19-3495; Rev ; 11/4 High-oltage, Low-Power Linear Regulators for General Description The are micropower, 8-pin TDFN linear regulators that supply always-on, keep-alive power to CMOS RAM, real-time clocks (RTC), and microcontrollers in systems with high-voltage batteries. The circuits consist of a 1mA linear regulator and a power-good comparator () with fixed-output delay. Key features include wide input voltage range, low-dropout voltage, and low-quiescent supply current. Despite a miserly 25µA (max) no-load quiescent current, the have good line- and loadtransient response and excellent AC power-supply rejection. They provide a clean fixed 5 or 3.3 output (MAX8718), or an adjustable 1.24 to 28 output (MAX8719), even when subjected to fast supply-voltage changes that occur during the switchover from battery to AC-adapter input power. The space-saving TDFN package has excellent thermal characteristics and tolerates up to 1951mW of power dissipation. Internal foldback current limiting and thermal shutdown protect the regulator from overload and thermal faults. In addition to the main notebook-computer application, these devices are useful in other low-power, high-voltage applications (4 < IN < 28) such as smart batteries, current control loops, telecom emergency power, and housekeeping power for off-line supplies. The are available in a thermally enhanced 3mm x 3mm, 8-lead TDFN package. Features 4 to 28 Input Range 18µA Quiescent Supply Current <3µA Shutdown Supply Current 1mA Output Current 3.3 or 5, Pin-Selectable Output (MAX8718) Adjustable 1.24 to 28 Output (MAX8719) ±2% Output Accuracy Thermal-Overload Protection Delayed Power-Good Output Thermally Enhanced 8-Pin TDFN Package Ordering Information PART TEMP RANGE PIN-PACKAGE MAX8718ETA -4 C to +85 C MAX8719ETA -4 C to +85 C 8 TDFN 3mm x 3mm 8 TDFN 3mm x 3mm OUTPUT OLTAGE 3.3/5 Adjustable Applications Pin Configuration CMOS/RTC Backup Power Microcontroller Power TOP IEW Smart-Battery Packs PDAs and Handy-Terminals Battery-Powered Systems IN GND 5/3 (FB) CC 1 2 3 4 MAX8718 MAX8719 8 7 6 5 OUT I.C. SHDN TDFN 3mm 3mm () ARE FOR THE MAX8719. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com.
ABSOLUTE MAXIMUM RATINGS IN to GND...-.3 to +3 SHDN to GND...-.3 to ( IN +.3) 5/3 (MAX8718) to GND...-.3 to +6 FB (MAX8719) to GND...-.3 to +6 OUT (MAX8718) to GND...-.3 to +6 OUT (MAX8719) to GND...-.3 to +3 CC to GND (MAX8718)...-.3 to +6 CC to GND (MAX8719)...-.3 to +2.7 to GND...-.3 to +3 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS I.C. to GND...-.3 to +6 OUT Short Circuit to GND...3s Continuous Power Dissipation (T A = +7 C) 8-Pin TDFN (derate 24.4mW/ C above +7 C)...1951mW Operating Temperature Range...-4 C to +85 C Junction Temperature...+15 C Storage Temperature Range...-65 C to +15 C Lead Temperature (soldering, 1s)...