CE.pdf Mar.28,2
NX Series Line Up Function Example Product Detail!Caution/Notice Soldering and Mounting Packaging Design Kits 88 88 9 95 97 2 22 CE.pdf Mar.28,2
NX Series Line Up / Function Example Type Part Number Thickness (mm) Rated Voltage Effective Frequency Range Rated Current p9 NX22-. Vdc MHz to GHz:5d min. A SMD Type NX2-. Vdc MHz to GHz:5d min. 5A for Power Lines NX24H.5 Vdc khz to GHz:5d min. 5A NX25H.5 25Vdc khz to GHz:5d min. 5A p9 NX2-8. Vdc MHz to GHz:4d min. A Lead Type NX- 8. Vdc 5MHz to GHz:4d min. A for Power Lines NX5-8.5 Vdc MHz to GHz:4d min. 5A Lead Type p94 NX2-8. Vdc MHz to GHz:4d min. 5A Low Profile for Power Lines NX6-8. 25Vdc khz to GHz:4d min. 5A Noise Suppression of Radiation Noise from Power Line Cable Antenna Test oard DC-DC Converter 7 AC Adaptor ACV ctest Result NX2 2Vdc Cable Without Filter IN 2V µf Power Circuit (SW) 7 Power lock OUT 5V Clock Drive (MHz) Digital lock With NX2-6 6 Level (duv/m) 4 2 2 4 6 8 Frequency (MHz) Level (duv/m) 4 2 2 4 6 8 Frequency (MHz) CE.pdf Mar.28,2 88
NX Function Example Impulse Noise Countermeasure Impulse Noise Generator: INS-442 (4kV, nsec) + C 6d (4d+2d) ATT Oscilloscope: TDS7254 NX cwithout Filter 4kV Applied Impulse Voltage: 4kV/nS Y-AXIS: kv/div cwith Filter NX2- NX2- NX22- ESD Countermeasure ESD Waveform Comparison 4 Wave Voltage (V) 2 Initial with NX22- - - 2 4 6 7 8 9 2 4 6 7 8 9 2 Time (nsec) CE.pdf Mar.28,2 89
EMI Suppression Effect NX Series Suppression of Ripple Noise of DC Side in the Switching Power Supply Test Circuit NX2- Switching Power Supply +5V Type of Filter EMI Suppression Effect / Description There is high frequency noise of.5v maximum. Without Filter +5.V µs/div.2v/div NX2- can suppress most of noise. When NX2- is used +5.V µs/div.2v/div Example of Impulse Noise Suppression Type of Filter Without Filter EMI Suppression Effect Impulse Noise 2V/ns Y-axis: V/div X-axis: ns/sec When NX2 is used Y-axis: V/div X-axis: ns/sec CE.pdf Mar.28,2 9
NX Series Power Lines Type NX2p NX2pSeries SMD package of block type EMIFILr. NX22/NX2 Dimensions 9.±.2 2.±.2 () (2) () NX2p* (4) 4.2±. (2.45).±.2.±..±. * Part Number NX22- NX2-.±.2.6±. Appearance NX22 NX2 () () (4) (2) (4) 7.±.2.55±.2 ().±..5±.2 () (4) 2.5±.2.55±.2 (4) (2) : Electrode (in mm) Equivalent Circuit L L C2 () C (2) L2 Packaging C () (4) ()-(4): Terminal Number : Power Supply Ground : Circuit Ground C: Circuit+ Code Packaging Minimum Quantity L 8mm Reel Embossed Tape 4 K mm Reel Embossed Tape ulk(ag) NX24H/NX25H Rated Value (p: packaging code) Insertion Loss Characteristics NX22/2 Dimensions Part Number Rated Voltage Withstand Voltage Rated Current Insulation Resistance (min.) NX24H Equivalent Circuit Packaging Refer to pages from p.97 to p.2 for mounting information. Insertion Loss (2 to 25 degrees C line impedance= ohm) NX22-p Vdc 25Vdc A M ohm MHz to GHz:5d min. NX2-p Vdc 2Vdc 5A M ohm MHz to GHz:5d min. NX24Hp Vdc 25Vdc 5A M ohm khz to GHz:5d min. NX25Hp 25Vdc 62.5Vdc 5A M ohm khz to GHz:5d min. Operating Temperature Range: -4 C to +25 C (NX22/NX2), -55 C to +25 C (NX24H/NX25H) 2.±.2 () (2) 9.±.2 () NX2p* (4) 4.2±. (2.45).5±.2 * Part Number NX24H NX25H Appearance NX24 NX25 () () (4) (2) (4) 7.±.2.55±.2.±..±..±..5±.2.±.2 () (4) () 2.5±.2.55±.2 (4) (2).6±. : Electrode (in mm) L L C2 () C (2) L2 C () (4) ()-(4): Terminal Number : Power Supply Ground : Circuit Ground C: Circuit+ Code Packaging Minimum Quantity L 8mm Reel Embossed Tape 4 K mm Reel Embossed Tape ulk(ag) Insertion Loss (d) 2 4 6 NX22- NX2- Insertion Loss (d) 2 4 6 7 Power Lines Type 8 8 9. Frequency (MHz).. Frequency (MHz) Continued on the following page. CE.pdf Mar.28,2 9
