DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS High-voltage: NP0/X7R (Pb Free & RoHS compliant)

Similar documents
DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS Mid-voltage: NP0/X7R (Pb Free & RoHS compliant)

DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS High-voltage SC type: NP0/X7R (Pb Free & RoHS compliant)

DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS Ultra small: NP0/X5R/X7R/Y5V (Pb Free & RoHS compliant)

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1%

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0402 5%, 1% RoHS compliant & Halogen Free

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0603 5%, 1%, 0.5% RoHS compliant

PRODUCT DATASHEET. is brought to you by. SOS electronic distribution of electronic components

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1%, 0.5%, 0.1% Product specification June 25, 2014 V.5. RoHS compliant

High-Q Capacitors (Microwave Chip Capacitors)

DATA SHEET THIN-FILM CHIP RESISTORS TF 13 series, 0.1% TC25

SPECIFICATION FOR APPROVAL 1/8W 0816 LOW RESISTNACE CHIP RESISTOR

MULTILAYER CERAMIC ANTENNA (LINEAR POLARIZATION MODE) FOR 400MHz~500MHz. Product Specification 1 (Preliminary)

DATA SHEET HIGH OHMIC CHIP RESISTORS RC high ohmic series 20%, 10%, 5% sizes 0805/1206. RoHS compliant

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0201 5%, 1% RoHS compliant

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1%

SMD - Resistors. Pulse Withstanding Thick Film Chip Resistor-SMDP Series. Product: Size: 0603/0805/1206/1210/2010/2512. official distributor of

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0603 5%, 1%, 0.5%, 0.1% Product specification July 01, 2014 V.5 Supersedes Date of Mar.

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1206 5%, 1% RoHS compliant

Data sheet ESD SUPPRESSOR; RECTANGULAR TYPE. AEC-Q200 qualified. RoHS COMPLIANCE ITEM Halogen and Antimony Free

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0402 5%, 1% RoHS compliant

Power chip resistor size 2010 PRC111 1% FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability.

SPECIFICATION FOR APPROVAL. 1/2W, 0603, Low Resistance Chip Resistor (Lead / Halogen free)

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1218 5%, 1% RoHS compliant

DATA SHEET FUSIBLE CHIP RESISTORS FR series (Pb Free) 5% sizes 0603/1206. Product specification Sep 26, 2005 V.0

DATA SHEET HIGH VOLTAGE CHIP RESISTORS RV series 5%, 1% sizes 0805/1206/2512. RoHS compliant

MULTILAYER CERAMIC ANTENNA FOR BLUETOOTH & WLAN IEEE b (2.45G Hz ISM Band) Product Specification

Metallized Polycarbonate film capacitors MKC 344

DATA SHEET CURRENT SENSOR - LOW TCR HIGH POWER PT-High power series 5%, 2%, 1% sizes 0402/0603/0805/1206/0815/2010/2512

QUICK REFERENCE DATA. Resistance tolerance ±5% Temperature coefficient: 1to4.7Ω ± /K 5.1 to 240 Ω ± /K Absolute maximum dissipation at

Thin Film Current Sensing Chip Resistor (TCS Series)

SPECIFICATION FOR APPROVAL. 1/32W, Low Resistance Chip Resistor (Lead / Halogen free)

Sp e c i f i c a t i o n

Multilayer Ceramic Antenna WIDE BAND MULTILAYER CERAMIC ANTENNA. 850~950MHz. Product Specification

AC and Pulse Film Foil Capacitors KP Radial Potted Type

DATA SHEET LOW OHMIC HIGH POWER CHIP RESISTORS RL-High power series 5%, 2%, 1% sizes 0805/1206

DATA SHEET ARRAY CHIP RESISTORS YC324 (8Pin/4R; Pb Free) 5%, 1% sizes Product specification Feb 22, 2005 V.1 Supersedes Date of Mar.

