Part Number SuperPix TM image sensor is one of SuperPix TM 2 Mega Digital image sensor series products. These series sensors have the same maximum ima

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Specification Version Commercial 1.7 2012.03.26 SuperPix Micro Technology Co., Ltd

Part Number SuperPix TM image sensor is one of SuperPix TM 2 Mega Digital image sensor series products. These series sensors have the same maximum image format, UXGA, which means they can be adapted by lots of different kinds of portable equipment, for instance, mobile phones or notebooks. The is the newest one of this series, which is based on the 3 rd generation 1.75um CMOS image sensor pixel architecture designed by SuperPix TM, offering high performance images, making it an ideal choice for mainstream phones. An additional SPI function let can access image data from other sensor, which make it can be capable of multi-sensor products. Functionalities CMOS Image Sensor Image Signal Processor Applications Mobile Phone Notebook PC-Cam Web-Cam Digital Camera Toys www.superpix.com.cn Room 201, Hao Hai Bld.,NO.7 Shang Di 5 th Street, Haidian District, Beijing, China, 100085 Tel 86-10-82784282 Fax 86-10-82784851 2012 SuperPix Micro Technology Co., Ltd. All rights reserved

List of Contents Overview... 5 General Description...5 Function Diagram...6 Typical Application List...6 Typical Application Diagram...6 Key Performance Parameters...7 Features List... 8 Function Description... 9 Pixel Array Structure...9 Image Signal Process...10 Black Level Compensation... 10 Lens Shading Correction... 10 Bad Pixel Correction... 10 Smooth and Sharpness... 11 Color Interpolation... 11 Auto White Balance... 11 Color Correction... 11 Gamma Correction... 11 RGB to YUV... 12 I²C Bus...12 Single READ and Single WRITE... 12 Data Bit Transfer... 14 Acknowledge Bit... 14 Data Valid... 14 Timing Parameter... 15 Electric Characteristics... 16 DC Specifications...16 Examination Item...16 Package... 17 Revision History... 20 Superpix Specification 3

List of Figures Figure 1 Function Diagram...6 Figure 2 Typical Application...6 Figure 3 Pixel Array Structure Detail...9 Figure 4 Sensor Pixel Description...10 Figure 5 I²C Read & Write Description...13 Figure 6 I²C Acknowledge Bit Description...14 Figure 7 I²C Data Transport Description...14 Figure 8 I²C Bus Timing Parameter Illustration...15 Figure 9 Pin Name...18 Figure 10 Package Dimensions...19 Figure 11 Pin Description...19 List of Tables Table 1 Key Performance Parameters...7 Superpix Specification 4

Overview General Description SuperPix TM image sensor is one of SuperPix TM 2-megapixel Digital image sensor series products. These series sensors have the same maximum image format, UXGA, which means they can be adapted by lots of different kinds of portable equipment, for instance, mobile phones or notebooks. The is the newest one of this series, which is based on the 3 rd generation 1.75um CMOS image sensor pixel architecture designed by SuperPix TM, offering high performance images, making it an ideal choice for mainstream phones. An additional SPI function let can access image data from other sensor, which make it can be capable of multi-sensor products. When it works with SuperPix TM SP0827, they can provide high cost performance dual sensor solution. A high performance system on a chip (SOC) sensor, is a chip built on SuperPix TM proprietary pixel and ISP technology for the users who demand high quality sensor for multiple realms. s image signal processor module includes automatic exposure control, gain control, white balance, black level calibration, lens correction, defect pixel canceling and more. Additionally, it also features all standard image quality controls such as color saturation, hue, gamma, sharpness (edge enhancement) and noise cancellation. Camera controls are accessed over a standard serial camera control bus interface. Other key image processing features include binning functionality that minimizes spatial artifacts and removes image artifacts around edges to deliver clean, crisp images, critical for achieving best-in-class 2-megapixel images. Moreover, SuperPix TM 's proprietary sensor technology utilizes advanced algorithms to cancel Vertical Fixed Pattern Noise (VFPN), eliminate smearing, and drastically reduce blooming. Extending the company s portfolio of 2-megapixel sensor, the 1.75um pixel architecture enables the to offer high performance imaging and high definition video in an ultra-compact 1/5 inch optical format, making it an ideal choice for mainstream handset equipments. The advanced pixel architecture Superpix Specification 5

delivers excellent low-light performance for the next generation of high performance mobile phones or PCs. operates at high frame rates, offering SVGA resolution at 30 frames per second (fps), and UXGA resolution at 12 frames per second (fps). comes with a standard serial I 2 C interface and a high speed parallel output interface delivering RAW or YUV or RGB image data. An overview of the Image Sensor features and functions will be given below. Function Diagram Typical Application List Mobile Phone Notebook PC-Cam Web-Cam Digital Camera Toys Figure 1 Function Diagram Typical Application Diagram Figure 2 Typical Application Superpix Specification 6

