Fully Integrated Proximity and Ambient Light Sensor with Infrared Emitter and I 2 C Interface

Similar documents
Fully Integrated Proximity Sensor With Infrared Emitter, I 2 C Interface, and Interrupt Function

preliminary Fully Integrated Proximity Sensor with Infrared Emitter and I 2 C Interface featuring Interrupt Function I2C BUS VOLTAGE RANGE (V)

Fully Integrated Proximity and Ambient Light Sensor with Infrared Emitter, I 2 C Interface, and Interrupt Function

High Resolution Digital Biosensor for Wearable Applications with I 2 C Interface

Fully Integrated Proximity and Ambient Light Sensor With Infrared Emitter, I 2 C Interface, and Interrupt Function

High Accuracy Ambient Light Sensor with I 2 C Interface

Fully Integrated Proximity Sensor with Infrared Emitter, I 2 C Interface, and Interrupt Function

High Accuracy Ambient Light Sensor with I 2 C Interface

Designing VCNL4000 into an Application

Silicon PIN Photodiode

Silicon PIN Photodiode

Ambient Light Sensor

High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology

Silicon PIN Photodiode

High Accuracy Ambient Light Sensor with I 2 C Interface

Silicon PIN Photodiode

Silicon NPN Phototransistor in, RoHS Compliant, Released for Lead (Pb)-free Solder Process, AEC-Q101 Released

High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology

Silicon PIN Photodiode

High Speed Infrared Emitting Diode, 940 nm, Surface Emitter Technology

High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, MQW

High Speed Infrared Emitting Diodes, 850 nm, Surface Emitter Technology

Silicon NPN Phototransistor

Dual Color Emitting Diodes, 660 nm and 940 nm

Ambient Light Sensor in 0805 Package

Silicon PIN Photodiode

High Speed Infrared Emitting Diode, 850 nm, Surface Emitter Technology

Ambient Light Sensor

High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology

High Speed Infrared Emitting Diode, 830 nm, GaAlAs Double Hetero

Ambient Light Sensor

High Speed Infrared Emitting Diode, 830 nm, GaAlAs Double Hetero

High Speed Infrared Emitting Diode, 940 nm, GaAlAs Double Hetero

Infrared Emitting Diode, 950 nm, GaAs

High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH

Silicon PIN Photodiode

Silicon PIN Photodiode

High Speed Infrared Emitting Diode, 890 nm, GaAlAs, DH

High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology

Silicon PIN Photodiode

High Speed Infrared Emitting Diode, 940 nm, GaAlAs, MQW

Silicon PIN Photodiode

Silicon PIN Photodiode

High Speed Infrared Emitting Diodes, 850 nm, Surface Emitter Technology

Silicon NPN Phototransistor

High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, MQW

Ambient Light Sensor

Ambient Light Sensor in 0805 Package

Silicon Phototransistor in 0805 Package

Ambient Light Sensor

High Power Infrared Emitting Diode, 940 nm, Surface Emitter Technology

Reflective Optical Sensor with Transistor Output

High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology

Silicon PIN Photodiode

Silicon PIN Photodiode

High Speed Infrared Emitting Diode, 940 nm, GaAlAs Double Hetero

Silicon PIN Photodiode

High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology

Silicon PIN Photodiode, RoHS Compliant, Released for Lead (Pb)-free Reflow Soldering, AEC-Q101 Released

Silicon PIN Photodiode

Silicon Phototransistor in 0805 Package

High Speed Infrared Emitting Diode, 850 nm, GaAlAs, DH

High Accuracy Ambient Light Sensor with I 2 C Interface

Silicon Phototransistor in 0805 Package

Tall Dome Dual Channel Transmissive Optical Sensor with Phototransistor Outputs

High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology

Reflective Optical Sensor with Transistor Output

Silicon PIN Photodiode

Reflective Optical Sensor with Transistor Output

Silicon PIN Photodiode

Designing VCNL4010 Into an Application

Triple Channel Transmissive Optical Sensor With Phototransistor Outputs for Turn and Push Encoding

Silicon PIN Photodiode, RoHS Compliant, Released for Lead (Pb)-free Solder Process, AEC-Q101 Released

Silicon PIN Photodiode, RoHS Compliant

High Power Infrared Emitting Diode, 940 nm, GaAlAs, MQW

Designing the VCNL4020C Into an Application

Reflective Optical Sensor with PIN Photodiode Output

Multi SMD LED RGB FEATURES APPLICATIONS. WAVELENGTH (nm) at I F (ma)