DATA SHEET FUSIBLE CHIP RESISTORS FR series (Pb Free) 5% sizes 0603/1206. Product specification Sep 26, 2005 V.0

SPECIFICATION FOR APPROVAL. 1/8W, 0402, Low Resistance Chip Resistor (Lead / Halogen Free)

A S J ASJ PTE LTD LEAD FREE THIN FILM CHIP RESISTOR SPECIFICATION. Reference No. : SYS-ENG-209. Revision No. : D

SMD Resistor Networks

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0603 (Pb Free) 5%, 1%

DATA SHEET. KP 460 to 464 Polypropylene film foil capacitors. BCcomponents

Surge Withstanding Thick FilmResistors(SWCR Series)

DATA SHEET THIN FILM CHIP RESISTORS High precision - high stability RT series 0.01% TO 1%, TCR 5 TO 50 sizes 0201/0402/0603/0805/1206/ 1210/2010/2512

Not for new design. Use new F611-F612 Series.

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1218 (Pb Free) 5%; 1% Product specification Oct 13, 2004 V.1

sizes 0201/0402/0603/0805/1206/1210/1218/2010/2512

MULTILAYER CERAMIC ANTENNA FOR BLUETOOTH/WLAN IEEE b & WLAN IEEE a (2.45/5.2GHz) (Surface Mounted Ceramic Dual Band Antenna)

KP 376 KP/MMKP 376. AC and pulse metallized polypropylene film capacitors. Fig.1 Simplified outlines.

Metal Film Precision Resistor. Features

Pulse Withstanding Thick Film Resistors(PWCR Series)

DATA SHEET ARRAY CHIP RESISTORS YC/TC 164 (8Pin/4R) 5%, 1% sizes

LEAD FREE CHIP RESISTOR SPECIFICATION

Hi-Rel Thin Film Chip Resistors

YC:102/104/122/124/162/164/248/324/158/358

QUICK REFERENCE DATA ORDERING INFORMATION. Ordering code indicating type and packaging TYPE

DATA SHEET ARRAY CHIP RESISTORS YC 158/358 (10Pin/8R) 5% sizes 0612/1225

sizes 0402/0603/0805/1206/ 1210/1218/2010/2512 RoHS compliant & Halogen Free

TC25 High Precision Thin Film chip resistors Size 1206, 0805, 0603, 0402 (Anti-Sulfuration )

GENERAL PURPOSE CHIP RESISTORS RC0805 5%, 1%, 0.5%, 0.1% RoHS Compliant & Halogen Free.

DATA SHEET CURRENT SENSOR - LOW TCR PR/PF series (Pb Free) 5%, 1% sizes 1206/2010/2512. Product specification Aug 11, 2005 V.0

DATA SHEET HIGH VOLTAGE CHIP RESISTORS RV series 0.5%, 1%, 5%

Metal Film Precision Resistor. Features

Resistor Chip General Information

WF12K, WF08K, WF06K, WF04K ±1.0%, 0.5%, ±0.25%, ±0.1% High Precision Thick Film chip resistors

INPAQ. Specification. WIP201610S L Series. Product Name. Power Inductor. Global RF/Component Solutions

Thick Film Chip Resistors. ( Lead Free for RM series standard ) page 1/13

Surface Mount Multilayer Ceramic Chip Capacitors for High Frequency Applications

Package / Case (Inch) 0402 Tolerance ±1 % Power Rating 0.1 W Number of each resistor 200

DATA SHEET CURRENT SENSOR - LOW TCR AUTOMOTIVE GRADE PE_L series 5%, 1%, 0.5% sizes 0201/0402/ 0603/ 0805/ 1206/ 2010/ 2512

DATA SHEET CURRENT SENSOR - LOW TCR PE Series - Wide Terminal 5%, 1%, 0.5%

Thick Film Chip Resistors ( Lead-Free for RM series standard )

sizes 0402/0603/0805/1206/ 1210/1218/2010/2512 RoHS compliant

MULTILAYER CERAMIC ANTENNA (LINEAR POLARIZATION MODE) FOR 433MHz. Preliminary Product Specification

