LBA11 Dual Pole OptoMOS Relay Parameter Ratings Units Blocking Voltage 3 V P Load Current 12 ma rms / ma DC On-Resistance (max 3 Features 37V rms Input/Output Isolation 1% Solid State Low Drive Power Requirements (TTL/CMOS Compatible Arc-Free With No Snubbing Circuits FCC Compatible VDE Compatible No EMI/RFI Generation Machine Insertable, Wave Solderable Description LBA11 comprises two independent 3V, 12mA, 3 solid state relays: one single-pole, normally open (1- relay and one single-pole, normally closed (1- relay. LBA11 is designed to provide an ideal solution where a complementary / relay pair is required. Approvals UL Recognized Component: File E7627 CSA Certified Component: Certificate 117739 EN/IEC 69-1 Certified Component TUV Certificate B 9 7 4941 4 Applications Telecounications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls Ordering Information Part # Description LBA11 8-Pin DIP (/Tube LBA11S 8-Pin Surface Mount (/Tube LBA11STR 8-Pin Surface Mount (1,/Reel LBA11P 8-Pin Flat Pack (/Tube LBA11PTR 8-Pin Flat Pack (1,/Reel Pin Configuration 1 8 + Control - Normally Closed Normally Closed Pole 2 7 Control - Normally Closed 3 6 + Control - Normally Open Normally Open Pole 4 Control - Normally Open Switching Characteristics of Normally Open Devices Switching Characteristics of Normally Closed Devices 9% I LOAD 9% I LOAD 1% 1% t on t off t off t on Pb e3 DS-LBA11-R9 www.ixysic.com 1
LBA11 Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Blocking Voltage 3 V P Reverse Input Voltage V Input Control Current ma Peak (1ms 1 A Input Power Dissipation 1 1 mw Total Power Dissipation 2 8 mw Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Isolation Voltage, Input to Output 37 V rms Operational Temperature -4 to +8 C Storage Temperature -4 to +12 C 1 Derate linearly 1.33 mw / ºC 2 Derate linearly 6.67 mw / ºC Electrical Characteristics @ 2ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 - I L - - 12 ma rms / ma DC Peak t = 1ms I LPK - - ±3 ma P On-resistance I L =12mA R ON - 2 3 Off-State Leakage Current V L =3V P I LEAK - - 1 A Switching Speeds Turn-On t =ma, V L =1V on - - 3 Turn-Off t off - - 3 ms Output Capacitance V L =V, f=1mhz C OUT - 2 - pf Input Characteristics Input Control Current to Activate I L =12mA - - 2 ma Input Control Current to Deactivate -.4.7 - ma Input Voltage Drop =ma V F.9 1.2 1.4 V Reverse Input Current V R =V I R - - 1 A Coon Characteristics Input to Output Capacitance - C I/O - 3 - pf 1 If both poles operate the load current must be derated so as not to exceed the package power dissipation value. R9 2 www.ixysic.com
LBA11 / PERFORMANCE DATA @2ºC (Unless Otherwise Noted* Device Count (N 3 3 2 2 1 1 Typical LED Forward Voltage Drop (N=, =ma 1.17 1.19 1.21 1.23 1.2 LED Forward Voltage Drop (V LED Forward Voltage Drop (V 1.8 1.6 Typical LED Forward Voltage Drop 1.4 =ma 1.2 =3mA =2mA I 1. F =1mA =ma.8-4 -2 2 4 6 8 1 12 Temperature (ºC PERFORMANCE DATA @2ºC (Unless Otherwise Noted* 2 (N=, =ma, I L =12mA DC 2 (N=, =ma, I L =12mA DC 3 Typical On-Resistance Distribution (N=, =ma, I L =12mA DC Device Count (N 2 1 1 Device Count (N 2 1 1 Device Count (N 3 2 2 1 1.4.7 1. 