..2.4.6.8 2. Collector-Emitter Voltage (V Leakage Current (µa 3. 2.5 2..5..5 Leakage vs. Temperature (O =35V -4-2 2 4 6 8 2 Temperature (ºC Breakdown Voltage BO (V P 45 44 43 42 4 4 39 38 37-4 Breakdown Voltage vs. Temperature -5 35 6 85 Temperature (ºC Switching Time vs. Load Resistance =25ºC t off, =6mA Switching Time ( s t off, =.6mA t on, =.6mA t on, =6mA. K K K Load Resistance ( *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R6 www.ixysic.com 3
CPC32 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL Rating CPC32G / CPC32GS MSL ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device CPC32G / CPC32GS Maximum Temperature x Time 25ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb e3 R6 4 www.ixysic.com
CPC32 CPC32G 2.54 ±.27 (. ±.5 6.35 ±.27 (.25 ±.5 Pin.457 ±.76 (.8 ±.3 4.64 TYP (.6 9.652 ±.38 (.38 ±.5 MECHANICAL DIMENSIONS 3.32 ±.5 (.3 ±.2 7.62 ±.254 (.3 ±. 9.44 ±.58 (.36 ±.2 7.239 TYP. (.285.254 ±.27 (. ±.5 8-.8 DIA. (8-.3 DIA. 6.35 ±.27 (.25 ±.5 7.62 ±.27 (.3 ±.5 PCB Hole Pattern 2.54 ±.27 (. ±.5 7.62 ±.27 (.3 ±.5.83 ±.2 (.32 ±.4 Dimensions mm (inches CPC32GS 2.54 ±.27 (. ±.5 9.652 ±.38 (.38 ±.5 3.32 ±.5 (.3 ±.2.635 ±.27 (.25 ±.5 PCB Land Pattern 2.54 (. 6.35 ±.27 (.25 ±.5 Pin 4.445 ±.27 (.75 ±.5 9.525 ±.254 (.375 ±..457 ±.76 (.8 ±.3 7.62 ±.254 (.3 ±..254 ±.27 (. ±.5.65 (.649.65 (.255 8.9 (.353.83 ±.2 (.32 ±.4 Dimensions mm (inches R6 www.ixysic.com 5
CPC32 MECHANICAL DIMENSIONS CPC32GSTR Tape & Reel 33.2 DIA. (3. DIA. Top Cover Tape Thickness.2 MAX. (.4 MAX. Bo=.3 (.46 W=6. (.63 Embossed Carrier Embossment K =4.9 (.93 K =4.2 (.65 Ao=.3 (.46 P=2. (.472 User Direction of Feed Dimensions mm (inches NOTES:. Dimensions carry tolerances of EIA Standard 48-2 2. Tape complies with all Notes for constant dimensions listed on page 5 of EIA-48-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC32-R6 Copyright 22, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 2/6/22