NX Series Power Lines Type NX2p Series NX2p Insertion Loss Characteristics NX25H Insertion Loss (d) 2 4 6 7 8 9.. Frequency (MHz) Notice (Rating) In operating temperatures exceeding +85 C, derating of current is necessary for NX22 series. Please apply the derating curve shown in chart according to the operating temperature. In operating temperatures exceeding +85 C, derating of current is necessary for NX2 series. Please apply the derating curve shown in chart according to the operating temperature. Derating Derating 5 Derated Current (A) Derated Current (A) -4 85 25 Operating Temperature ( C) In operating temperatures exceeding +85 C, derating of current is necessary for NX24H/25H series. Please apply the derating curve shown in chart according to the operating temperature. -4 85 25 Operating Temperature ( C) Derating 5 Power Lines Type Derated Current (A) -4 85 25 Operating Temperature ( C) CE.pdf Mar.28,2 92
NX Series Power Lines Type NXp NXpSeries Large insertion loss from several hundred khz to several GHz. NX2/NX Dimensions.5±. 2.±.5 ø.8.8 ±. 7.5±.2 2.5±.2 max. 8 max. 5.±.5.±.5 ø.8 ø.8.6 ±. 2.5±.2 2.5±.2 Equivalent Circuit L L C2 () C (2) L2 C () (4) ()-(4): Terminal Number : Power Supply Ground : Circuit Ground C: Circuit+ C : Power supply ground : Load circuit ground C: Load circuit + ias Packaging Code Packaging Minimum Quantity (in mm) - ox NX5 Dimensions 2.±.5.±.5 Equivalent Circuit L L C2 () C (2).5±. ø..8 ±..5 max. 8.5 max. 5.±.5 ø. ø..6 ±. 2.5±.2 2.5±.2 L2 C () (4) ()-(4): Terminal Number : Power Supply Ground : Circuit Ground C: Circuit+ 7.5±.2 2.5±.2 Rated Value Part Number Rated Voltage Withstand Voltage Rated Current Insertion Loss Characteristics : Power supply ground : Load circuit ground C: Load circuit + ias Insulation Resistance (min.) Packaging Code Packaging Minimum Quantity - ox Refer to pages from p.97 to p.2 for mounting information. Insertion Loss (2 to 25 degrees C line impedance= ohm) NX2- Vdc 25Vdc A M ohm MHz to GHz:4d min. NX- Vdc 75Vdc A M ohm 5MHz to GHz:4d min. NX5- Vdc 25Vdc 5A M ohm MHz to GHz:4d min. Operating Temperature Range: - C to +85 C (Ω - Ω) C (in mm) NX- 2 Insertion Loss (d) 4 6 8 NX2- (NX5-) Power Lines Type... Frequency (MHz) CE.pdf Mar.28,2 9
NX Series Power Lines Type NXp NXpSeries Low profile version of NX series. Dimensions.2±.5.8 ±. *** : 2/6 2.±.2 NX*** 7.5±.2.8 ±. 8.±.5 4.±.5 2.±.5 2.5±.2 ø.8 ±..±.2 ø.8 ±..6 ±. 2.5±.2 Equivalent Circuit L L C2 () C (2) L2 C () (4) ()-(4): Terminal Number : Power Supply Ground : Circuit Ground C: Circuit+ C : Power supply ground : Load circuit ground C: Load circuit + ias Packaging Code Packaging Minimum Quantity (in mm) - ox Rated Value Part Number Rated Voltage Withstand Voltage Rated Current Insertion Loss Characteristics Insulation Resistance (min.) Notice (Rating) In operating temperatures exceeding +85 C, derating of current is necessary for NXp series. Please apply the derating curve shown in chart according to the operating temperature. Refer to pages from p.97 to p.2 for mounting information. Insertion Loss (2 to 25 degrees C line impedance= ohm) NX2- Vdc 25Vdc 5A M ohm MHz to GHz:4d min. NX6-25Vdc 62.5Vdc 5A M ohm khz to GHz:4d min. Operating Temperature Range: -4 C to +25 C Insertion Loss (d) 2 4 6 8 NX2- NX6- (Ω - Ω)... Frequency (MHz) Derating Derated Current [A] 5 5-4 85 2.5 2 25 Operating Temperature [ C] Power Lines Type " Connecting ± power line In case of using ± power line, please connect to each terminal as shown. Power Supply (NX Input) Power Supply +ias Power Supply Ground Power Supply -ias Power Supply Ground NX C C Circuit (NX Output) Load Circuit +ias Load Circuit Ground Load Circuit -ias Load Circuit Ground CE.pdf Mar.28,2 94