High Power Infrared Emitting Diode, 940 nm, GaAlAs, MQW

UV SMD LED with Silicone Lens

UV SMD LED with Silicone Lens

Highbright 0603 ChipLED

Ambient Light Sensor, RoHS Compliant, Released for Lead (Pb)-free Solder Process, AEC-Q101 Released

High Power Infrared Emitting Diode, RoHS Compliant, 940 nm, GaAlAs/GaAs

VCNL4000 Demo Kit. IR Anode. IR Cathode. IR Cathode SDA SCL

Optocoupler, Phototransistor Output, Very High Isolation Voltage

Reflective Optical Sensor with PIN Photodiode Output

Standard Mini SMD LED

Subminiature Dual Channel Transmissive Optical Sensor with Phototransistor Outputs

FLD00042 I 2 C Digital Ambient Light Sensor

Highbright 0603 ChipLED

UV SMD LED with Silicone Lens

Ultrabright 0402 ChipLED

UVA Light Sensor with I 2 C Interface

Bicolor SMD LED PLCC-4

UV SMD LED with Silicone Lens

Low Current 0603 SMD LED

Reflective Optical Sensor with PIN Photodiode Output. Parameter Test condition Symbol Value Unit Reverse Voltage V R 5 V Forward current I F 100 ma

Silicon PIN Photodiode

DISCONTINUED PH5551A2NA1-E4. Preliminary. Data Sheet. Ambient Illuminance Sensor DESCRIPTION FEATURES APPLICATIONS. R08DS0037EJ0100 Rev.1.

Transcription:

Fully Integrated Proximity and Ambient Light Sensor with Infrared Emitter and I 2 C Interface IR anode 1 IR cathode 2 IR cathode 3 SDA 4 SCL 5 22297-1 6 12 11 nc 1 nc 9 nc 8 nc 7 V DD DESCRIPTION is a fully integrated proximity and ambient light digital 16 bit resolution sensor in a miniature lead less package (LLP) for surface mounting. It includes a signal processing IC and supports an easy to use I 2 C bus communication interface. APPLICATIONS Proximity sensor for mobile devices (e.g. smart phones, touch phones, PDA, GPS) for touch screen locking, power saving, etc. Integrated ambient light function for display/keypad contrast control and dimming of mobile devices Proximity/optical switch for consumer, computing and industrial devices and displays Dimming control for consumer, computing and industrial displays FEATURES Package type: surface mount Dimensions (L x W x H in mm): 3.95 x 3.95 x.75 Integrated module with ambient light sensor, proximity sensor and signal conditioning IC Supply voltage range V DD : 2.5 V to 3.6 V Supply voltage range IR anode: 2.5 V to 5 V Communication via I 2 C interface I 2 C Bus H-level range: 1.7 V to 5 V Floor life: 168 h, MSL 3, acc. J-STD-2 Low stand by current consumption: 1.5 μa Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 PROXIMITY FUNCTION Built in infrared LED and photo-pin-diode for proximity function 16 bit effective resolution for proximity detection range ensures excellent cross talk immunity Programmable LED drive current from 1 ma to 2 ma (in 1 ma steps) Excellent ambient light suppression by signal modulation Proximity distance up to 2 mm AMBIENT LIGHT FUNCTION Built in ambient light photo-pin-diode with close to human eye sensitivity characteristic 16 bit dynamic range for ambient light detection from.25 lx to 16 klx 1 Hz and 12 Hz flicker noise rejection PRODUCT SUMMARY PART NUMBER OPERATING RANGE (mm) Note (1) Adjustable through I 2 C interface OPERATING VOLTAGE RANGE (V) I 2 C BUS VOLTAGE RANGE (V) LED PULSE CURRENT (1) (ma) AMBIENT LIGHT RANGE (lx) AMBIENT LIGHT RESOLUTION (lx) OUTPUT CODE 1 to 2 2.5 to 3.6 1.7 to 5 1 to 2.25 to 16 383.25 16 bit, I 2 C Rev. 1.8, 1-May-12 1 Document Number: 83798