Surface Mount Multilayer Ceramic Chip Capacitors DSCC Qualified Type 03028

DATA SHEET CURRENT SENSOR - LOW TCR PA0402 series 5%, 1% sizes 0402

High Stability Thin Film Flat Chip Resistor 0.05 % (1000 h rated power at 70 C)

Data sheet. FIXED RECTANGULAR TYPE RMC10,16,20,32,35 Automotive Grade AEC-Q200 qualified RoHS COMPLIANCE ITEM Halogen and Antimony Free

Interference Suppression Film Capacitor - Class X2 Axial MKT 253 V AC - Continuous Across the Line

Surface Mount Polyester (PET) Film Capacitor JSN, Unencapsulated Stacked Chip with Flat Terminations, VDC, for DC Link (Automotive Grade)

Thin Film Precision Chip Resistor (AR Series)

Over Coat. Resistive Element RBS 10 B T P Product Code Size Tolerance Packaging TCR Nominal. e.g., (1608) 1/10W.

High Ohmic Flat Chip Resistors

DATA SHEET GENERAL PURPOSE CHIP RESISTORS. RC_L series ±0.1%, ±0.5%, ±1%, ±5% Sizes 0075/0100/0201/0402/0603/0805/ 1206/1210/1218/2010/2512

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC_L series ±0.1%, ±0.5%, ±1%, ±5% Sizes 0075/0100/0201/0402/0603/0805/ 1206/1210/1218/2010/2512

RMC10,16,20,32,35,50,63 Automotive Grade Page: 1/10

DATA SHEET CURRENT SENSOR - LOW TCR PA0603 series 5%, 1% sizes 0603

WF12T, WF08T, WF06T, WF04T 0.5%, 0.1% TC50 High Precision Thin Film chip resistors Size 1206, 0805, 0603, 0402

DATA SHEET LOW OHMIC CHIP RESISTORS RL series 5%, 2%, 1% sizes 0402/0603/0805/1206/ 1210/1218/2010/2512

SPECIFICATIONS. Metal Film Precision Resistor. CSR-Serie SWISSDIS. Swissdis AG Grasweg 7 CH-4911 Schwarzhäusern

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC_L series ±0.1%, ±0.5%, ±1%, ±5% Sizes 0075/0100/0201/0402/0603/0805/ 1206/1210/1218/2010/2512

High Voltage Thick Film Chip Resistors Product Specification

Polypropylene Pulse/High Frequency Capacitors R79 Series Single Metallized Polypropylene Film, Radial, 5 mm Lead Spacing, Multipurpose Applications

DATA SHEET ARRAY CHIP RESISTORS YC/TC 5%, 1% sizes YC:102/104/122/124/162/164/248/324/158T/358L/358T TC: 122/124/164

C 062 C 105 K 1 R 5 T A Rated Voltage (VDC) 5 = 50 1 = = 200

SMD MELF - Resistors. Metal Film Precision Resistor - SMDM Series Size: 0204/ official distributor of

1. INSTRUCTION: THIS SHEET IS THE STATEMENT OF THE LEAD-FREE THICK FILM CHIP RESISTORS SPECIFICATION THAT UNIOHMS PRODUCTIONS CAN MEET.

Precision Thin Film Chip Resistor Array

METAL FOIL CHIP FIXED RESISTOR

Gas Discharge Tube (GDT) Data Sheet

Transcription:

w DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS High-voltage: NP0/X7R (Pb Free & RoHS compliant) 1K V TO 4K V 10 pf to 33 nf Sep 30, 2005 V. 1