1.3 1.6 Turn-On Time (ms.12.2.28.36.44.2.6 Turn-Off Time (ms 19. 2. 21. 22. 23. 24. 2. On-Resistance ( 2 Typical for Switch Operation (N=, I L =12mA DC 2 Typical for Switch Dropout (N=, I L =12mA DC 3 Typical Blocking Voltage Distribution (N= Device Count (N 2 1 1 Device Count (N 2 1 1 Device Count (N 3 2 2 1 1.6.91 1.17 1.43 1.69 1.9 LED Current (ma.39.6.91 1.17 1.43 1.69 1.9 LED Current (ma 4 42 44 46 48 2 Blocking Voltage (V P *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R9 www.ixysic.com 3
LBA11 Turn-On Time (ms 1..9.8.7.6..4.3.2.1 PERFORMANCE DATA @2ºC (Unless Otherwise Noted* vs. LED Forward Current =12mA DC 1 1 2 2 3 3 4 4 LED Forward Current (ma Turn-Off Time (ms vs. LED Forward Current =12mA DC.22.21.21.2.2.19.19.18.18 1 1 2 2 3 3 4 4 LED Forward Current (ma LED Current (ma 2. 2. 1. 1.. -4 Typical for Switch Operation =12mA DC -2 2 4 6 8 1 Temperature (ºC 2. Typical for Switch Dropout =12mA DC 1.4 =12mA DC.4 ( =ma, I L =12mA DC LED Current (ma 2. 1. 1.. -4-2 2 4 6 8 1 Temperature (ºC Turn-On Time (ms 1.2 1..8.6.4.2-4 =ma =1mA =2mA -2 2 4 6 8 1 Temperature (ºC Turn-Off Time (ms.3.3.2.2.1.1. -4-2 2 4 6 8 1 Temperature (ºC On-Resistance ( Typical On-Resistance ( =ma, I L =12mA DC 6 4 3 2 1-4 -2 2 4 6 8 1 Temperature (ºC Load Current (ma Typical Load Current vs. Load Voltage ( =ma 1 1 - -1-1 -4-3 -2-1 1 2 3 4 Load Voltage (V Load Current (ma Maximum Load Current 18 16 14 12 1 I 8 F =2mA =1mA 6 =ma 4 2-4 -2 2 4 6 8 1 12 Temperature (ºC Blocking Voltage (V P 48 47 46 4 44 43 42-4 Typical Blocking Voltage -2 2 4 6 8 1 Temperature (ºC Leakage (µa.16.14.12.1.8.6.4.2-4 Typical Leakage Measured Across Pins &6-2 2 4 6 8 1 Temperature (ºC Load Current (A Energy Rating Curve 1..9.8.7.6..4.3.2.1 1μs 1μs 1ms 1ms 1ms 1s 1s 1s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R9 4 www.ixysic.com
LBA11 2 PERFORMANCE DATA @2ºC (Unless Otherwise Noted* (N=, =ma, I L =12mA DC 2 (N=, =ma, I L =12mA DC 2 Typical On-Resistance Distribution (N=, =ma, I L =12mA DC Device Count (N 2 1 1 Device Count (N 2 1 1 Device Count (N 2 1 1.2.3.4..6.7 Turn-On Time (ms.24.4.6.72.88 1.4 Turn-Off Time (ms 2. 26. 27. 28. 29. 3. 31. On-Resistance ( 2 Typical for Switch Operation (N=, I L =12mA DC 2 Typical for Switch Dropout (N=, I L =12mA DC 3 Typical Blocking Voltage Distribution (N= Device Count (N 2 1 1 Device Count (N 2 1 1 Device Count (N 2 2 1 1.7.9 1.1 1.3 1. 1.7 1.9 LED Current (ma.7.9 1.1 1.3 1. 1.7 1.9 LED Current (ma 36 37 38 39 4 41 42 Blocking Voltage (V P.42 vs. LED Forward Current =12mA DC.7 vs. LED Forward Current =12mA DC 3. Typical for Switch Operation =12mA DC Turn-On Time (ms.41.4.39.38.37.36.3 Turn-Off Time (ms.6..4.3.2.1 LED Current (ma 2. 2. 1. 1...34 1 1 2 2 3 3 4 4 LED Forward Current (ma 1 1 2 2 3 3 4 4 LED Forward Current (ma -4-2 2 4 6 8 1 Temperature (ºC LED Current (ma 3. 2. 2. 1. 1.. Typical for Switch Dropout =12mA DC Turn-On Time (ms.7.6..4.3.2.1 ( =ma, I L =12mA DC Turn-Off Time (ms 1.2 1..8.6.4.2 =12mA DC =ma =1mA =2mA -4-2 2 4 6 8 1 Temperature (ºC -4-2 2 4 6 8 1 Temperature (ºC -4-2 2 4 6 8 1 Temperature (ºC *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R9 www.ixysic.com
