CPC1N V Normally-Open Single-Pole 4-Pin SOP OptoMOS Relay Parameter Rating Units Blocking Voltage V P Load Current 7 ma rms / ma DC On-Resistance (max) 1 LED Current to operate. ma Features Designed for EN13-4 Compliant Security Systems 1V rms Input/Output Isolation Only.mA of LED Current Required to Operate Small 4-Pin SOP Package High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Immune to Radiated EM Fields Tape & Reel Version Available Flammability Rating UL 94 V- Applications Security Passive Infrared Detectors (PIR) Data Signalling Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment Patient/Equipment Isolation Aerospace Industrial Controls Description The CPC1N is a miniature single-pole, normally-open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1V rms of input to output isolation. The relay outputs are constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. Using IXYS Integrated Circuits Division s state of the art double-molded vertical construction packaging to produce one of the world s smallest relays, the CPC1N offers board space savings of at least 2% over the competitor s larger 4-pin SOP relay. Approvals UL Recognized Component: File E727 CSA Certified Component: Certificate 11727 EN/IEC 9-1 Certified Component: TUV Certificate B 13 12 827 3 Ordering Information Part # CPC1N CPC1NTR Pin Configuration 1 + Control Description 4-Pin SOP (1/tube) 4-Pin SOP (2/reel) 4 Load 2 3 Control Load Switching Characteristics of Normally-Open Devices Form-A 9% 1% I LOAD t on t off DS-CPC1N-R www.ixysic.com 1
CPC1N Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Blocking Voltage V P Reverse Input Voltage V Input Control Current ma Peak (1ms) 1 A Input Power Dissipation 1 7 mw Total Power Dissipation 2 4 mw Isolation Voltage Input to Output 1 V rms ESD Rating, Human Body Model 4 kv Operational Temperature -4 to +8 ºC Storage Temperature -4 to +12 ºC 1 Derate linearly 1.33 mw / ºC 2 Derate linearly 3.33 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +2 C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 2ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous =.ma I L - - 7 ma rms / ma DC Peak t=1ms I LPK - - ±3 ma P On-Resistance 1 =.ma, I L =7mA R ON - 7 1 Off-State Leakage Current =ma, V L =V P I LEAK - - 1 A Switching Speeds Turn-On t =2mA, V L =1V on - - 1 ms Turn-Off t off - - 1 ms Output Capacitance =ma, V L =V, f=1mhz C OUT - - pf Input Characteristics Input Control Current to Activate 2 I L =7mA -.1. ma Input Control Current to Deactivate -. - - ma Input Voltage Drop =ma V F.9 1.2 1. V Reverse Input Current V R =V I R - - 1 A Common Characteristics Capacitance, Input to Output V IO =V, f=1mhz C IO - 1 - pf 1 Measurement taken within 1 second of on-time. 2 For applications requiring high temperature operation (greater than ºC) a minimum LED drive current of 2mA is recommended. 2 www.ixysic.com R
CPC1N PERFORMANCE DATA* 3 Typical LED Forward Voltage Drop (N=, =ma) 2 Typical Turn-On Time (N=, =2mA, I L =7mA) 2 Typical Turn-Off Time (N=, =2mA, I L =7mA) 2 2 1 1 2 1 1 2 1 1 1.23 1.24 1.24 1.2 1.2 1.2 1.2 LED Forward Voltage (V).99.18.117.12.13.144.13 Turn-On Time (ms).4.41.43.44.4.47.49 Turn-Off Time (ms) 2 Typical for Switch Operation (N=, I L =7mA) 2 Typical On-Resistance Distribution (N=, =.ma, I L =7mA) 2 Typical Blocking Voltage Distribution (N=, =ma) 2 1 1 2 1 1 2 1 1.7.8.9.1.11.12 LED Forward Current (ma).7.8.9 7. 7.1 7.2 7.3 On-Resistance ( ) 83 84 8 8 87 88 89 9 91 Blocking Voltage (V P ) LED Forward Voltage (V) 1. 1. 1.4 1.3 Typical LED Forward Voltage Drop =ma =2mA =1mA 1.2 =ma 1.1 =2mA 1. =1mA -4-2 2 4 8 1 Turn-On Time ( s) 3 2 2 1 1 Typical Turn-On Time vs. LED Forward Current =ma) 1 2 3 4 LED Forward Current (ma) Turn-Off Time ( s) 449 448 447 44 44 444 443 Typical Turn-Off Time vs. LED Forward Current =ma) 1 2 3 4 LED Forward Current (ma).18 Typical for Switch Operation =ma) Typical Turn-On Time =ma) 7 Typical Turn-Off Time =ma) (ma).1.14.12.1.8 Turn-On Time ( s) 4 3 2 1 =1mA =2mA =ma Turn-Off Time ( s) 4 3 =ma =2mA =1mA. -4-2 2 4 8 1-4 -2 2 4 8 1 2-4 -2 2 4 8 1 *Unless otherwise noted, data presented in these graphs is typical of device operation at 2ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R www.ixysic.com 3
CPC1N On-Resistance ( ) 12 11 1 9 8 7 Typical On-Resistance ( =1mA, I L =ma) -4-2 2 4 8 1 Load Current (ma) PERFORMANCE DATA* 1 - Typical Load Current vs. Load Voltage ( =.ma) -1 -. -.4 -.2..2.4. Load Voltage (V) Load Current (ma) 8 7 7 Maximum Load Current ( =1mA) 4-4 -2 2 4 8 1 94 Typical Blocking Voltage 1 Typical Leakage Measured Across Pins 3&4 (V L =V) 14 Output Capacitance vs. Load Voltage ( =ma, f=1mhz) Blocking Voltage (V P ) 92 9 88 8 Leakage Current (na) 8 4 2 Output Capacitance (pf) 12 1 8 84-4 -2 2 4 8 1-4 -2 2 4 8 1 4 1 2 3 4 Load Voltage (V) Load Current (ma) Energy Rating Curve ( =.ma) 8 7 4 3 2 1 1 s 1 s 1ms 1ms 1ms 1s 1s 1s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 2ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R
CPC1N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Classification CPC1N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-2. Soldering Profile Provided in the table below is the Classification Temperature (T C ) of this product and the maximum dwell time the body temperature of this device may be (T C - )ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-2 must be observed. Board Wash Device Classification Temperature (T c ) Dwell Time (t p ) Max Reflow Cycles CPC1N 2ºC 3 seconds 3 IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R www.ixysic.com
CPC1N CPC1N 4.89 ±.2 (.11 ±.1) MECHANICAL DIMENSIONS.23 Typ (.8 Typ) Recommended PCB Land Pattern. (.22) 3.81 ±.2 (.1 ±.1) Pin 1 2.4 Typ (.1 Typ) 2.3±.2 (.8±.1).481 (.19) -.1 (-.4).9 ±.12 (.24 ±.4) Package standoff:.4 ±.4 (.2 ±.1).381 TYP. (.1 TYP.).91 ±.2 (.3 ±.1).9 ±.127 (.22 ±.) 1.4 (.7) 2.4 (.1). (.217) Dimensions mm (inches) CPC1NTR Tape & Reel 33.2 Dia (13. Dia) Top Cover Tape Thickness.12 Max (.4 Max) B =4.7 (.18) W=12. (.472) K =2.7 (.1) K 1 =2.3 (.91) A =. (.2) P1=8. (.31) User Direction of Feed Embossed Carrier Dimensions mm (inches) Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1N-R Copyright 218, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/3/218