2 SCOPE This specification describes Highvoltage NP0/X7R series chip capacitors with lead-free terminations. APPLICATIONS PCs, hard disk, game PCs Power supplies LCD panel ADSL, modem FEATURES Supplied in tape on reel Nickel-barrier end termination ORDERING INFORMATION Components may be ordered by using either a Phycomp s unique 12NC or Phycomp clear text code. PHYCOMP ORDERING CODE 12NC CODE 2 2 X X X X X X X X X X Carrier type 50 blister 38 paper 54 bulk Capacitance value (1) Tolerance 5 ±5% 6 ±10% Rated voltage - Termination 00 1K V; NiSn 02 2K V; NiSn 04 3K V; NiSn 50 4K V; NiSn Size 1 1206 2 1210 3 1808 4 1812 SCM042 Temperature characteristic 1 NP0 5 X7R Packaging (2) 1 reel: 180 mm; 7" 5 reel: 330 mm; " 4 bulk case (1) Refer to Conversion table of capacitance & last 2 digits of 12NC (2) Quantity on reel depends on thickness classification; see section Thickness classification and packing quantities for 1K V to 4K V. Conversion table of capacitance & last 2 digits of 12NC for NP0 1.0 10 8.2 22 68 34 560 46 4,700 58 1.2 11 10 23 82 35 680 47 5,600 59 1.5 12 12 24 100 36 820 48 6,800 61 1.8 15 25 120 37 1,000 49 8,200 62 2.2 14 18 26 150 38 1,200 51 10,000 63 2.7 15 22 27 180 39 1,500 52 12,000 64 3.3 16 27 28 220 41 1,800 53 15,000 65 3.9 17 33 29 270 42 2,200 54 18,000 66 4.7 18 39 31 330 43 2,700 55 22,000 67 5.6 19 47 32 390 44 3,300 56 6.8 21 56 33 470 45 3,900 57

3 Conversion table of capacitance & last 2 digits of 12NC for X7R 100 10 680 21 4,700 32 33,000 43 220,000 54 120 11 820 22 5,600 33 39,000 44 270,000 55 150 12 1,000 23 6,800 34 47,000 45 330,000 56 180 1,200 24 8,200 35 56,000 46 390,000 57 220 14 1,500 25 10,000 36 68,000 47 470,000 58 270 15 1,800 26 12,000 37 82,000 48 560,000 59 330 16 2,200 27 15,000 38 100,000 49 680,000 61 390 17 2,700 28 18,000 39 120,000 51 820,000 62 470 18 3,300 29 22,000 41 150,000 52 560 19 3,900 31 27,000 42 180,000 53 CTC CODE Size code Temp. Char. 1206 CG = NP0 1210 2R = X7R 1808 1812 Capacitance Tolerance Rated voltage 225 = 2,200,000 pf; the third digit signifies the multiplying factor: 0 = 1 1 = 1,0 2 = 1,00 3 = 1,000 4 = 10,000 5 = 100,000 6 = 1,000,000 8 = 0.01 9 = 0.1 J = ±5% K = ±10% E = 1K V F = 2K V G = 3K V H = 4K V Termination Packing Marking Series B = NiSn 2 = 180 mm; 7 paper 3 = 330 mm; paper B = 180 mm; 7 blister F = 330 mm; blister P = Bulk case 0 = No marking 0 = conv. ceramic D = BME Example: 1808CG100JGBB00

4 CONSTRUCTION The capacitor consists of a rectangular block of ceramic dielectric in which a number of interleaved metal electrodes are contained. This structure gives rise to a high capacitance per unit volume. The inner electrodes are connected to the two end terminations and finally covered with a layer of plated tin (NiSn). The terminations are lead-free. A cross section of the structure is shown in Fig.1. Fig. 1 terminations electrodes MLB457 ceramic material Surface mounted multilayer ceramic capacitor construction DIMENSION For dimension see Table 1 Table 1 TYPE CC1206 CC1210 CC1808 CC1812 L1 (mm) 3.2±0.20 3.2 ±0.20 4.5 ±0.30 4.5 ±0.30 T W W (mm) 1.6±0.20 2.5 ±0.20 2.0 ±0.30 3.2 ±0.30 T (mm) Refer to table 2 to 4 L2 L4 L1 L3 MBB211 L2/L3 (mm) min. 0.25 0.25 0.25 0.25 max. 0.75 0.75 0.75 0.75 Fig. 2 Surface mounted multilayer ceramic capacitor dimension L4 (mm) min. 1.40 1.40 2.20 2.20