+3 C (Circuit of Figure 1. IN = 15, I OUT = 5µA, T A = C to +85 C. Typical values are at T A = +25 C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input oltage Range IN 4 28 SHDN = IN, T A = +25 C 12 18 µs Supply Current (MAX8718) I IN SHDN = IN, IN = 6 to 28 25 µa CC Input Current (MAX8719) CC Input Current (MAX8718) < CC < 2.7, T A = +25 C -.1 +.1 < CC < 2.7, T A = C to +85 C.4 < CC < 5.5, T A = +25 C 3.4 < CC < 5.5, T A = C to +85 C 2.3 OUT Minimum Load Current 5 µa Shutdown Supply Current SHDN = 1.2 3 µa Dropout Supply Current OUT set to 5, IN = 4.7 85 µa IN = 6 to 28, I LOAD = 1mA, 5/3 = GND, T A = +25 C 3.26 3.33 3.4 µa µa OUT Output oltage (MAX8718) IN = 6 to 28, I LOAD = 1mA, 5/3 = OUT, T A = +25 C IN = 6 to 28, I LOAD = 5µA to 1mA, 5/3 = GND 4.95 5.5 5.15 3.15 3.48 IN = 6 to 28, I LOAD = 5µA to 1mA, 5/3 = OUT 4.75 5.25 FB Threshold (MAX8719) FB FB = OUT, IN = 6 to 28, I LOAD = 5µA to 1mA (Note 2) FB = OUT, IN = 6 to 28, I LOAD = 1mA 1.215 1.24 1.265 1.18 1.28 FB = 1.3, T A = +25 C -3 +3 FB Input Current (MAX8719) I FB FB = 1.3, T A = C to +85 C 15 5/3 = 5, T A = +25 C -3 +3 5/3 Input Current (MAX8718) I 5/3 5/3 = 5, T A = C to +85 C 2 na na Dropout oltage DROPOUT I LOAD = 1mA (Note 3) 56 m 2
ELECTRICAL CHARACTERISTICS (continued) (Circuit of Figure 1. IN = 15, I OUT = 5µA, T A = C to +85 C. Typical values are at T A = +25 C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS IN = 6, T A = +25 C 21 Output Current Limit I LIM OUT =, IN = 6 125 34 Output Reverse Leakage Current OUT forced to 5.5, IN = unconnected 7 µa Capacitive Load Requirements Startup Time Response Startup Output Overshoot CC Threshold (MAX8718) MAX8718.16 MAX8719.23 Rising edge of IN or SHDN to OUT within spec limits, C OUT = 1µF, R LOAD = 5Ω, OUT = 5 C OUT = 1µF, R LOAD = 5Ω, OUT within 9% of the nominal output voltage T A = +25 C, rising edge only C < T A < +85 C, rising edge only ma µf/ma 1 ms.5 %.88.9.92 OUT OUT OUT.85.9.95 OUT OUT OUT CC Threshold (MAX8719) T A = +25 C, rising edge only.88.9.92 FB FB FB C < T A < +85 C, rising edge only.85.9.95 FB FB FB CC to Delay TH to ( TH - 1m) 4.5 µs Active-Timeout Period 1 185 3 ms Output Leakage Current = 5.5, CC = 5.5.1 µa Output Low oltage I SINK = 1.6mA, CC = GND.3 CC Input Hysteresis 2 % Thermal-Shutdown Threshold SHDN = or 15, 2 C hysteresis +165 C SHDN Input Low oltage.25 SHDN Input High oltage 1.4 SHDN Input Bias Current SHDN = or 15, T A = C to +85 C -1 +.1 +1 µa 3
ELECTRICAL CHARACTERISTICS (Circuit of Figure 1 IN = 15, I OUT = 5µA, T A = -4 C to +85 C, unless otherwise noted.) (Note 4) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input oltage Range IN 4 28 Supply Current (MAX8718) I IN SHDN = IN, IN = 6 to 28 25 µa Supply Current (MAX8719) I IN SHDN = IN, IN = 6 to 28 25 µa OUT Minimum Load Current 5 µa Shutdown Supply Current SHDN = 3 µa OUT Output oltage (MAX8718) IN = 6 to 28, I LOAD = 5µA to 1mA, 5/3 = GND IN = 6 to 28, I LOAD = 5µA to 1mA, 5/3 = OUT FB Threshold (MAX8719) FB FB = OUT, IN = 6 to 28, I LOAD = 5µA to 1mA (Note 2) 3.1 3.48 4.72 5.25 FB = OUT, IN = 6 to 28, I LOAD = 1mA 1.215 1.265 1.18 1.28 FB Input Current (MAX8719) I FB FB = 1.3-4 +4 na 5/3 Input Current (MAX8718) I 5/3 5/3 = 5-3 +3 na Dropout oltage DROPOUT I LOAD = 1mA (Note 3) 56 m Output Current Limit I LIM OUT =, IN = 6 125 375 ma Capacitive Load Requirements MAX8718.16 MAX8719.23 µf/ma Startup Time Response Rising edge of IN or SHDN to OUT within spec limits, C OUT = 1µF, R LOAD = 5Ω, OUT = 5 1 ms CC Threshold (MAX8718) -4 C < T A < +85 C, rising edge only.85.95 OUT OUT.85.95 CC Threshold (MAX8719) -4 C < T A < +85 C, rising edge only FB FB Active-Timeout Period 1 3 ms Output Low oltage I SINK = 1.6mA, CC = GND.3 SHDN Input Low oltage.25 SHDN Input High oltage 1.4 SHDN Input Bias Current SHDN = or 15, T A = -4 C to +85 C -1 +1 µa Note 