NSV50010YT1G. Constant Current Regulator & LED Driver 50 V, 10 ma 30%, 460 mw Package

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Constant Current Regulator & LED Driver 0 V, ma 30%, 460 Package The linear constant current regulator (CCR) is a simple, economical and robust device designed to provide a cost effective solution for regulating current in LEDs (similar to Constant Current Diode, CCD). The CCR is based on Self-Biased Transistor (SBT) technology and regulates current over a wide voltage range. It is designed with a negative temperature coefficient to protect LEDs from thermal runaway at extreme voltages and currents. The CCR turns on immediately and is at 40% of regulation with only 0. V Vak. It requires no external components allowing it to be designed as a high or low side regulator. The high anode-cathode voltage rating withstands surges common in Automotive, Industrial and Commercial Signage applications. The CCR comes in thermally robust packages and is qualified to AEC-Q1 standard, and UL94 V0 certified. Features Robust Power Package: 460 Wide Operating Voltage Range Immediate Turn-On Voltage Surge Suppressing Protecting LEDs UL94 V0 Certified SBT (Self Biased Transistor) Technology Negative Temperature Coefficient NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q1 Qualified and PPAP Capable These Devices are Pb Free, Halogen Free/BFR Free and are RoHS Compliant Applications Automobile: Chevron Side Mirror Markers, Cluster, Display & Instrument Backlighting, CHMSL, Map Light AC Lighting Panels, Display Signage, Decorative Lighting, Channel Lettering Switch Contact Wetting Application Note AND391/D Power Dissipation Considerations Application Note AND349/D Automotive CHMSL MAXIMUM RATINGS (T A = C unless otherwise noted) Rating Symbol Value Unit Anode Cathode Voltage Vak Max 0 V Reverse Voltage V R 00 mv Operating and Storage Junction Temperature Range ESD Rating: Human Body Model Machine Model T J, T stg to +10 C ESD Class 1C Class B Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. I reg(ss) = ma @ Vak =. V 1 Anode Cathode 1 SOD 13 CASE 4 STYLE 1 MARKING DIAGRAM AJ M 1 AJ = Device Code M = Date Code = Pb Free Package (Note: Microdot may be in either location) Device Package Shipping NSI00YT1G NSV00YT1G ORDERING INFORMATION SOD 13 (Pb Free) SOD 13 (Pb Free) 3000/Tape & Reel 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD011/D. Semiconductor Components Industries, LLC, 014 April, 014 Rev. 1 Publication Order Number: NSI00Y/D

ELECTRICAL CHARACTERISTICS (T A = C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Steady State Current @ Vak =. V (Note 1) I reg(ss).0 13 ma Voltage Overhead (Note ) V overhead 1. V Pulse Current @ Vak =. V (Note 3) I reg(p).1. 13. ma Capacitance @ Vak =. V (Note 4) C. pf Capacitance @ Vak = 0 V (Note 4) C. pf 1. I reg(ss) steady state is the voltage (Vak) applied for a time duration sec, using FR 4 @ 300 mm 1 oz. Copper traces, in still air.. V overhead = V in V LEDs. V overhead is typical value for 0% I reg(ss). 3. I reg(p) non repetitive pulse test. Pulse width t 300 sec. 4. f = 1 MHz, 0.0 V RMS. Figure 1. CCR Voltage Current Characteristic

THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation (Note ) T A = C Derate above C P D 0 1.66 Thermal Resistance, Junction to Ambient (Note ) R θja 600 C/W Thermal Reference, Lead to Ambient (Note ) RψLA 404 C/W Thermal Reference, Junction to Cathode Lead (Note ) RψJL 196 C/W Total Device Dissipation (Note 6) T A = C Derate above C P D 1. Thermal Resistance, Junction to Ambient (Note 6) R θja 0 C/W Thermal Reference, Lead to Ambient (Note 6) RψLA 390 C/W Thermal Reference, Junction to Cathode Lead (Note 6) RψJL 160 C/W Total Device Dissipation (Note ) T A = C Derate above C P D 34. Thermal Resistance, Junction to Ambient (Note ) R θja 360 C/W Thermal Reference, Lead to Ambient (Note ) RψLA 00 C/W Thermal Reference, Junction to Cathode Lead (Note ) RψJL 160 C/W Total Device Dissipation (Note ) T A = C Derate above C P D 36.9 Thermal Resistance, Junction to Ambient (Note ) R θja 340 C/W Thermal Reference, Lead to Ambient (Note ) RψLA 0 C/W Thermal Reference, Junction to Cathode Lead (Note ) RψJL 13 C/W Total Device Dissipation (Note 9) T A = C Derate above C P D 436 3. Thermal Resistance, Junction to Ambient (Note 9) R θja C/W Thermal Reference, Lead to Ambient (Note 9) RψLA 139 C/W Thermal Reference, Junction to Cathode Lead (Note 9) RψJL 14 C/W Total Device Dissipation (Note ) T A = C Derate above C P D 463 3. Thermal Resistance, Junction to Ambient (Note ) R θja 0 C/W Thermal Reference, Lead to Ambient (Note ) RψLA 10 C/W Thermal Reference, Junction to Cathode Lead (Note ) RψJL 10 C/W Junction and Storage Temperature Range T J, T stg to +10 C. FR 4 @ 0 mm, 1 oz. copper traces, still air. 6. FR 4 @ 0 mm, oz. copper traces, still air.. FR 4 @ 300 mm, 1 oz. copper traces, still air.. FR 4 @ 300 mm, oz. copper traces, still air. 9. FR 4 @ 00 mm, 1 oz. copper traces, still air..fr 4 @ 00 mm, oz. copper traces, still air. NOTE: Lead measurements are made by non contact methods such as IR with treated surface to increase emissivity to 0.9. Lead temperature measurement by attaching a T/C may yield values as high as 30% higher C/W values based upon empirical measurements and method of attachment. 3

TYPICAL PERFORMANCE CURVES Minimum FR 4 @ 300 mm 1 oz Copper Trace, Still Air I reg(ss), STEADY STATE CURRENT (ma) 1 11 9 6 4 3 1 0 0 1 T A = 40 C T A = C T A = C 3 4 DC Test Steady State, Still Air 6 0.04 ma/ C typ @ Vak =. V 0.019 ma/ C typ @ Vak =. V 9 I reg(p), PULSE CURRENT (ma) 13 1 11 9 3 4 Non Repetitive Pulse Test 6 T A = C 9 Vak, ANODE CATHODE VOLTAGE (V) Vak, ANODE CATHODE VOLTAGE (V) Figure. Steady State Current (I reg(ss) ) vs. Anode Cathode Voltage (Vak) Figure 3. Pulse Current (I reg(p) ) vs. Anode Cathode Voltage (Vak) I reg(ss), STEADY STATE CURRENT (ma) 13 1 11 9 Vak @. V T A = C 9 11 1 13 14 I reg, CURRENT REGULATION (ma). 9. 0 Vak @. V T A = C 1 0 30 3 I reg(p), PULSE CURRENT (ma) TIME (s) Figure 4. Steady State Current vs. Pulse Current Testing Figure. Current Regulation vs. Time 00 P D, POWER DISSIPATION () 00 600 00 400 300 00 00 mm / oz 00 mm /1 oz 300 mm / oz 300 mm /1 oz 0 mm / oz 0 mm /1 oz 0 40 0 0 0 40 60 T A, AMBIENT TEMPERATURE ( C) 0 Figure 6. Power Dissipation vs. Ambient Temperature @ T J = 10 C 4

The CCR is a self biased transistor designed to regulate the current through itself and any devices in series with it. The device has a slight negative temperature coefficient, as shown in Figure Tri Temp. (i.e. if the temperature increases the current will decrease). This negative temperature coefficient will protect the LEDS by reducing the current as temperature rises. The CCR turns on immediately and is typically at 0% of regulation with only 0. V across it. The device is capable of handling voltage for short durations of up to 0 V so long as the die temperature does not exceed 10 C. The determination will depend on the thermal pad it is mounted on, the ambient temperature, the pulse duration, pulse shape and repetition. NSI00YT1G APPLICATIONS INFORMATION Single LED String The CCR can be placed in series with LEDs as a High Side or a Low Side Driver. The number of the LEDs can vary from one to an unlimited number. The designer needs to calculate the maximum voltage across the CCR by taking the maximum input voltage less the voltage across the LED string (Figures and ). Figure. Higher Current LED Strings Two or more fixed current CCRs can be connected in parallel. The current through them is additive (Figure 9). Figure. Figure 9.