5 CAPACITANCE RANGE & THICKNESS FOR NP0 1K/2K V Table 2 For NP0 1K/2K V sizes from 1206 to 1812 CAPACITANCE 1K V 2K V 1206 1210 1808 1812 1206 1210 1808 1812 10 12 15 18 22 27 33 0.8 ±0.10 1.25 ±0.20 1.00 ±0.10 39 47 56 68 82 1.25 ±0.20 1.25 ±0.20 1.25 ±0.20 100 120 1.25 ±0.20 1.25 ±0.20 150 0.8 ±0.10 180 220 270 1.00 ±0.10 1.25 ±0.20 330 0.85 ±0.10 390 1.15 ±0.15 470 0.85 ±0.10 560 680 1.15 ±0.15 820 1,000 1,200 1,500 1,800 2,200 2,700 3,300 1.15 ±0.15 1.25 ±0.20 NOTE 1. Values in shaded cells indicate thickness class in mm. 2. Capacitance range < 10 pf is on request.

6 CAPACITANCE RANGE & THICKNESS FOR NP0 3K/4K V Table 3 For NP0 3K/4K V sizes from 1808 to 1812 CAPACITANCE 3K V 4K V 1808 1812 1808 1812 10 12 15 1.5 ±0.10 18 22 1.5 ±0.10 27 33 39 1.15 ±0.15 1.15 ±0.15 47 56 same 68 82 100 120 150 1.6 ±0.20 180 220 270 330 390 470 560 680 2.0 ±0.20 1.6 ±0.20 NOTE 1. Values in shaded cells indicate thickness class in mm. 2. Capacitance range < 10 pf is on request.

7 CAPACITANCE RANGE & THICKNESS FOR X7R 1K/2K/3K V Table 4 For X7R 1K/2K/3K V sizes from 1206 to 1812 CAPACITANCE 1K V 2K V 3K V 1206 1210 1808 1812 1206 1210 1808 1812 1808 NOTE 470 0.8 ±0.10 1.6 ±0.20 680 1.25 ±0.20 1,000 1.25 ±0.20 1.35 ±0.15 2.0 ±0.20 1,500 1.15 ±0.15 1.35 ±0.15 2,200 1.6 ±0.20 1.35 ±0.15 3,300 4,700 1.25 ±0.20 1.25 ±0.20 1.35 ±0.15 6,800 1.25 ±0.20 1.6 ±0.20 1.6 ±0.20 10,000 2.0 ±0.20 15,000 22,000 1.6 ±0.20 1.25 ±0.20 33,000 2.0 ±0.20 1.6 ±0.20 47,000 1. Values in shaded cells indicate thickness class in mm.

