Overview. Benefits. Applications

KC-LINK for Fast Switching Semiconductor Applications DC Link, Snubber, Resonator Capacitor, 150 C (Commercial & Automotive Grade) Overview KEMET's KC-LINK surface mount capacitors are designed to meet the growing demand for fast switching wide bandgap (WBG) semiconductors that operate at higher voltages, temperatures, and frequencies. By utilizing KEMET's robust and proprietary C0G/NPO base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators, where high efficiency is a primary concern. With extremely low effective series resistance (ESR) and very low thermal resistance, KC-LINK capacitors can operate at very high ripple currents with no change in capacitance versus DC voltage, and negligible change in capacitance versus temperature. With an operating temperature of 150 C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. KC-LINK C0G dielectric technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of lead frames. This provides extremely low effective series inductance (ESL) increasing the operating frequency range allowing for further miniaturization. In addition to commercial grade, automotive grade devices are available and meet the demanding Automotive Electronics Council s AEC Q200 qualification requirements. Benefits AEC-Q200 automotive qualified Very high ripple current capability Extremely low equivalent series resistance (ESR) Extremely low equivalent series inductance (ESL) Operating temperature range of 55 C to +150 C High frequency operation (> 10 MHz) No capacitance shift with voltage No piezoelectric noise High thermal stability RoHS and Pb-free Applications Wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems EV/HEV (drive systems, charging) Wireless charging Photovoltaic systems Power converters Inverters LLC resonant converters DC link Snubber One world. One KEMET KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 1

Typical Performance - 3640, 220 nf, 500 V Frequency 50 khz Typical ESR at 25 C Typical ESL at 25 C Operating Voltage = 0 V Typical Ripple Current (A rms ) 1 Operating Voltage = 400 V R Θ 2 T a = 105 C T a = 125 C T a = 105 C T a = 125 C 20.6 15.4 8.6 8.6 100 khz 19.3 14.4 17.1 14.4 < 4.0 mω 1 nh 15 C/W 200 khz 17.9 13.4 17.9 13.4 300 khz 17.2 12.8 17.2 12.8 1 T a = Ambient temperature during ripple current measurements. Ripple current measurements performed with a peak capacitor temperature of 150 C. Samples mounted to heat sink with no forced air cooling. 2 R Θ = Thermal resistance of KC-LINK 3640 224 nf 500 V capacitor. Ripple Current (A rms ) KC-LINK Ripple Current Operating Voltage: 0 VDC 25 20 15 10 5 0 0 50 100 150 200 250 300 350 Frequency (khz) I rms at T a = 105 C I rms at T a = 125 C Ripple Current (A rms ) KC-LINK Ripple Current Operating Voltage: 400 VDC 25 20 15 10 5 0 0 50 100 150 200 250 300 350 Frequency (khz) I rms at T a = 105 C I rms at T a = 125 C 100.00 Impedance 1.00 ESR Impedance (Ohms) 10.00 1.00 0.10 0.01 Z (Ohms) ESR (Ohms) 0.10 0.01 ESR (Ohms) 0.00 10 100 1,000 10,000 100,000 Frequency (khz) 0.00 10 100 1,000 10,000 100,000 Frequency (khz) 10 Capacitance Change vs. Temperature 10 Capacitance Change vs. DC Voltage Capacitance change (%) 5 0 5 Capacitance change (%) 5 0 5 10 55 35 15 5 25 45 65 85 105 125 145 Temperature ( C) 10 0 100 200 300 400 500 DC Voltage (V) KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 2

Electrical Parameters/Characteristics Item Operating temperature range Capacitance change with reference to +25 C and 0 VDC applied (TCC) Aging rate (maximum % capacitance loss/decade hour) 0% 55 C to +150 C ±30 PPM/ C Parameters/Characteristics 1 Dielectric Withstanding Voltage (DWV) 750 VDC 2 Dissipation Factor (DF) Maximum Limit at 25 C 0.1% 3 Insulation Resistance (IR) Minimum Limit at 25 C 1,000 - MΩ - µf or 100 GΩ (500 VDC applied for 120 ±5 seconds at 25 C) 1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor. 2 Capacitance and dissipation factor (DF) measured under the following conditions: 1 MHz ±100 khz and 1.0 ±0.2 V rms if capacitance 1,000 pf 1 khz ±50 Hz and 1.0 ±0.2 V rms if capacitance > 1,000 pf 3 To obtain IR limit, divide MΩ - µf value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Ordering Information CKC 33 C 224 K C G A C TU Series CKC = KC-LINK Case Size (L"x W") Specification/ Series Capacitance Code (pf) 33 = 3640 C = Standard Two single digits and number of zeros. Use 9 for 1.0 9.9 pf e.g., 2.2 pf = 229 Capacitance Tolerance F = ±1% G = ±2% J = ±5% K = ±10% Rated Voltage (V) Dielectric Subclass Designation Termination Finish Packaging (Suffix/C-Spec) C = 500 V G = C0G A = N/A C = 100% matte Sn See "Packaging C-Spec Ordering Options Table" below KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 3

