November 2011 Rev FEATURES. Fig. 1: SP2526A Application Diagram Two Port Self Powered Hub

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November 2011 Rev. 2.1.0 GENERAL DESCRIPTION The SP2526A device is a dual +3.0V to +5.5V USB Supervisory Power Control Switch ideal for self-powered and bus-powered Universal Serial Bus (USB) applications. Each switch has low on-resistance (110mΩ typical) and can supply 500mA minimum. The fault currents are limited to 1.0A typical and the flag output pin for each switch is available to indicate fault conditions to the USB controller. The thermal shutdown feature will prevent damage to the device when subjected to excessive current loads. The undervoltage lockout feature will ensure that the device will remain off unless there is a valid input voltage present. The SP2526A is offered in a RoHS compliant green /halogen free 8-pin NSOIC package. APPLICATIONS Self Powered USB 2.0 and 3.0 Hubs USB Compliant V BUS Power Distribution Audio-Video Equipments Generic Power Switching FEATURES +3.0V to +5.5V Input Voltage Range Two Independent Power Switches Two Error Flag Outputs, Open Drain 2.6V Undervoltage Lockout 1.25A Short Circuit Current Limit 150mΩ Maximum On-Resistance 110μA On-State Supply Current 1μA Shutdown Current Output can be Forced Higher than Input (Off-State) Thermal Shutdown 1ms Soft Start Power Up, Fast Turn Off Active-high Version: SP2526A-1 Active-low Version: SP2526A-2 RoHS Compliant, Green/Halogen Free 8-Pin NSOIC Package TYPICAL APPLICATION DIAGRAM Fig. 1: SP2526A Application Diagram Two Port Self Powered Hub Exar Corporation www.exar.com 48720 Kato Road, Fremont CA 94538, USA Tel. +1 510 668-7000 Fax. +1 510 668-7001

ABSOLUTE MAXIMUM RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Supply Voltage V IN... 7.0V Fault Flag Voltage V FLG... 7.0V Fault Flag Current I FLG... 50mA Enable Input V EN... -0.3V to 15V Storage Temperature... -65 C to 150 C Soldering Temperature (10sec)... 260 C Maximum Junction Temperature... 125 C Power Dissipation (NSOIC-8)... (derate 6.14mW/ C above 70 C)... 500mW OPERATING RATINGS Ambient Temperature Range... -40 C to 85 C ELECTRICAL SPECIFICATIONS Specifications with standard type are for an Operating Ambient Temperature of T A = 25 C only; limits applying over the full Operating Junction Temperature range are denoted by a. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at T A = 25 C, and are provided for reference purposes only. Unless otherwise indicated, V IN = 5.0V, T A = 25 C. Supply Current Enable Input Voltage Enable Input Current Parameter Min. Typ. Max. Units Conditions 0.75 5.0 V EN = Logic 0 OUT =open µa 110 160 V EN = Logic 1 OUT =open 0.8 1.7 V EN = Logic 0 V 2.0 2.4 V EN = Logic 1 0.01 1 V EN = Logic 0 µa 0.01 1 V EN = Logic 1 Enable Input Capacitance 1 pf Output MOSFET Resistance 110 150 mω Output turn-on delay 100 µs R L =10Ω, each output Output turn-on rise time 1000 4000 µs R L =10Ω, each output Output turn-off delay 0.8 20 µs R L =10Ω, each output Output turn-off fall time 0.7 20 µs R L =10Ω, each output Output Leakage Current 10 µa Current limit threshold 0.6 1.0 1.25 A Over temperature shutdown threshold Error Flag Output Resistance 135 C Temperature T J raising 125 Temperature T J decreasing 10 25 V IN =5V, I L =10mA Ω 15 40 V IN =3.3V, I L =10mA Error Flag Current 0.01 1 µa V FLAG =5V UVLO threshold 2.6 V IN increasing V 2.4 V IN decreasing 2011 Exar Corporation 2/9 Rev. 2.1.0

BLOCK DIAGRAM Fig. 2: SP2526A Block Diagram PIN ASSIGNMENT Fig. 3: SP2526A Pin Assignment 2011 Exar Corporation 3/9 Rev. 2.1.0