ORDERING INFORMATION ORDERING CODE PACKAGING VOLUME (1) REMARKS -GS8 MOQ: 18 pcs Tape and reel 3.95 mm x 3.95 mm x.75 mm -GS18 MOQ: 7 pcs demokit (www.vishay.com/doc?83395) - MOQ: 1 pc - Note (1) MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. MAX. UNIT Supply voltage V DD -.3 5.5 V Operation temperature range T amb - 25 + 85 C Storage temperature range T stg - 4 + 85 C Total power dissipation T amb 25 C P tot 5 mw Junction temperature T j 1 C BASIC CHARACTERISTICS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Supply voltage V DD 2.5 3.6 V Supply voltage IR anode 2.5 5 V I 2 C Bus H-level range 1.7 5 V Current consumption Current consumption proximity mode incl. IRED (averaged) Current consumption ambient light mode Standby current, no IRED-operation 2 measurements per second, IRED current 2 ma 25 measurements per second, IRED current 2 ma 2 measurements per second, IRED current 2 ma 25 measurements per second, IRED current 2 ma 2 measurements per second averaging = 1 8 measurements per second averaging = 1 2 measurements per second averaging = 64 8 measurements per second averaging = 64 1.5 2 μa 4 μa 5 μa 31 μa 3.8 ma 2.5 μa 1 μa 16 μa 635 μa Ambient light resolution Digital resolution (LSB count ).25 lx E Ambient light output V = 1 lx 4 counts averaging = 64 I 2 C clock rate range f SCL 34 khz Rev. 1.8, 1-May-12 2 Document Number: 83798

CIRCUIT BLOCK DIAGRAM TEST CIRCUIT IR anode 1 IR cathode 2 IRED 12 PD Proxi 11 nc 1 nc Kodak gray card (18 % reflectivity) 3 mm x 3 mm IR cathode 3 SDA 4 SCL 5 22299 ASIC 6 PD Ambi 9 nc 8 nc 7 V DD 223 IRED Proxi-PD d = 2 mm Note nc must not be electrically connected Pads 8 to 11 are only considered as solder pads BASIC CHARACTERISTICS (T amb = 25 C, unless otherwise specified) I DD - Supply Current Idle Mode (μa) 2231 2.4 2.2 2. 1.8 1.6 1.4 1.2 V DD = 3.6 V V DD = 3.5 V V DD = 3.3 V V DD = 3.1 V V DD = 2.5 V V DD = 2.7 V V DD = 2.9 V - 5-3 - 1 1 3 5 7 9 T amb - Ambient Temperature ( C) 11 Fig. 1 - Idle Current vs. Ambient Temperature Proximity Value (cts) 1 1 1 1 2233 LED current 1 ma LED current 2 ma LED current 2 ma 1 Media: Kodak gray card Mod. frequency = 39 khz 1.1 1 1 1 Distance to Reflecting Card (mm) Fig. 3 - Proximity Value vs. Distance I DD - Supply Current Idle Mode (μa) 2.4 2.2 1 C 2. 8 C 1.8 55 C 1.6 25 C 1.4-1 C 1.2-4 C 2.4 2.6 2.8 3. 3.2 3.4 3.6 3.8 2232 V DD - Supply Voltage (V) Fig. 2 - Idle Current vs. V DD I IRED - Forward Current IRED (ma) 25 V IRED = 2.5 V 2 ma 2 18 ma 16 ma 15 14 ma 12 ma 1 1 ma 8 ma 6 ma 5 4 ma 2 ma - 6-2 2 6 1 14 2234 T amb - Ambient Temperature ( C) Fig. 4 - Forward Current vs. Temperature Rev. 1.8, 1-May-12 3 Document Number: 83798

I e, rel - Relative Radiant Intensity 1.1 I F = 1 ma.9.8.7.6.5.4.3.2.1 75 8 85 9 95 1 15 2235 λ - Wavelength (nm) Fig. 5 - Relative Radiant Intensity vs. Wavelength S rel - Relative Sensitivity 2.9 4.8.7 6.6 8.5.4.3.2.1 2238 Fig. 8 - Relative Radiant Sensitivity vs. Angular Displacement ϕ - Angular Displacement 2 1 I rel - Relative Radiant Intensity.9.8.7.6 4 6 8 ϕ - Angular Displacement Ambient Light Signal (cts) 1 1 1 1 2236.5.4.3.2.1 1.1 1 1 1 1 1 E V - Illuminance (lx) Fig. 6 - Relative Radiant Intensity vs. Angular Displacement Fig. 9 - Ambient Light Value vs. Illuminance S(λ) rel - Relative Spectral Sensitivity 1.1.9.8.7.6.5.4.3.2.1 4 5 6 7 8 9 1 11 2237 λ - Wavelength (nm) Fig. 7 - Relative Spectral Sensitivity vs. Wavelength S(λ) rel - Relative Spectral Responsivity 2231 Human eye.8.6.4.2 4 5 6 7 8 9 1 11 λ - Wavelength (nm) Fig. 1 - Relative Spectral Sensitivity vs. Wavelength Rev. 1.8, 1-May-12 4 Document Number: 83798