SMD Type!Caution/Notice!Caution Rating Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. Notice Storage and Operating Conditions <Operating Environment> Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Do not use products in the environment close to the organic solvent. <Storage and Handling Requirements>. Storage Period NX series should be used within 2 months. Solderability should be checked if this period is exceeded. 2. Storage Conditions () Storage temperature: - to +4 C Relative humidity: 5 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Notice (Soldering and Mounting). Cleaning Do not clean NX series (SMD Type). efore cleaning, please contact Murata engineering. 2. Soldering Reliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in mounting information.. Other Noise suppression levels resulting from Murata's EMI suppression filters EMIFILr may vary, depending on the circuits and ICs used, type of noise, mounting pattern, mounting location, and other operating conditions. e sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a commercialpurpose equipment design. Handling. Resin Coating Using resin for coating/molding products may affect the products performance. So please pay careful attention in selecting resin. Prior to use, please make the reliability evaluation with the product mounted in your application set. 2. Handling of a Substrate (for NX2p) After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the Product. ending Twisting!Caution/ Notice CE.pdf Mar.28,2 95
Lead Type!Caution/Notice!Caution Rating Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. Notice Storage and Operating Conditions <Operating Environment>. Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. 2. Do not use products near water, oil or organic solvents. <Storage and Handling Requirements>. Storage Period NX Series should be used within 2 months. Solderability should be checked if this period is exceeded. 2. Storage Conditions () Storage temperature: - to +4 C Relative humidity: 5 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Notice (Soldering and Mounting). Cleaning Failure and degradation of a product are caused by the cleaning method. When you clean in conditions that are not in mounting information, please contact Murata engineering. 2. Soldering Reliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in mounting information.. Other Noise suppression levels resulting from Murata's EMI suppression filters "EMIFIL" may vary, depending on the circuits and ICs used, type of noise, mounting pattern, lead wire length, mounting location, and other operating conditions. e sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a commercial-purpose equipment design.!caution/ Notice CE.pdf Mar.28,2 96
NX SMD Type Soldering and Mounting. Standard Land Pattern Dimensions NX22 NX2 NX24 NX25 2.5.2 9.9 9.6 7. 6.2 5. 2.8 2..8 5.8..2.7 C 7.5 Land Pattern + Solder Resist Land Pattern Solder Resist (in mm) () A double-sided print board (or multilayer board) as shown in the left figure is designed, and please apply a soldering Cu electrode with a product electrode to a "Land Pattern", apply resist to a "Land Pattern + Solder Resist" at Cu electrode. (2) This product has large rated current of A/5A. Please consider real current and make Cu electrode thick enough. (Please design line resistance suitable for real current) () Please drop on a ground electrode on the back layer (the same also in a multilayer case) by the through hole. And a surface grand electrode layer may also take a large area as much as possible. (4) It is recommended to use a double-sided printed circuit board with NX mounting on one side and the ground pattern on the other in order to maximize filtering performance, multiple feed through holes are required to maximize the NX's connection to ground. (5) The ground pattern should be designed to be as large as possible to achieve maximum filtering performance. o PC Warping (for NX2p) PC should be designed so that products are not subjected to the mechanical stress caused by warping the board. Products should be located in the sideways direction (Length: a<b) to the mechanical stress. a b 2. Solder Paste Printing and Adhesive Application When reflow soldering the block type EMIFILr, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will be prone to Poor example Good example damage by mechanical and thermal stress from the PC and may crack. Standard land dimensions should be used for resist and copper foil patterns. Series Solder Paste Printing Adhesive Application NX22 NX2 NX24 NX25 oguideline of solder paste thickness: -2µm 2.5.2 9.6 7. 