PIN DESCRIPTION Name Pin Number Description ENA 1 FLGA 2 FLGB 3 ENB 1 Enable Input for channel A. Active High for SP2526A-1 and Active Low for SP2526A-2 An active-low and open-drained fault flag output for channel A. It can indicate current limit ENA is active. In normal mode operation (ENA and/or ENB is active), it also can indicate thermal shutdown or under voltage An active-low and open-drained fault flag output for channel B. It can indicate current limit ENA is active. In normal mode operation (ENA and/or ENB is active), it also can indicate thermal shutdown or under voltage Enable Input for channel B. Active High for SP2526A-1 and Active Low for SP2526A-2 OUTB 5 Output for Channel B. This is the output pin of the MOSFET source of channel B, typically connected to the switched side of the load GND 6 Ground IN 7 Power Supply Input OUTA 8 Output for Channel A. This is the output pin of the MOSFET source of channel A, typically connected to the switched side of the load ORDERING INFORMATION Part Number Temperature Range Marking SP2526A-1EN-L -40 C T A +85 C Sipex 2526A-1E YYWWL SP2526A-2EN-L -40 C T A +85 C Sipex 2526A-2E YYWWL Package Packing Quantity Bulk SP2526A-1EN-L/TR -40 C T A +85 C NSOIC8 2.5K/Tape & Reel Bulk SP2526A-2EN-L/TR -40 C T A +85 C NSOIC8 2.5K/Tape & Reel YY = Year WW = Work Week X = Lot Number Note 1 Note 2 RoHS Compliant Halogen Free RoHS Compliant Halogen Free Enable Active high Enable Active Low 2011 Exar Corporation 4/9 Rev. 2.1.0

TYPICAL PERFORMANCE CHARACTERISTICS All data taken at V IN = 5.0V, T A = 25 C, unless otherwise specified - Schematic and BOM from Application Information section of this datasheet. Fig. 4: Output On-Resistance vs Supply Voltage Fig. 5: Output On-Resistance vs Temperature Fig. 6: UVLO Threshold vs Temperature Fig. 7: On-state Supply Current vs Supply Voltage Fig. 8: On-state Supply Current vs Temperature Fig. 9: Off-state Supply Current vs Temperature 2011 Exar Corporation 5/9 Rev. 2.1.0

Fig. 10: Off-state Supply Current vs Supply Voltage Fig. 11: Control Threshold vs Supply Voltage Fig. 12: Turn-on/Turn-off Characteristics 2011 Exar Corporation 6/9 Rev. 2.1.0

APPLICATION INFORMATION ERROR FLAG An open-drained output of an N-channel MOSFET, the FLG output is pulled low to signal the following fault conditions: input undervoltage, output current limit, and thermal shutdown. CURRENT LIMIT The current limit threshold is preset internally. It protects the output MOSFET switches from damage resulting from undesirable short circuit conditions or excess inrush current, which is often encountered during hot plug-in. The low limit of the current limit threshold of the SP2526A allows a minimum current of 0.6A through the MOSFET switches. A current limit condition will signal the Error Flag. THERMAL SHUTDOWN When the chip temperature exceeds 135ºC for any reason other than overcurrent fault of either one of the two MOSFETs, the thermal shutdown function turns off both MOSFET switches and signals the error flag. A hysteresis of 10ºC prevents the MOSFETs from turning back on until the chip temperature drops below 125ºC. However, if thermal shutdown is triggered by chip temperature rise resulting from overcurrent fault condition of either one of the MOSFET switches, the thermal shutdown function will only turn off the switch that is in overcurrent condition and the other switch can still remain its normal operation. In other words, the thermal shutdown function of the two switches is independent of each other in the case of overcurrent fault. may cause ringing on the input (from supply lead inductance) which can damage internal control circuitry. TRANSIENT REQUIREMENTS USB supports dynamic attachment (hot plugin) of peripherals. A current surge is caused by the input capacitance of a downstream device. Ferrite beads are recommended in series with all power and ground connector pins. Ferrite beads reduce EMI and limit the inrush current during hotattachment by filtering high-frequency signals. SHORT CIRCUIT TRANSIENT Bulk capacitance provides the short-term transient current needed during a hotattachment event. A 33μF/16V tantalum or a 100μF/10V electrolytic capacitor mounted close to the downstream connector at each port should provide sufficient transient drop protection. PRINTED CIRCUIT LAYOUT The Power circuitry of USB printed circuit boards requires a customized layout to maximize thermal dissipation and to minimize voltage drop and EMI. TEST CIRCUIT SUPPLY FILTERING A 0.1μF to 1μF bypass capacitor from IN to GND, located near the device, is strongly recommended to control supply transients. Without a bypass capacitor, an output short 2011 Exar Corporation 7/9 Rev. 2.1.0

PACKAGE SPECIFICATION 8-PIN NSOIC 2011 Exar Corporation 8/9 Rev. 2.1.0

REVISION HISTORY Revision Date Description 2.0.0 11/19/2010 Reformat of datasheet 2.1.1 11/04/2011 Updated package specification FOR FURTHER ASSISTANCE Email: Exar Technical Documentation: customersupport@exar.com http://www.exar.com/techdoc/default.aspx? EXAR CORPORATION HEADQUARTERS AND SALES OFFICES 48720 Kato Road Fremont, CA 94538 USA Tel.: +1 (510) 668-7000 Fax: +1 (510) 668-7030 www.exar.com NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user s specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. 2011 Exar Corporation 9/9 Rev. 2.1.0