Packaging C-Spec Ordering Options Table Packaging Type Commercial Grade Packaging/Grade Ordering Code (C-Spec) 7" Reel/Unmarked TU 13" Reel (Embossed Plastic Tape)/ Unmarked 7210 Automotive Grade 1 7" Reel AUTO 13" Reel (Embossed Plastic Tape)/ Unmarked AUTO7210 1 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information." Dimensions Millimeters (Inches) W L T B S EIA Size Code Metric Size Code 3640 9210 L Length 9.30 (0.366) ±0.60 (0.024) W Width 10.20 (0.402) ±0.40 (0.016) T Thickness 2.5 (0.098) ±0.2 (0.008) B Bandwidth 1.27 (0.050) ±0.40 (0.016) S Separation Minimum N/A Mounting Technique Solder Reflow Only Environmental Compliance Lead (Pb)-free, RoHS, and REACH compliant without exemptions. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 4

Table 1 Product Ordering Codes & Ratings Capacitance Capacitance Code Case Size 3640 Voltage Code Rated Voltage (VDC) Capacitance Tolerance 220 nf 224 F G J K C 500 Table 2 Performance & Reliability: Test Methods and Conditions (Commercial Only) Stress Reference Test or Inspection Method Terminal Strength JIS-C-6429 Appendix 1, Note: force of 1.8kg for 60 seconds. Board Flex JIS-C-6429 Appendix 2, Note: 3.0 mm (minimum). Magnification 50X. Conditions: Solderability Temperature Cycling Biased Humidity High Temperature Life Storage Life Vibration Mechanical Shock Resistance to Solvents J-STD-002 JESD22 Method JA-104 MIL-STD-202 Method 103 MIL-STD-202 Method 108/EIA-198 MIL-STD-202 Method 108 MIL-STD-202 Method 204 MIL-STD-202 Method 213 MIL-STD-202 Method 215 a) Method B, 4 hours at 155 C, dry heat at 235 C b) Method B at 215 C, category 3 c) Method D at 260 C, category 3 1,000 cycles ( 55 C to +125 C), measurement at 24 hours ±4 hours after test conclusion. Load humidity: 1,000 hours 85 C/85% RH and 200 VDC maximum. Add 100 K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. Low volt humidity: 1,000 hours 85C /85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours ±4 hours after test conclusion. 1,000 hours at 150 C with 1.0 X rated voltage applied. 150 C, 0 VDC, for 1,000 hours. 5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 2,000 Hz. Figure 1 of Method 213, condition F. Add aqueous wash chemical, OKEM Clean or equivalent. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 5

Automotive C-Spec Information The KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC Q200, Stress Test Qualification for Passive Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process warrant (PPAP). Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, AUTO. This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are not granted the same privileges as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited (see details below.) Product Change Notification (PCN) The KEMET Product Change Notification system is used to communicate primarily the following types of changes: Product/process changes that affect product form, fit, function, and/or reliability Changes in manufacturing site Product obsolescence KEMET Automotive C-Spec Customer Notification Due To: Process/Product change Obsolescence* Days Prior To Implementation KEMET assigned 1 Yes (with approval and sign off) Yes 180 days minimum AUTO Yes (without approval) Yes 90 days minimum 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Production Part Approval Process (PPAP) The purpose of the Production Part Approval Process is: To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts. To provide the evidence that all customer engineering design records and specification requirements are properly understood and fulfilled by the manufacturing organization. To demonstrate that the established manufacturing process has the potential to produce the part. KEMET Automotive C-Spec PPAP (Product Part Approval Process) Level 1 2 3 4 5 KEMET assigned 1 AUTO 1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET. Part number specific PPAP available Product family PPAP only KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 6

Table 3 Chip Capacitor Land Pattern Design Recommendations per IPC 7351 EIA Size Code Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 3640 9210 4.45 1.70 10.70 11.60 11.70 4.35 1.50 10.60 10.70 11.10 4.25 1.30 10.50 10.00 10.80 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC 7351). Image below based on Density Level B for an EIA 1210 case size. Y V1 Y X X V2 C C Grid Placement Courtyard KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 7

Soldering Process Recommended Reflow Soldering Profile KEMET s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J STD 020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Profile Feature Termination Finish 100% matte Sn T P Maximum Ramp Up Rate = 3 C/second Maximum Ramp Down Rate = 6 C/second t P Preheat/Soak Temperature Minimum (T Smin ) 150 C Temperature Maximum (T Smax ) 200 C Time (t S ) from T Smin to T Smax 60 120 seconds Temperature T L T smax T smin t s t L Ramp-Up Rate (T L to T P ) 3 C/second maximum Liquidous Temperature (T L ) 217 C Time Above Liquidous (t L ) 60 150 seconds 25 25 C to Peak Time Peak Temperature (T P ) 260 C Time Within 5 C of Maximum Peak Temperature (t P ) Ramp-Down Rate (T P to T L ) 30 seconds maximum 6 C/second maximum Time 25 C to Peak Temperature 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40 C and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years upon receipt. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 8