1: Limits are 1% production tested at T A = +25 C. Limits over the operating temperature range are guaranteed through correlation using standard quality control (SQC) methods. Note 2: Pulse test at IN = 28, I OUT = 1mA to avoid exceeding package power-dissipation limits. Note 3: Dropout voltage is tested by reducing the input voltage until OUT drops to 1m below its nominal value as measured with IN starting 2 above OUT. Note 4: Specifications to -4 C are guaranteed by design, not production tested. 4
Typical Operating Characteristics (Circuit of Figure 1. IN = 15, OUT = 3.3, T A = +25 C, unless otherwise noted.) LOAD CURRENT (ma) 12. 1. 8. 6. 4. 2. SAFE LOAD-CURRENT OPERATING AREA vs. SUPPLY OLTAGE POWER-DISSIPATION LIMIT REGION 5 1 15 2 25 3 SUPPLY OLTAGE () MAX8718/19 toc1 GROUND CURRENT (ma) 15. 12. 9. 6. 3. GROUND CURRENT vs. SUPPLY OLTAGE AT ARIOUS LOADS 15mA 11mA 7mA 3mA 1mA 5 1 15 2 25 3 SUPPLY OLTAGE () MAX8718/19 toc2 SUPPLY CURRENT (µa) SUPPLY CURRENT vs. SUPPLY OLTAGE 19. 18.5 18. 17.5 17. 16.5 16. 15.5 T A = +85 C T A = +25 C T A = -4 C 15. 5 1 15 2 25 3 SUPPLY OLTAGE () MAX8718/9 toc3 SHUTDOWN SUPPLY CURRENT (µa) 1.6 1.4 1.2 1..8.6.4.2 SHUTDOWN SUPPLY CURRENT vs. SUPPLY OLTAGE T A = +25 C 2 6 1 14 18 22 26 3 SUPPLY OLTAGE () MAX8718/19 toc4 SUPPLY CURRENT (µa) SUPPLY CURRENT vs. TEMPERATURE 19. IN = 15 18.5 18. 17.5 17. 16.5 16. 15.5 15. -4-2 2 4 6 8 1 TEMPERATURE ( C) MAX8718/9 toc5 RIPPLE REJECTION (db) RIPPLE REJECTION vs. FREQUENCY -8-7 -6-5 -4-3 -2-1 1mA LOAD CURRENT.1.1 1 1 1 FREQUENCY (khz) MAX8718/19 toc6 LOAD-TRANSIENT RESPONSE MAX8718/9 toc7 LINE-TRANSIENT RESPONSE MAX8718/9 toc8 OUT 1m/div OUT 2m/div AC-COUPLED +2 I OUT 1mA/div C IN = 1µF, C OUT = 1µF IN +1 2µs/div 1µs/div 5
Typical Operating Characteristics (continued) (Circuit of Figure 1. IN = 15, OUT = 3.3, T A = +25 C, unless otherwise noted.) IN = 15 TIME TO EXIT SHUTDOWN 1µs/div MAX8718/9 toc9 +5 OUT SHDN 5/div DROPOUT SUPPLY CURRENT (µa) 16 14 12 1 8 6 4 2 DROPOUT SUPPLY CURRENT vs. SUPPLY OLTAGE T A = -4 C T A = +85 C T A = +25 C 4. 4.2 4.4 4.6 4.8 5. 5.2 5.4 5.6 5.8 6. SUPPLY OLTAGE () MAX8718/19 toc1 DROPOUT OLTAGE (m) 35 3 25 2 15 1 5 DROPOUT OLTAGE vs. LOAD CURRENT MAX8718/9 toc11 TRANSIENT RESPONSE MAX8718/9 toc12 +5 CC +5 1 2 3 4 5 6 7 8 9 1 LOAD CURRENT (ma) 4ms/div ACTIE-TIMEOUT PERIOD (ms) 18 175 17 165 16 155 ACTIE-TIMEOUT PERIOD vs. TEMPERATURE MAX8718/9 toc13 15-4 -2 2 4 6 8 1 TEMPERATURE ( C) 6
MAX8718 PIN MAX8719 NAME FUNCTION 1 1 IN Positive Supply Input. Connect to a +4 to +28 supply. 2 2 GND Ground Pin Description 3 5/3 P r eset Outp ut- ol tag e S el ect Inp ut. C onnect 5/3 to GN D for 3.3 outp ut, or to OU T for 5 outp ut. 3 FB Feedback Input. Regulates to 1.24 nominally. 4 4 CC Sense Input 5 5 Power-Good Output 6 6 SHDN Shutdown Control Input 7 7 I.C. Internal Connection. This pin is internally connected for test purposes; leave it unconnected in the application. 