2 S rel - Relative Sensitivity.9.8.7.6 Vertical Horizontal 4 6 ϕ - Angular Displacement 8.5.4.3.2.1 22311 Fig. 11 - Relative Radiant Sensitivity vs. Angular Displacement APPLICATION INFORMATION is a cost effective solution of proximity and ambient light sensor with I 2 C Bus interface. The standard serial digital interface is easy to access Proximity Signal and Light Intensity without complex calculation and programming by external controller. 1. Application Circuit 2.5 V to 5 V C 1 C 2 22 μf 1 nf 2.5 V to 3.6 V R1 IR Anode (1) 1R C 4 C 3 1 μf 1 nf V DD (7) Host Micro Controller (6, 12) SCL (5) SDA (4) I 2 C Bus Clock SCL I 2 C Bus Data SDA 22312-1 Fig. 12 - Application Circuit (x) = Pin Number Rev. 1.8, 1-May-12 5 Document Number: 83798

2. I 2 C Interface The contains twelve 8 bit registers for operation control, parameter setup and result buffering. All registers are accessible via I 2 C communication. Figure 13 shows the basic I 2 C communication with. The built in I 2 C interface is compatible with all I 2 C modes (standard, fast and high speed). I 2 C H-level range = 1.7 V to 5 V. Please refer to the I 2 C specification from NXP for details. Send byte Write command to S Slave address Wr A Register address A Data byte A P Receive byte Read data from S Slave address Wr A Register address A P S Slave address Rd A Data byte A P S = start condition P = stop condition A = acknowledge Host action response Fig. 13 - Send Byte/Receive Byte Protocol 22313 Device Address The has a fix slave address for the host programming and accessing selection. The predefined 7 bit I 2 C bus address is set to 1 11 = 13h. The least significant bit (LSB) defines read or write mode. Accordingly the bus address is set to 1 11x = 26h for write, 27h for read. Register Addresses has twelve user accessible 8 bit registers. The register addresses are 8h (register #) to 8Bh (register #11). REGISTER FUNCTIONS Register # Command Register Register address = 8h The register # is for starting ambient light or proximity measurements. This register contains 2 flag bits for data ready indication. TABLE 1 - COMMAND REGISTER # config_lock als_data_rdy prox_data_rdy als_od prox_od N/A N/A N/A config_lock Read only bit. Value = 1 als_data_rdy prox_data_rdy als_od prox_od Read only bit. Value = 1 when ambient light measurement data is available in the result registers. This bit will be reset when one of the corresponding result registers (reg #5, reg #6) is read. Read only bit. Value = 1 when proximity measurement data is available in the result registers. This bit will be reset when one of the corresponding result registers (reg #7, reg #8) is read. R/W bit. Starts a single on-demand measurement for ambient light. If averaging is enabled, starts a sequence of readings and stores the averaged result. Result is available at the end of conversion for reading in the registers #5(HB) and #6(LB). R/W bit. Starts a single on-demand measurement for proximity. Result is available at the end of conversion for reading in the registers #7(HB) and #8(LB). Notes After a proximity start command [prox_od] a WAIT time of 4 μs should be inserted before any read out commands. With setting bit 3 and bit 4 at the same write command, a simultaneously measurement of ambient light and proximity is done. Rev. 1.8, 1-May-12 6 Document Number: 83798