Construction Termination Finish (100% matte Sn) Barrier Layer (Ni) End Termination/ External Electrode (Cu) Dielectric Material (CaZrO 3 ) Detailed Cross Section Dielectric Material (CaZrO 3 ) Inner Electrodes (Ni) End Termination/ External Electrode (Cu) Barrier Layer (Ni) Termination Finish (100% matte Sn) Inner Electrodes (Ni) KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 9

Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar code label Anti-static reel KEMET Embossed plastic* or punched paper carrier. Chip and KPS orientation in pocket (except 1825 commercial, and 1825 and 2225 Military) Sprocket holes Embossment or punched cavity 178 mm (7.00") or 330 mm (13.00") 8 mm, 12 mm or 16 mm carrier tape Anti-static cover tape (0.10 mm (0.004") maximum thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 3 Carrier Tape Configuration, Embossed Plastic (mm) EIA Case Size Tape Size (W)* Embossed Plastic 7" Reel 13" Reel Pitch (P 1 )* 3640 24 16 16 *Refer to Figure 1 for W and P 1 carrier tape reference locations. *Refer to Tables 4 and 5 for tolerance specifications. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 10

Figure 1 Embossed (Plastic) Carrier Tape Dimensions T T 2 ØD 0 P 2 P 0 (10 pitches cumulative tolerance on tape ±0.2 mm) E 1 A 0 F K 0 W B 1 B 0 E 2 S 1 P 1 T 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B 0. Center Lines of Cavity User Direction of Unreeling ØD 1 Embossment For cavity size, see Note 1 Table 4 Table 4 Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions Millimeters (Inches) Tape Size D 0 E 1 P 0 P 2 24 mm Tape Size 1.5 +0.10/ 0.0 (0.059 +0.004/ 0.0) Pitch 24 mm 16 mm 1.75 ±0.10 (0.069 ±0.004) E 2 Minimum 22.25 (0.875) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.10 (0.078 ±0.003) R Reference Note 2 30 (1.181) Variable Dimensions Millimeters (Inches) T F P 2 1 Maximum 11.5 ±0.10 16.0 ±0.10 3 (0.452 ±0.003) (0.629 ±0.004) (0.118) S 1 Minimum Note 3 5 (0.196) W Maximum 24.3 (0.956) T Maximum 0.250 (0.009) A 0,B 0 & K 0 T1 Maximum 0.350 (0.013) 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A 0, B 0 and K 0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4) (e) For KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 11

Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) 24 mm 0.1 to 1.6 Newton (10 to 160 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 Maximum Component Rotation Bo T Ao Maximum Component Rotation Top View Typical Pocket Centerline Maximum Component Rotation Side View Tape Maximum s Width (mm) Rotation ( T) 8,12 20 16 200 10 Tape Maximum Width (mm) Rotation ( 8,12 20 Typical Component Centerline 16 56 10 72 200 5 S) Figure 3 Maximum Lateral Movement Figure 4 Bending Radius 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape 1.0 mm maximum 1.0 mm maximum Embossed Carrier Punched Carrier R Bending Radius R KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 12

Figure 5 Reel Dimensions Full Radius, See Note Access Hole at Slot Location (Ø 40 mm minimum) W 3 (Includes flange distortion at outer edge) W 2 (Measured at hub) A D (See Note) B (see Note) Note: Drive spokes optional; if used, dimensions B and D shall apply. C (Arbor hole diameter) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth W 1 N (Measured at hub) Table 5 Reel Dimensions Metric will govern Constant Dimensions Millimeters (Inches) Tape Size A B Minimum C D Minimum 24 mm 1.2 13.0 ±0.2 (0.047) (0.521 ±0.008) Variable Dimensions Millimeters (Inches) Tape Size N Minimum W 1 W 2 Maximum W 3 24 mm 25 +1.0/ 0.0 (0.984 +0.039/ 0.0) 27.4 ±1.0 (1.078 ±0.039) 21 (0.826) KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 13

Figure 6 Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 12 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum Top Cover Tape Components 100 mm minimum leader 400 mm minimum Figure 7 Maximum Camber Elongated Sprocket Holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 14

KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the Information ) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation s ( KEMET ) knowledge of typical operating conditions for such applications, but are not intended to constitute and KEMET specifically disclaims any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 864-963-6300 www.kemet.com C1039_KC-LINK_C0G 4/6/2018 15