8 8 OUT 1mA Regulator Output IN OUT OUTPUT 3.3 IN OUT OUTPUT 6 TO 28 1µF SHDN MAX8718 CC 1kΩ 1µF 6 TO 28 1µF SHDN MAX8719 CC 1kΩ 1µF I.C. I.C. R1 GND 5/3 GND FB R2 Figure 1. Typical Operating Circuit of the MAX8718 Figure 2. Typical Operating Circuit of the MAX8719 Detailed Description The low-quiescent-current linear regulators are designed primarily for high-input-voltage applications. The MAX8718 supplies a preselected 3.3 or 5. output for loads up to 1mA (Figure 1). The MAX8719 provides an adjustable voltage from 1.24 to 28 (Figure 2). The maximum output current is a function of the package s maximum power dissipation for a given temperature. A 5µA load is required to maintain output regulation. The MAX8718 s output voltage is fed back through an internal resistive voltage-divider connected to OUT. Set the output voltage to either 5. or 3.3 with the 5/3 pin. Select the 5 output by connecting 5/3 to OUT, or the 3.3 output by connecting 5/3 to GND. The MAX8719 s output is adjustable with an external resistive voltage-divider. The typical feedback threshold is 1.24 (see the Setting the MAX8719 Output oltage section). See Figure 3 for the MAX8718/ MAX8719 Functional Diagram. Shutdown The device enters shutdown mode when SHDN is low. In shutdown mode, the internal pnp power transistor, control circuit, reference, and all biases turn off, reducing the supply current to below 3µA. Connect SHDN to IN for automatic startup. 7
SHDN BIAS THERMAL SHUTDOWN REF IN CURRENT LIMIT MAX8718 MAX8719 OUT FB (MAX8719) 5/3 (MAX8718) GND CC DELAY THRESHOLD Figure 3. Functional Diagram Current Limit Output current is limited to 21mA (typ). The current limit exceeds the 1mA (min) safe operating limit. The output can be shorted to ground for 3 seconds without damaging the part. Thermal-Overload Protection When the junction temperature exceeds T J = +165 C, an internal thermal sensor sends a signal to the shutdown logic, turning off the pass transistor and allowing the IC to cool. The thermal sensor turns the pass transistor on again after the IC s junction temperature cools by 2 C (typ), causing the output to pulse on and off during continuous thermal-overload conditions. Operating Region and Power Dissipation Maximum power dissipation depends on the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The device s power dissipation is P = I OUT x ( IN - OUT ). The power dissipation at +7 C ambient is 1951mW (see the Absolute Maximum 8
C IN IN 1 2 3 4 Ratings). The thermal resistance junction-to-case of the TDFN package is 41 C/W, and the maximum safe junction temperature is +15 C. The GND pin and backside pad performs the dual function of providing an electrical connection to ground and channeling heat away from the package. Connect GND and the backside pad to ground using a metal trace or ground plane. The package s overall thermal resistance varies inversely with the copper PC board area attached to the part. To achieve rated thermal resistance, a copper region of at least 65mm 2 should be attached to the s case. Applications Information Setting the MAX8719 s Output oltage Set the MAX8719 s output voltage with a resistive voltage-divider (R1 and R2 in Figure 3). Choose R2 = 125kΩ or less to maintain a 1µA minimum load on OUT. Calculate R1 using the following equation: where FB = 1.24 (typ). GND MAX8718 MAX8719 Figure 4. Layout of High-Current Paths R R OUT 1= 2 1 FB Capacitor Selection Use a.1µf (min) capacitor on the input. Higher values improve the line-transient response. Use a 1µF (min) capacitor on the output, or a 15µF capacitor for the full 1mA load current. Otherwise, use a 1µF plus.16µf/ma (.23µF/mA for the MAX8719). For output voltages less than 3.3, use 15µF instead of 1µF. The