LBA11 On-Resistance ( 4 3 2 1-4 PERFORMANCE DATA @2ºC (Unless Otherwise Noted* Typical On-Resistance ( =ma, I L =12mA DC 6-2 2 4 6 8 1 Temperature (ºC Load Current (ma 1 1 - -1 Typical Load Current vs. Load Voltage ( =ma -1-4 -3-2 -1 1 2 3 4 Load Voltage (V Load Current (ma Maximum Load Current ( =ma 18 16 14 12 1 8 6 4 2-4 -2 2 4 6 8 1 12 Temperature (ºC Blocking Voltage (V P 41 41 4 4 39 39 38 38 37-4 Typical Blocking Voltage -2 2 4 6 8 1 Temperature (ºC Leakage (µa.16.14.12.1.8.6.4.2-4 Typical Leakage Measured Across Pins &6 ( =ma -2 2 4 6 8 1 Temperature (ºC Load Current (A Energy Rating Curve 1..9.8.7.6..4.3.2.1 1μs 1μs 1ms 1ms 1ms 1s 1s 1s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R9 6 www.ixysic.com
LBA11 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL Rating LBA11 / LBA11S / LBA11P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device LBA11 / LBA11S LBA11P Maximum Temperature x Time 2ºC for 3 seconds 26ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recoends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb e3 R9 www.ixysic.com 7
LBA11 MECHANICAL DIMENSIONS LBA11 2.4 ±.127 (.1 ±. 6.3 ±.127 (.2 ±. Pin 1.47 ±.76 (.18 ±.3 4.64 TYP (.16 9.62 ±.381 (.38 ±.1 3.32 ±.1 (.13 ±.2 7.62 ±.24 (.3 ±.1 9.144 ±.8 (.36 ±.2 7.239 TYP. (.28.24 ±.127 (.1 ±. 8-.8 DIA. (8-.31 DIA. 6.3 ±.127 (.2 ±. 7.62 ±.127 (.3 ±. PCB Hole Pattern 2.4 ±.127 (.1 ±. 7.62 ±.127 (.3 ±..813 ±.12 (.32 ±.4 (inches LBA11S 2.4 ±.127 (.1 ±. 9.62 ±.381 (.38 ±.1 3.32 ±.1 (.13 ±.2.63 ±.127 (.2 ±. PCB Land Pattern 2.4 (.1 6.3 ±.127 (.2 ±. Pin 1 9.2 ±.24 (.37 ±.1.47 ±.76 (.18 ±.3 7.62 ±.24 (.3 ±.1.24 ±.127 (.1 ±. 1.6 (.649.6 (.2 8.9 (.33 4.44 ±.127 (.17 ±..813 ±.12 (.32 ±.4 (inches LBA11P 2.4 ±.127 (.1 ±. 6.3 ±.127 (.2 ±. Pin 1 9.398 ±.127 (.37 ±. 9.62 ±.381 (.38 ±.1 2.19 ±.2 (.8 ±.1 MIN /.12 MAX ( MIN /.4 MAX 7.62 ±.24 (.3 ±.1.23 ±.13 (.8 ±. 2.286 MAX. (.9 MAX..63 ±.127 (.2 ±. 1. (.61 PCB Land Pattern.6 (.2 2.4 (.1 8.7 (.342.47 ±.76 (.18 ±.3.864 ±.12 (.34 ±.4 (inches R9 8 www.ixysic.com
LBA11 MECHANICAL DIMENSIONS LBA11STR Tape & Reel 33.2 DIA. (13. DIA. Top Cover Tape Thickness.12 MAX. (.4 MAX. Bo=1.3 (.46 W=16. (.63 Embossed Carrier Embossment K =4.9 (.193 K 1 =4.2 (.16 Ao=1.3 (.46 P=12. (.472 User Direction of Feed (inches NOTES: 1. carry tolerances of EIA Standard 481-2 2. Tape complies with all Notes for constant dimensions listed on page of EIA-481-2 LBA11PTR Tape & Reel 33.2 DIA. (13. DIA. 2. (.79 4. (.17 Top Cover Tape Thickness.12 MAX. (.4 MAX. 7. (.29 W = 16. (.63 Bo = 1.3 (.46 Embossed Carrier K = 2.7 (.16 K 1 = 2. (.79 P = 12. (.472 User Direction of Feed Ao = 1.3 (.46 (inches Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all Notes for constant dimensions listed on page of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 9 Specification: DS-LBA11-R9 Copyright 212, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/212