Key Performance Parameters Parameter Value Active Pixel Array 1600 x 1200 Pixel Size Active Image Size Lens Size Power Supply Power consumption Output Data format Max Working Clock Max. Frame Rate Dark Current @ 60 C SNR max Shutter 1.75um x 1.75um 2.91 mm x 2.17mm 1/5 inch I/O 1.8V ~ 3.0V Core 1.2 VDC ± 5% Analog 2.6V ~ 3.0V Active 220 mw Standby 60 ua Raw Bayer Format YUV422 RGB565 62MHz 13fps@1600 x 1200 Mode 30fps@1280 x 720 Mode 47fps@800 x 600 Mode 30fps@Binning Mode 40ele/sec 38dB Rolling shutter Operating Temperature -20 C ~ 70 C Stable Temperature 0 C ~ 50 C Package COB / TSV Table 1 Key Performance Parameters Superpix Specification 7

Features List Active pixel array 1600 x 1200 Support for UXGA, SVGA Analog gain rage is 1.0x 15.5x The image can be zoomed in and zoomed out from 1600 x 1200 to 60 x 60 Support for video operations Support for horizontal and vertical sub-sample Embedded black level control Support R, Gr, B, Gb 4 transmission channel in analog portion Support VFPN reduction circuit Embedded image preprocessor functionality - Interpolation arithmetic - Bad pixel detection and cancellation - Auto white balance - Auto exposal control - Auto black level calibration - Image sharpening - Smooth inhibiting noise - Color space transform - Color saturation control - Hue control - Programmable gamma control - Lens correction - Defective pixel canceling - Noise canceling I²C bus controlling registers inside chip Support maximum 62MHz working clock Support Globe digital gain control Pipeline ADC output 10bit image data Support strobe signal in order to control flash lamp Support SPI interface data access Superpix Specification 8

Function Description Pixel Array Structure The pixel array is configured as of 1608 columns by 1208 rows, shown below. There are 1600 columns by 1200 rows of optically active pixels. Figure 3 Pixel Array Structure Detail Superpix Specification 9

Image Signal Process Black Level Compensation Figure 4 Sensor Pixel Description Image signal processor starts the image processing stream with black level compensation module. The Black level compensation module provides the function which is to adjust the black level of the image from the sensor automatically. Lens Shading Correction Lens shading correction unit is used to correct the brightness near the edge of the lens, and make the brightness across the field of view similar. has an embedded lens shading correction module that can be programmed to precisely counter the shading effect of a lens on each RGB color signal. The Lens Shading Correction module multiplies RGB signals by a 2-dimensional correction function F(x,y), whose profile in both x and y direction is a piecewise quadratic polynomial with coefficients independently programmable for each direction and color. Bad Pixel Correction Bad pixels will be detected and be replaced by a value calculated from the neighbor Superpix Specification 10

pixel during the Bad Pixel module. Smooth and Sharpness In this module, smoothing is used to remove the noise in planes and sharpness is used to enhance the edges and detail regions. This block is designed especial for images token out door. The sharpness module of is integrated in color interpolation module. Color Interpolation Color interpolation module is to convert the raw data to RGB image data. The algorithm is a digital image process used to interpolate a complete image from the partial raw data received form the color filter in form of a matrix of colored pixels. Each 10bit raw pixel data is converted to RGB value using an edge-sensitive color interpolation algorithm. Auto White Balance Auto white balance unit is help to remove the unrealistic color from the image automatically by referencing the white balance pre-gain. With auto white balance unit, the still / video camera system can determine the color temperature of the light and automatically adjust for the color temperature. Color Correction Color correction unit is design to correct the color with the color correction coefficient. The color correction multiplies the interpolated RGB value by programmable 3x3 matrix to map the color response of the sensor to a desired target. The matrix values are determined based on the spectral response and the cross talk characteristics of the sensor and the values can be programmable. This module can deliver vivid images for users. Gamma Correction The includes a module for gamma correction that has the capability to adjust its gamma curve, to enhance the performance under certain lighting conditions. As a result, the images turn to more fresh after this module. Superpix Specification 11