output capacitor s equivalent series resistance (ESR) must be less than 1Ω for stable operation. Output-oltage Noise The typically exhibit 5m P-P of noise during normal operation. This is negligible in 8 7 6 5 OUT C OUT most applications. In applications that include analogto-digital converters (ADCs) of more than 12 bits, consider the ADC s power-supply rejection specifications. Transient Response The Typical Operating Characteristics show the s load-transient response. When a step-in load current is applied, there are two components to the regulator s response. There is an instantaneous step in the output voltage due to the output capacitor s ESR and the regulator s finite output impedance. The second, slower component is the regulator s active correction to the output voltage. Typical step changes in the OUT load current from 1mA to 2mA produce 2m transients. Power-Good Output () The include an independent power-good monitor. This circuit has an uncommitted sense input ( CC ) that can be connected to the regulator s output or similar voltage. In the MAX8718, the comparator threshold tracks the output set point according to the state of 5/3. In the MAX8719, the comparator threshold is set to the feedback reference voltage. The output goes high when CC is greater than -1% of the regulation set point. There is a fixed 1ms (min) delay when the output goes into regulation, which helps ensure proper output-voltage settling. The delay when transitioning out of regulation is much faster, 4.5µs (typ), which permits the system to respond as fast as possible to the out-of-regulation condition. The power-good monitor has an open-drain output, which can be externally pulled up to OUT. The voltage rating for is 28. Layout Guidelines Good layout is important to minimize the effects of noise and ensure accurate voltage regulation. Use appropriate trace widths for the high-current paths and keep traces short to minimize parasitic inductance and capacitance. Figure 4 shows a layout of the high-current paths. Place bypass capacitors close to the IN and OUT pins. When using the MAX8719, the feedback resistors should be placed close to the device to avoid voltage drops on ground that may shift the output voltage. Connect the exposed backside paddle to as large a copper area as practical. Chip Information TRANSISTOR COUNT: 1298 PROCESS: BiCMOS 9
Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) PIN 1 INDEX AREA D E DETAIL A E2 LC N L C 6, 8, &1L, DFN THIN.EPS L L A e e PACKAGE OUTLINE, 6, 8, 1 & 14L, TDFN, EXPOSED PAD, 3x3x.8 mm NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY 21-137 F 1 2 COMMON DIMENSIONS SYMBOL MIN. MAX. A.7.8 D 2.9 3.1 E 2.9 3.1 A1..5 L.2.4 k.25 MIN. A2.2 REF. PACKAGE ARIATIONS PKG. CODE N D2 E2 e JEDEC SPEC b [(N/2)-1] x e T633-1 6 1.5±.1 2.3±.1.95 BSC MO229 / WEEA.4±.5 1.9 REF T833-1 8 1.5±.1 2.3±.1.65 BSC MO229 / WEEC.3±.5 1.95 REF T133-1 1 1.5±.1 2.3±.1.5 BSC MO229 / WEED-3.25±.5 2. REF T1433-1 14 1.7±.1 2.3±.1.4 BSC - - - -.2±.3 2.4 REF T1433-2 14 1.7±.1 2.3±.1.4 BSC - - - -.2±.3 2.4 REF PACKAGE OUTLINE, 6, 8, 1 & 14L, TDFN, EXPOSED PAD, 3x3x.8 mm 21-137 F 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 1 Maxim Integrated Products, 12 San Gabriel Drive, Sunnyvale, CA 9486 48-737-76 24 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.