8 THICKNESS CLASSES AND PACKING QUANTITY Table 5 DESCRIPTION SIZE THICKNESS 8 mm TAPE WIDTH/AMOUNT PER REEL 12 mm TAPE WIDTH CODE CLASSIFICATION Ø180 mm, 7 Ø330 mm, /AMOUNT PER REEL (mm) Paper Blister Paper Blister Ø180 mm, 7 Blister 0603 0.8 ±0.10 4,000 --- --- --- --- 0805 0.6 ±0.10 4,000 --- --- --- --- 0.8 ±0.10 4,000 --- --- --- --- 0.85 ±0.10 4,000 --- --- --- --- 1.25 ±0.20 --- 3,000 --- --- --- 1206 0.6 ±0.10 4,000 --- 20,000 --- --- 0.8 ±0.10 4,000 --- --- --- --- 0.85 ±0.10 4,000 --- 15,000 --- --- 1.00 ±0.10 --- 3,000 --- 10,000 --- 1.15 ±0.15 --- 3,000 --- 10,000 --- 1.25 ±0.20 --- 3,000 --- --- --- 1210 0.6 ±0.10 --- 4,000 --- 15,000 --- 0.85 ±0.10 --- 4,000 --- 10,000 --- Mid/High voltage 1.15 ±0.15 --- 3,000 --- 10,000 --- 1.25 ±0.20 --- 3,000 --- --- --- 1.6 ±0.20 --- 2,000 --- --- --- 1808 1.15 ±0.15 --- --- --- --- 1,500 1.25 ±0.20 --- --- --- --- 3,000 1.35 ±0.15 --- --- --- --- 1,000 1.5 ±0.10 --- --- --- --- 1,000 1.6 ±0.20 --- --- --- --- 2,000 2.0 ±0.20 --- --- --- --- 2,000 1812 0.85 ±0.10 --- --- --- --- 2,000 1.15 ±0.15 --- --- --- --- 1,500 1.25 ±0.20 --- --- --- --- 1,000 1.35 ±0.15 --- --- --- --- 1,000 1.5 ±0.10 --- --- --- --- 1,000 1.6 ±0.20 --- --- --- --- 1,000 2.0 ±0.20 --- --- --- --- 2,000

9 ELECTRICAL CHARACTERISTICS NP0/X7R DIELECTRIC CAPACITORS; NISN TERMINATIONS Unless otherwise stated all electrical values apply at an ambient temperature of 20±1 C, an atmospheric pressure of 86 to 106 kpa, and a relative humidity of 63 to 67%. Table 6 DESCRIPTION Capacitance range (1) VALUE 10 pf to 33 nf Capacitance tolerance (1) ±5% and ±10% Dissipation factor (D.F.) (1) : NP0 X7R Insulation resistance after 1 minute at U r (DC) Maximum capacitance change as a function of temperature (temperature characteristic/coefficient): NP0 X7R Operating temperature range: NP0/X7R 0.1% 2.5% R ins 10 GΩ or R ins C 500 seconds whichever is less ±30 ppm/ C ±15% 55 C to +125 C NOTE 1. NP0: frequency = 1 MHz for C 1 nf, measuring at voltage 1 Vrms; frequency = 1 KHz for C > 1 nf, measuring at voltage 1 V rms X7R: frequency = 1 KHz for C 10 µf, measuring at voltage 1 V rms.

10 TESTS AND REQUIREMENTS Table 7 Test condition, procedure and requirements TEST TEST METHOD PROCEDURE REQUIREMENTS Mounting IEC 60384-21/22 4.3 The capacitors may be mounted on printed-circuit boards or ceramic substrates No visible damage Visual inspection and dimension check 4.4 Any applicable method using 10 magnification In accordance with specification Capacitance 4.5.1 NP0: f = 1 MHz for C 1 nf, measuring at voltage 1 V rms at 20 C; f = 1 KHz for C > 1 nf, measuring at voltage 1 V rms at 20 C X7R: f = 1 KHz for C 10 µf, measuring at voltage 1 V rms at 20 C Within specified tolerance Dissipation factor (D.F.) 4.5.2 NP0: f = 1 MHz for C 1 nf, measuring at voltage 1 V rms at 20 C; f = 1 KHz for C > 1 nf, measuring at voltage 1 V rms at 20 C X7R: f = 1 KHz for C 10 µf, measuring at voltage 1 V rms at 20 C In accordance with specification Insulation resistance 4.5.3 At U r (DC) for 1 minute In accordance with specification Voltage proof 4.5.4.2 Test voltage (DC) applied for 1 minute U r 100 V: 2.5 U r applied to NP0/X7R series 100 V < U r 200 V: 1.5 U r +100 V applied to NP0/X7R series 200 V < U r 500 V: 1.3 U r +100 V applied to NP0/X7R series U r > 500 V: 1.3 U r applied to NP0/X7R series I: 7.5 ma No breakdown or flashover Temperature characteristic 4.6 Between minimum and maximum temperature NP0: l C/Cl: 30 ppm/ C X7R: l C/Cl: 15% Adhesion 4.15 A force applied for 10 seconds to the line joining the terminations and in a plane parallel to the substrate for size 0603: a force of 5 N applied for size 0402: a force of 2.5 N applied No visible damage