Register #1 Product ID Revision Register Register address = 81h. This register contains information about product ID and product revision. Register data value of current revision = 11h. TABLE 2 - PRODUCT ID REVISION REGISTER #1 Product ID Revision ID Product ID Read only bits. Value = 1 Revision ID Register #2 without Function in Current Version Register address = 82h. Register #3 LED Current Setting for Proximity Mode Register address = 83h. This register is to set the LED current value for proximity measurement. The value is adjustable in steps of 1 ma from ma to 2 ma. This register also contains information about the used device fuse program ID. TABLE 3 - IR LED CURRENT REGISTER #3 Fuse prog ID IR LED current value Fuse prog ID IR LED current value Read only bits. Information about fuse program revision used for initial setup/calibration of the device. R/W bits. IR LED current = Value (dec.) x 1 ma. Valid Range = to 2d. e.g. = ma, 1 = 1 ma,., 2 = 2 ma (2 = 2 ma = DEFAULT) LED Current is limited to 2 ma for values higher as 2d. Register #4 Ambient Light Parameter Register Register address = 84h. TABLE 4 - AMBIENT LIGHT PARAMETER REGISTER #4 Cont. conv. mode Bit 7 Cont. conversion mode Bit 3 Auto offset compensation Bit to bit 2 Averaging function N/A Auto offset compensation Averaging function (number of measurements per run) R/W bit. Continuous conversion mode. Enable = 1; Disable = = DEFAULT This function can be used for performing faster ambient light measurements. Please refer to the application information chapter 3.3 for details about this function. R/W bit. Automatic offset compensation. Enable = 1 = DEFAULT; Disable = In order to compensate a technology, package or temperature related drift of the ambient light values there is a built in automatic offset compensation function. With active auto offset compensation the offset value is measured before each ambient light measurement and subtracted automatically from actual reading. R/W bits. Averaging function. Bit values sets the number of single conversions done during one measurement cycle. Result is the average value of all conversions. Number of conversions = 2 decimal_value e.g. = 1 conv., 1 = 2 conv, 2 = 4 conv.,.7 = 128 conv. DEFAULT = 32 conv. Rev. 1.8, 1-May-12 7 Document Number: 83798

Register #5 and #6 Ambient Light Result Register Register address = 85h and 86h. These registers are the result registers for ambient light measurement readings. The result is a 16 bit value. The high byte is stored in register #5 and the low byte in register #6. TABLE 5 - AMBIENT LIGHT RESULT REGISTER #5 Read only bits. High byte (15:8) of ambient light measurement result TABLE 6 - AMBIENT LIGHT RESULT REGISTER #6 Read only bits. Low byte (7:) of ambient light measurement result Register #7 and #8 Proximity Measurement Result Register Register address = 87h and 88h. These registers are the result registers for proximity measurement readings. The result is a 16 bit value. The high byte is stored in register #7 and the low byte in register #8. TABLE 7 - PROXIMITY RESULT REGISTER #7 Read only bits. High byte (15:8) of proximity measurement result TABLE 8 - PROXIMITY RESULT REGISTER #8 Read only bits. Low byte (7:) of proximity measurement result Register #9 Proximity Measurement Signal Frequency Register address = 89h. TABLE 9 - PROXIMITY MEASUREMENT SIGNAL FREQUENCY #9 N/A Proximity frequency Bit and 1 Proximity frequency R/W bits. Setting the proximity IR test signal frequency. The proximity measurement is using a square IR signal as measurement signal. Four different values are possible: = 3.125 MHz 1 = 1.5625 MHz 2 = 781.25 khz (DEFAULT) 3 = 39.625 khz Rev. 1.8, 1-May-12 8 Document Number: 83798

Register #1 Proximity Modulator Timing Adjustment Register address = 8Ah. TABLE 1 - PROXIMITY MODULATOR TIMING ADJUSTMENT #1 Modulation delay time N/A Modulation dead Time Modulation delay time Modulation dead Time R/W bits. Setting a delay time between IR LED signal and IR input signal evaluation. This function is for compensation of delays from IR LED and IR photo diode. Also in respect to the possibility for setting different proximity signal frequency. Correct adjustment is optimizing measurement signal level. R/W bits. Setting a dead time in evaluation of IR signal at the slopes of the IR signal. This function is for reducing of possible disturbance effects. This function is reducing signal level and should be used carefully. Note The settings for best performance will be provided by Vishay. With first samples this is evaluated to: delay time = 4 and dead time = 1, with that register #1 should be programmed with: 129 (dez.) Register #11 Ambient IR Light Level Register Register address = 8Bh. This register is not intended to be used by customer. 3. IMPORTANT APPLICATION HINTS AND EXAMPLES 3.1 Receiver standby mode In standby mode the receiver has the lowest current consumption of about 1.5 μa. In this mode only the I 2 C interface is active. This is always valid, when there are no measurement demands for proximity and ambient light executed. Also the current sink for the IR-LED is inactive, so there is no need for changing register #3 (IR LED current). 3.2 Data Read In order to get a certain register value, the register has to be addressed without data like shown in the following scheme. After this register addressing, the data from the addressed register is written after a subsequent read command. Receive byte Read data from S Slave address Wr A Register address A P S Slave address Rd A Data byte A P S = start condition P = stop condition A = acknowledge Host action response 22314 Fig. 14 - Send Byte/Receive Byte Protocol The stop condition between these write and read sequences is not mandatory. It works also with a repeated start condition. Note For reading out 2 (or more) subsequent registers like the result registers, it is not necessary to address each of the registers separately. After one read command the internal register counter is increased automatically and any subsequent read command is accessing the next register. Example: read register Ambient Light Result Register #5 and #6: Addressing:command: 26h, 85h (_I 2 C_Bus_Write_Adr., Ambient Light Result Register #5 [85]) Read register #5:command: 27h, data (_I 2 C_Bus_Read_Adr., {High Byte Data of Ambient Light Result Register #5 [85])} Read register #6:command: 27h, data (_I 2 C_Bus_Read_Adr., {Low Byte Data of Ambient Light Result Register #6 [86])} Rev. 1.8, 1-May-12 9 Document Number: 83798