5. 2.8 2. Soldering and Mounting C.8 5.8..7 7.5 CE.pdf Mar.28,2 97
NX SMD Type Soldering and Mounting. Standard Soldering Conditions () Soldering Methods Use reflow soldering methods only. Use standard soldering conditions when soldering block type EMIFILr SMD type. In cases where several different parts are soldered, each having different soldering conditions, use those conditions requiring the least heat and minimum time. Flux: o Use Rosin-based flux. In case of using RA type solder, products should be cleaned completely with no residual flux. o Do not use strong acidic flux (with chlorine content exceeding.2wt%) o Do not use water-soluble flux. Solder: Use Sn-.Ag-.5Cu solder. Use of Sn-Zn based solder will deteriorate performance of products. For additional mounting methods, please contact Murata. (2) Soldering Profile oreflow Soldering Profile (Sn-.Ag-.5Cu solder) Temperature ( C) 8 T2 T Pre-heating t t2 T4 T Limit Profile Standard Profile Series Standard Profile Heating Peak Cycle Heating Temperature Temp. (T) Time. (t) (T2) of Reflow Temp. (T) Time. (t2) NX22/2/24/25 22 C min. to 6s 2± C 2 times max. Limit Profile Peak Temperature (T4) 2 C min. 6s max. 26 C/s Cycle of Reflow 2 times max. 4. Cleaning Soldering and Mounting 9s±s Time (s) () Reworking with Solder Iron The following conditions must be strictly followed when using a soldering iron. Pre-heating: C 6s min. Soldering iron power output: W max. Temperature of soldering iron tip / Soldering time / Times: 4 C max. / 5s max. / time Do not allow the tip of the soldering iron to directly contact the chip. For additional methods of reworking with a soldering iron, please contact Murata engineering. Do not clean NX22/2/24/25 series. In case of cleaning, please contact Murata engineering. CE.pdf Mar.28,2 98
NX Lead Type Soldering and Mounting. Mounting Hole Mounting holes should be designed as specified below. NXp/p Component Side ø.2 () () () () () (C) 2.5±. 5.±. 7.5±. 2.5±. 2.5±. Terminal Layout (ottom figure) C : Power supply ground : Load circuit ground C: Load circuit + ias 2. Using the (Lead Type) Effectively () How to use effectively This product effectively prevents undesired radiation and external noise from going out / entering the circuit by grounding the high frequency components which cause noise problems. Therefore, grounding conditions may affect the performance of the filter and attention should be paid to the following for effective use. (a) Design maximized grounding area in the P.C. board, and grounding pattern for all the grounding terminals of the product to be connected. (Please follow the specified recommendations.) (b) Minimize the distance between ground of the P.C. board and the ground plate of the product. (Recommend unsing the through hole connection between grounding area both of component side and bottom side.) (c) Insert the terminals into the holes on P.C. board completely. (d) Don't connect terminal with terminal directly. (See the item. Terminal Layout) (2) Self-heating Though this product has a large rated current, localized selfheating may be caused depending on soldering conditions. To avoid this, attention should be paid to the following: (a) Use P.C. board with our recommendation on hole diameter / land pattern dimensions, mentioned