6V Normally-Closed Single-Pole 4-Pin SOP OptoMOS Relay Parameter Rating Units Blocking Voltage 6 V P Load Current 4 ma rms / ma DC Max On-Resistance 2 LED Current to Operate 2 ma Features V rms Input/Output Isolation Small 4-Pin SOP Package High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Immune to radiated EM fields Wave Solderable Tape & Reel Version Available Applications Security Passive Infrared Detectors (PIR) Data Signalling Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment Patient/Equipment Isolation Aerospace Industrial Controls Description The is a single-pole, normally-closed (1-Form-B) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide V rms of input/output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. IXYS Integrated Circuits Division s state of the art double-molded vertical construction packaging makes the one of the world s smallest relays. It offers board space savings of at least 2% over the competitor s larger 4-pin SOP relay. Approvals UL Recognized Component: File E7627 CSA Certified Component: Certificate 11727 EN/IEC 69-1 Certified Component: Certificate B 13 12 82667 3 Ordering Information Part # TR Pin Configuration Description 4-Pin SOP (1/tube) 4-Pin SOP (2/reel) 1 + Control 4 Load 2 3 Control Load Switching Characteristics of Normally-Closed Devices Form-B I LOAD 1% t off 9% t on DS--R2 www.ixysic.com 1
Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Blocking Voltage 6 V P Reverse Input Voltage V Input Control Current ma Peak (1ms) 1 A Input Power Disipation 7 mw Total Power Dissipation 1 4 mw Isolation Voltage, Input to Output V rms ESD Rating, Human Body Model 8 kv Operational Temperature -4 to +8 C Storage Temperature -4 to +12 C 1 Derate linearly 3.33 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +2 C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 2ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 =ma I L - - 4 ma rms / ma DC Peak =ma, t<1ms I LPK - - 1 ma On-Resistance 2 =ma, I L =4mA R ON - 1.2 2 Off-State Leakage Current =2mA, V L =6V P I LEAK - - 1 µa Switching Speeds Turn-On t =ma, V L =1V on -.46 2 Turn-Off t off - 2.1 ms Output Capacitance =2mA, V L =V, f=1mhz - 24 - C I OUT F =2mA, V L =1V, f=1mhz - 114 - pf Input Characteristics Input Control Current to Activate (Output Open) 3 - -.8 2 ma Input Control Current to Deactivate (Output Closed) I L =12mA.1.6 - ma Input Voltage Drop =ma V F.9 1.2 1.4 V Reverse Input Current V R =V I R - - 1 µa Common Characteristics Capacitance, Input to Output V IO =V, f=1mhz C IO - 1 - pf 1 Load current derates linearly from 4mA @ 2 o C to 2mA @8 o C. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 6 o C) a minimum LED drive current of 4mA is recommended. R2 2 www.ixysic.com
PERFORMANCE DATA @2ºC (Unless Otherwise Noted)* 3 Typical LED Forward Voltage Drop (N=, =ma) 2 Typical Turn-On Time (N=, =ma, I L =1mA) 2 Typical Turn-Off Time (N=, =ma, I L =1mA) 3 2 2 1 2 1 2 1 1.2 1.22 1.22 1.23 1.23 LED Forward Voltage (V).43.44.4.46.47.48.49 Turn-On Time (ms) 1.2 1.6 2. 2.4 2.8 3.2 3.6 Turn-Off Time (ms) 2 Typical for Switch Operation (N=, I L =4mA) 2 Typical On-Resistance Distribution (N=, =ma, I L =4mA) 3 Typical Blocking Voltage Distribution (N=, =2mA) 2 1 1 2 2 1.42..8.66.74.82.9 1.21 1.24 1.27 1.3 1.33 1.36 1.39 On-Resistance ( ) 66 68 7 72 74 76 Blocking Voltage (V P ) LED Forward Voltage (V) 1.6 1. 1.4 1.3 Typical LED Forward Voltage Drop =ma =2mA 1.2 =1mA 1.1 =ma =2mA 1. -4-2 2 4 6 8 1 Turn-Off Time ( s) 468 466 464 462 46 48 Typical Turn-On Time vs. LED Forward Current 1 2 3 4 Turn-On Time (ms) 1 8 6 4 2 Typical Turn-Off Time vs. LED Forward Current 1 2 3 4 Typical for Switch Operation (I L =2mA).8.7.7.6.6...4.4-4 -2 2 4 6 8 1 Turn-On Time (ms).7.6..4.3.2 Typical Turn-On Time (I L =2mA) =2mA =ma =1mA.1-4 -2 2 4 6 8 1 Turn-Off Time (ms) 1 8 6 4 2 =2mA =ma =1mA Typical Turn-Off Time (I L =2mA) -4-2 2 4 6 8 1 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. R2 www.ixysic.com 3
On-Resistance ( ) PERFORMANCE DATA @2ºC (Unless Otherwise Noted)* Typical On-Resistance ( =ma, I L =2mA) 1. 1.4 1.4 1.3 1.3 1.2 1.2 1. 1.1 1. -4-2 2 4 6 8 1 Load Current (ma) 4 4 3 3 2 2 Maximum Load Current -4-2 2 4 6 8 1 Load Current (ma) Typical Load Current vs. Load Voltage ( =ma) 4 3 2 1-1 -2-3 -4 - -.6 -.4 -.2..2.4.6 Load Voltage (V) Leakage (na) 32 3 28 26 24 22 2 Typical Leakage Current ( =4mA, V L =6V) 18-4 -2 2 4 6 8 1 Blocking Voltage (V P ) 8 78 76 74 72 Typical Blocking Voltage ( =4mA) 7-4 -2 2 4 6 8 1 Output Capacitance (pf) 2 2 1 Output Capacitance vs. Load Voltage ( =2mA) 1 2 3 4 Load Voltage (V) Load Current (ma) Energy Rating Curve 11 1 9 8 7 6 4 3 1 s 1 s 1ms 1ms 1ms 1s 1s 1s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R2 4 www.ixysic.com
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Rating MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Board Wash Device Maximum Temperature x Time Maximum Reflow Cycles 26ºC for 3 seconds 3 IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R2 www.ixysic.com
4.89 ±.23 (.161 ±.8) Mechanical Dimensions.2 ±.2 (.8 ±.1) Recommended PCB Land Pattern.6 (.217) 3.81 ±.76 (. ±.3) Pin 1 2.4 Typ (.1 Typ) 6.96 ±.12 (.24 ±.4) 1.2 ±.2 (.4 ±.1).432 ±.127 (.17 ±.) 1.3 (.12).6 (.22) 2.184 Max (.86 Max) Pin to package standoff:.637 ±.383 (.2 ±.) 2.4 (.1).762 ±.12 (.3 ±.4).381 TYP. (. TYP.) Dimensions mm (inches) TR Tape & Reel 33.2 Dia (13. Dia) Top Cover Tape Thickness.12 Max (.4 Max) B =4.7 (.18) W=12. (.472) K =2.7 (.16) K 1 =2.3 (.91) A =6. (.26) User Direction of Feed P=8. (.3) Embossed Carrier Dimensions mm (inches) Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS--R2 Copyright 214, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 11/1/214