Other Currents The adjustable CCR can be placed in parallel with any other CCR to obtain a desired current. The adjustable CCR provides the ability to adjust the current as LED efficiency increases to obtain the same light output (Figure ). LEDs on and off for a portion of a single cycle. This on/off cycle is called the Duty cycle (D) and is expressed by the amount of time the LEDs are on (Ton) divided by the total time of an on/off cycle (Ts) (Figure 1). Figure 1. The current through the LEDs is constant during the period they are turned on resulting in the light being consistent with no shift in chromaticity (color). The brightness is in proportion to the percentage of time that the LEDs are turned on. Figure 13 is a typical response of Luminance vs Duty Cycle. 6000 000 Figure. Dimming using PWM The dimming of an LED string can be easily achieved by placing a BJT in series with the CCR (Figure 11). ILLUMINANCE (lx) 4000 3000 000 00 Lux Linear 0 0 0 30 40 0 60 0 0 90 0 DUTY CYCLE (%) Figure 13. Luminous Emmitance vs. Duty Cycle Figure 11. The method of pulsing the current through the LEDs is known as Pulse Width Modulation (PWM) and has become the preferred method of changing the light level. LEDs being a silicon device, turn on and off rapidly in response to the current through them being turned on and off. The switching time is in the order of 0 nanoseconds, this equates to a maximum frequency of Mhz, and applications will typically operate from a 0 Hz to 0 khz. Below 0 Hz the human eye will detect a flicker from the light emitted from the LEDs. Between 00 Hz and 0 khz the circuit may generate audible sound. Dimming is achieved by turning the Reducing EMI Designers creating circuits switching medium to high currents need to be concerned about Electromagnetic Interference (EMI). The LEDs and the CCR switch extremely fast, less than 0 nanoseconds. To help eliminate EMI, a capacitor can be added to the circuit across R. (Figure 11) This will cause the slope on the rising and falling edge on the current through the circuit to be extended. The slope of the CCR on/off current can be controlled by the values of R1 and C1. The selected delay / slope will impact the frequency that is selected to operate the dimming circuit. The longer the delay, the lower the frequency will be. The delay time should not be less than a :1 ratio of the minimum on time. The frequency is also impacted by the resolution and dimming steps that are required. With a delay of 1. microseconds on the rise and the fall edges, the minimum on time would be 30 microseconds. If the design called for a resolution of 0 dimming steps, then a total duty cycle time (Ts) of 3 milliseconds or a frequency of 333 Hz will be required. 6

Thermal Considerations As power in the CCR increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the device has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the device can handle is given by: P D(MAX) T J(MAX) T A R JA Referring to the thermal table on page the appropriate R JA for the circuit board can be selected. AC Applications The CCR is a DC device; however, it can be used with full wave rectified AC as shown in application notes AND433/D and AND49/D and design notes DN0013/D and DN0606/D. Figure 14 shows the basic circuit configuration. Figure 14. Basic AC Application

PACKAGE DIMENSIONS SOD 13 CASE 4 04 ISSUE G H E D 1 ÂÂÂ b E C A A1 L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.M, 19.. CONTROLLING DIMENSION: INCH. MILLIMETERS DIM MIN NOM MAX A 0.94 1.1 1.3 0.03 A1 0.00 0.0 0. 0.000 b 0.1 0.61 0.1 0.00 c --- --- 0.1 D 1.40 1.60 1.0 0.0 E.4.69.4 0.0 H E 3.6 3.6 3.6 0.140 L 0. --- --- 0.0 0 0 STYLE 1: PIN 1. CATHODE. ANODE INCHES MIN NOM MAX 0.046 0.03 0.00 0.004 0.04 0.0 --- --- 0.063 0.6 0.14 0.006 0.01 0.11 0.1 --- --- --- --- SOLDERING FOOTPRINT* 0.91 0.036.36 0.093 4.19 0.16 1. 0.04 SCALE :1 mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 163, Denver, Colorado 01 USA Phone: 303 6 1 or 00 344 360 Toll Free USA/Canada Fax: 303 6 16 or 00 344 36 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 00 9 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 41 33 90 9 Japan Customer Focus Center Phone: 1 3 1 0 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NSI00Y/D