in the right hand drawing, especially for 4 terminals which pass current. (b) Solder the terminals to the P.C. board with soldercover area at least 9%. Otherwise, excess selfheating at connection between terminals and P.C. board may lead to smoke and / or fire of the product even when operating at rated current. (c) After installing this product in your product, please make sure the self-heating is within the rated current recommended. P. C. oard Patterns Use a bilateral P.C. board. Insert the NX into the P.C.board until the root of the terminal is secured, then solder. () Component Side View (2) ottom View C C Recommended Land Pattern C 2.5.2.2 5..2 7.5 Shield plate Copper foil pattern Through holes ø.2 2.5 2.5 (in mm) Copper foil pattern Soldering and Mounting CE.pdf Mar.28,2 99
NX Lead Type Soldering and Mounting. Soldering () Use Sn-.Ag-.5Cu solder. (2) Use Rosin-based flux. Do not use strong acidic flux with halide content exceeding.2wt% (chlorine conversion value). () Products and the leads should not be subjected to any mechanical stress during the soldering process, or while subjected to the equivalent high temperatures. (4) Standard flow soldering profile Temperature ( C) 2 2 Pre-heating C 6s min. Gradual cooling Soldering (in air) Soldering temperature Solder Soldering Temperature Soldering Time Sn-.Ag-.5Cu solder 2 to 26 C 4 to 6s 4. Cleaning Clean the block Type EMIFILr(Lead Type) in the following conditions. () Cleaning temperature should be limited to 6 C max. (4 C max for alcohol type cleaner). (2) Ultrasonic cleaning should comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.. Power: 2W/liter max. Frequency: 28 to 4kHz Time: 5 min. max. () Cleaner (a) Alcohol type cleaner Isopropyl alcohol (IPA) (b) Aqueous agent Pine Alpha ST-S (4) There should be no residual flux or residual cleaner left after cleaning. In the case of using aqueous agent, products should be dried completely after rinsing with de-ionized water in order to remove the cleaner. (5) The surface of products may become dirty after cleaning, but there is no deterioration on mechanical, electrical characteristics and reliability. (6) Other cleaning: Please contact us. Soldering and Mounting Soldering Time CE.pdf Mar.28,2 2
NX SMD Type Packaging Minimum Quantity and Dimensions of 24mm Width Embossed Tape 4.±. 2.±. 4.xpitch=4.±.2 2.±. ø.5 +. -.75±..5±. a: 2.4±. 24.±.2 c:.±. c: Depth of Cavity max..±. ø.5 +.5 -.±. b: 9.4±. Dimension of the cavity is measured at the bottom side. Part Number NX22/2 Cavity Size a b c 2.4 9.4. Minimum Qty. (pcs.) ø8mm Reel ømm Reel 4 ulk 4.±. 2.±. 4.xpitch=4.±.2 (in mm) 2.±. ø.5 +. -.75±. c:.6±. b: 9.4±..6±. Dimension of the cavity is measured at the bottom side. ø.5 +.5 - Part Number NX24/25.5±. a: 2.4±. 24.±.2.±. Cavity Size Minimum Qty. (pcs.) a b c ø8mm reel ømm reel 2.4 9.4.6 4 ulk "Minimum Quantity" means the number of units of each delivery or order. The quantity should be an integral multiple of the "Minimum Quantity". CE.pdf Mar.28,2 2 Packaging
NX Design Kits Design Kits oekepnxa No. 2 4 5 6 7 8 oekeplcka No. 2 4 5 6 7 8 9 Part Number NX2- NX2- NX6- NX2H NX22- NX2- NX24H NX25H Part Number NX2- NX- NX5- NX2- NX6- NX2H NP2-2 NX22- NX2- NX24H NX25H Quantity (pcs.) Quantity (pcs.) Insertion Loss MHz to GHz : 4d min. MHz to GHz : 4d min. khz to GHz : 4d min. MHz to GHz : 4d min. MHz to GHz : 5d min. MHz to GHz : 5d min. khz to GHz : 5d min. khz to GHz : 5d min. Insertion Loss MHz to GHz : 4d min. 5MHz to GHz : 4d min. MHz to GHz : 4d min. MHz to GHz : 4d min. khz to GHz : 4d min. MHz to GHz : 4d min. 2MHz to MHz : 4d min. MHz to GHz : 5d min. MHz to GHz : 5d min. khz to GHz : 5d min. khz to GHz : 5d min. Rated Voltage (Vdc) 25 25 Rated Voltage (Vdc) 25 25 Rated Current (A) 5 5 5 5 5 5 Rated Current (A) 5 5 5 5 5 5 5 CE.pdf Mar.28,2 22