11 Table 7 Test condition, procedure and requirements (continued) TEST TEST METHOD PROCEDURE REQUIREMENTS Bond strength of plating on end face IEC 60384-21/22 4.8 Mounting in accordance with IEC 60384-22 paragraph 4.3 Conditions: bending 1 mm at a rate of 1 mm/s, radius jig 340 mm No visible damage NP0: l C/Cl: 1% or 0.5 pf whichever is greater X7R: l C/Cl: 10% Resistance to soldering heat 4.9 Precondition: 150 +0/ 10 C for 1 hour, then keep for 24 ±1 hours at room temperature Preheating: for size 1206: 120 to 150 C for 1 minute Preheating: for size >1206: 100 to 120 C for 1 minute and 170 to 200 C for 1 minute Solder bath temperature: 260 ±5 C Dipping time: 10 ±0.5 seconds Recovery time: 24 ±2 hours. The termination shall be well tinned NP0: l C/Cl: 0.5% or 0.5 pf whichever is greater X7R: l C/Cl: 10% D.F.: within initial specified value R ins : within initial specified value Solderability 4.10 Unmounted chips completely immersed in a solder bath at 235 ±5 C Dipping time: 2 ±0.5 seconds Depth of immersion: 10 mm The termination shall be well tinned. Rapid change of temperature 4.11 Preconditioning; 150 +0/ 10 C for 1 hour, then keep for 24 ±1 hours at room temperature 5 cycles with following detail: 30 minutes at lower category temperature; 30 minutes at upper category temperature Recovery time 24 ±2 hours. No visual damage NP0: l C/Cl: 1% or 1 pf whichever is greater X7R: l C/Cl: 15% D.F.: within initial specified value R ins : within initial specified value Damp heat, with U r load 4. Initial measurements; after 150 +0/-10 C for 1 hour, then keep for 24 ±1 hours at room temperature Duration and conditions: 500 ±12 hours at 40 ±2 C; 90 to 95% RH; U r applied Final measurement: perform a heat treatment at 150 +0/ 10 C for 1 hour, final measurements shall be carried out 24 ±1 hours after recovery at room temperature without load. NP0: l C/Cl: 2% or 1 pf whichever is greater X7R: l C/Cl: 15% NP0: D.F.: 2 initial value max. X7R 100 V: D.F. 5% NP0: R ins 2,500 MΩ or R ins C r 25 seconds, whichever is less X7R: R ins 500 MΩ or R ins C r 25 seconds, whichever is less

12 Table 7 Test condition, procedure and requirements (continued) TEST TEST METHOD PROCEDURE REQUIREMENTS Endurance IEC 60384-21/22 4.14 Preconditioning; Initial measurements; after 150 +0/-10 C for 1 hour, then keep for 24 ±1 hours at room temperature Duration and conditions: 1,000 ±12 hours at upper category temperature with 1.5 U r voltage applied Final measurement: perform a heat treatment at 150 +0/ 10 C for 1 hour, final measurements shall be carried out 24 ±1 hours after recovery at room temperature without load. NP0: l C/Cl: 2% or 1 pf whichever is greater X7R: l C/Cl: 15% NP0: D.F.: 2 initial value max. X7R 100 V: D.F. 5% NP0: R ins 4,000 MΩ or R ins C r 40 seconds, whichever is less X7R: R ins 1,000 MΩ or R ins C r 50 seconds, whichever is less

REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 1 Sep 30, 2005 - - Thickness revised Version 0 Sep 12, 2005 - - New