Company Presentation Heicks Industrieelektronik GmbH 1
Company Presentation Company In 1986 Dipl.-Ing. Rudolf Heicks founded his company. His object was to design and produce electronic devices for gardening purposes. In the course of the years the site grew constantly and in 2005 the company moved to the current location in Geseke with a total area of ca. 5200 m². 2
Company Presentation Services Circuit unbundling and layout Complete material procurement SMD & THT assembly Manually soldering Mechanically soldering of assembly groups Wave soldering Selektiv soldering / nitrogen atmosphere SMT-soldering / nitrogen atmosphere 3
Company Presentation Services Fitting of assemblies to complete devices Testing of electronic assemblies with AOI or ICT Coating of assemblies Potting of assemblies Parylene coating of assemblies Makeup of test devices and test systems Construction of harnesses for test devices Partial removal of gold surface Partial removal of solder resist 4
Equipment Fitting machines JUKI FX-3L Samsung CP 40 (5 pieces) JUKI KE 2080L 5
Equipment Soldering facilities Selektiv soldering system (2x) ERSA Ecoselect 350 Possibility to solder lead-free and leaded Reflow soldering system SMT Quattro Peak L N 2 Wave soldering system ERSA POWERFLOW e N 2 6
Equipment Testing equipment ICT - Tester FKT - Tester 3D-AOI System High-End-Flying-Probe 7
Equipment Painting line paint shop Elite Coating DR-070 DIMA Group BV Elite Coater incl. inlet belt and outlet belt 8
Product portfolio PCB configuration LED control electronics development and production 9
Product portfolio PCB configuration Power supply for aerospace equipment 10
Product portfolio Test devices for garages Doppler-simulator for testing of lane change assistant in vehicles 11
Product portfolio Manufacturing of complex systems Boeing 787 Flight Deck lighting control unit 12
Product portfolio Construction of harnesses Wiring harness for testing purposes in the automotive industry 13
Product portfolio Systems with mechanic, electric and electronic components Test device for automotive industry 14
Product portfolio UAV (Un-manned aerial vehicle) Electronic manufacturing for UAVs (remote controlled drone) 15
Contractual services Parylene coating Example of application Assembly group coated with parylene 16
Contractual services Parylene coating Example of application (1) HIMA Paul Hildebrandt GmbH + Co KG PCBs HIMA Paul Hildebrandt GmbH + Co KG 17
Contractual services Parylene coating Example of application (2) 3-D MID (Molded Interconnect Devices) Demonstrator Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.v. FAPS Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik 18
Lohndienstleistungen Parylene coating Example of application (3) 3-D MID (Molded Interconnect Devices) Demonstrator Aluminium injection molded part with electronic components fitted in the form of a light bulb, including Parylene Coating 19
Contractual services Cleaning of assembly groups Aqueous cleaning services HFE-process as cleaning service 20
Contractual services Partial removal of solder resist Solder resist has been remove partially from trace Trace with green solder resist 21
Contractual services Degolding of PCBs Gold plated traces Gold layer has been removed partially Gold layer has been removed partially 22
Lohndienstleistungen Parylene coating Partial removal of solder resist Manual Protection with special protective masks Manually removing of the protective mask after parylene coating Unmask of coated areas with a special laser 23
Thanks for your attention! Heicks Industrieelektronik GmbH Am Schwarzen Weg 25 31 D 59590 Geseke Tel. +49 29 42 / 9 79 26 0 Fax +49 29 42 / 9 79 26 150 info@heicks.de www.heicks.de Stand 016 EN 24