3.3 Continuous Conversion Mode in Ambient Light Measurement In the following is a detail description of the function continuous conversion (bit 7 of register #4) Standard mode (bit 7 of reg #4 = ): In standard mode the ambient light measurement is done during a fixed time frame of 1 ms. The single measurement itself takes actually only appr. 3 μs. The following figures show examples of this measurement timing in standard mode using averaging function 2 and 8 as examples for illustration (possible values up to 128). Start Start 5 ms 1 ms 22316 12.5 ms 1 ms 22315 Fig. 15 - Ambient Light Measurement with Averaging = 2; Final Measurement Result = Average of these 2 Measurements Note Independent of setting of averaging the result is available only after 1 ms. Fig. 16 - Ambient Light Measurement with Averaging = 8; Final Measurement Result = Average of these 8 Measurements Continuous conversion mode (bit7 of reg #4 = 1): In continuous conversion mode the single measurements are done directly subsequent after each other. See following examples in figure 17 and 18 46 μs Start 46 μs Start 1.5 ms 22317 4.2 ms 22318 Fig. 17 - Ambient Light Measurement with Averaging = 2; using Continuous Conversion Mode Fig. 18 - Ambient Light Measurement with Averaging = 8; using Continuous Conversion Mode Rev. 1.8, 1-May-12 1 Document Number: 83798

PACKAGE DIMENSIONS in millimeters 4 x.75 = 3 Cathode Emitter.75 ±.5.35 ±.5 Anode Emitter SDA SCL.475.175 ±.5.175 ±.5.475.555 Pinning Bottom view 1.8.4 ±.5.545 1.26.4 ±.5 Pad must not be electrical connected V DD V DD.175 ±.5 Pinning Top view.47 ±.5 technical drawings according to DIN specifications.475.15 3.95.75 SDA SCL.935 Cathode Emitter Anode Emitter Proposed PCB Footprint (3.95) 3.25 3.355 3.95.85.4.2.2.735.985 2.615 (3.95) 1.8.4 1.26 Drawing-No.: 6.55-532.1-4 Issue: prel; 16.2.1 Not indicated tolerances ±.1.35 (1x).75 4 x.75 = 3.85 2232 Rev. 1.8, 1-May-12 11 Document Number: 83798

TAPE AND REEL DIMENSIONS in millimeters Reel size "Y" Unreel direction X Ø 6 min. GS 8 Ø 18 ± 2 = 18 pcs. GS 18 Ø 33 ± 2 = 7 pcs. 2 ±.5 Tape position coming out from reel Ø Y Not indicated tolerances ±.1 Ø 21 ±.8 Ø 13 ±.2 12.4 + 2 18.4 max. Parts mounted Label posted here Empty Leader 4mm min. 1mm min. with cover tape Leader and trailer tape: Empty Trailer 2mm min. Direction of pulling out technical drawings according to DIN specifications.9.3 4.25 X 2:1 8 4 Ø 1.5 2 1.75 4.25 5.5 12 ±.3 Drawing-No.: 9.8-5131-4 Issue: prel; 2.12.9 22319 Rev. 1.8, 1-May-12 12 Document Number: 83798

SOLDER PROFILE Temperature ( C) 3 25 2 15 1 5 255 C 24 C 217 C max. 12 s max. ramp up 3 C/s max. 26 C 245 C max. 3 s max. 1 s max. ramp down 6 C/s 5 1 15 2 25 3 19841 Time (s) Fig. 19 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-2 DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: T amb < 3 C, RH < 6 % Moisture sensitivity level 3, acc. to J-STD-2. DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-2 or label. Devices taped on reel dry using recommended conditions 192 h at 4 C (+ 5 C), RH < 5 %. Rev. 1.8, 1-May-12 13 Document Number: 83798