RGB to YUV After the gamma correction, the image data stream undergoes RGB to YUV conversion. The RGB format image data can be turned to YUV422 format. I²C Bus Single READ and Single WRITE The I 2 C write address is 60H and read address is 61H. A typical READ or WRITE sequence begins by the master sending a start bit. After the start bit, the master sends the slave device s 8-bit address. The last bit of the address determines if the request will be a read or a write, where a 0 indicates a WRITE and a 1 indicates a READ. The slave device acknowledges its address by sending an acknowledge bit back to the master. If the request was a WRITE, the master then transfers the 8-bit register address to which a write should take place. The slave sends an acknowledge bit to indicate that the register address has been received. The master then transfers the data 8 bits at a time, with the slave sending an acknowledge bit after each 8 bits. The master stops writing by sending a start or stop bit. A typical READ sequence is executed as follows. First the master sends the write-mode slave address and 8-bit register address just as in the write request. The master then sends a start bit and the read-mode slave address. The master then clocks out the register data 8 bits at a time. The master sends an acknowledge bit after each 8-bit transfer. The data transfer is stopped when the master sends a no-acknowledge bit. Tow figures that is shown below will illustrate single READ sequence and single WRITE sequence. Superpix Specification 12

Figure 5 I²C Read & Write Description Superpix Specification 13

Data Bit Transfer One data bit is transferred during each clock pulse. The serial clock pulse is provided by the master. The data must be stable during the HIGH period of the serial clock it can only change when the serial clock is LOW. Data is transferred 8 bits at a time, followed by an acknowledge bit. Acknowledge Bit The SP0838 will hold the value of the SDA pin to logic 0 during the logic 1 state of the Acknowledge clock pulse on SCLK. Data Valid Figure 6 I²C Acknowledge Bit Description The master must ensure that data is stable during the logic 1 state of the SCLK pin. All transitions on the SDA pin can only occur when the logic level on the SCLK pin is 0. Figure 7 I²C Data Transport Description Superpix Specification 14

Timing Parameter Figure 8 I²C Bus Timing Parameter Illustration Symbol Description Min Max Unit fscl SBCL clock frequency 0 400 KHz tbuf Bus free time between a stop and a start 1.2 - ns thd_sta Hold time for a repeated start 1 - ns tlow LOW period of SBCL 1.2 - ns thigh HIGH period of SBCL 1 - ns tsu_sta Setup time for a repeated start 1.2 - ns thd_dat Data hold time 1.3 - ns tsu_dat Data Setup time 250 - ns tr Rise time of SBCL, SBDA - 250 ns tf Fall time of SBCL, SBDA - 300 ns tsu_sto Setup time for a stop 1.2 - ns Cb Capacitive load of bus line (SBCL, SBDA) - - pf Superpix Specification 15

Electric Characteristics DC Specifications Symbol Description Min. Typ. Max. Unit AVDD Power supply voltage for IO and analog 2.6 2.8 3.0 V VDDIO Power supply voltage for IO and digital 2.6 2.8 3.0 V 1.6 1.8 2.0 V VIH Input high Voltage 0.7xVDDIO 3.0 V VIL Input low voltage 0 0.3xVDDIO V VOH Output high voltage@8ma 0.7xVDDIO V VOL Output low voltage@8ma 0.3xVDDIO V T Junction Temperature -20 25 70 C Examination Item No. Reliability Items Condition 1 Temp Cycle -20 C ~ 70 C each 30 min, 24 cycles 2 High Temp. & Humidity storage 70 C / 80% / 72Hr 3 Low Temp. & Humidity storage -20 C / 96Hr natural dry, for 3 hours 4 High Temp Operating 70 C / 80% / 72Hr / 2.8V other pins are active condition 5 Low Temp Operating -20 C / 72Hr / 2.8V other pins are active condition 6 Drop Test 1.5m drop, 1 X 6 plane ( Camera with 100g cradle ) 7 Random Vibration 5~100HZ, 3 axis (X,Y,Z),15min/axis,swing :6mm Superpix Specification 16

Package Superpix Specification 17

Figure 9 Pin Name Superpix Specification 18

Figure 10 Package Dimensions Figure 11 Pin Description Superpix Specification 19

Revision History Version # Date Modification Commercial 1.0 2011.10.17 1. The first version only for customers. Commercial 1.1 2011.10.18 1. edit key performance parameters: power consumption, dark current, and SNR. Commercial 1.2 2011.10.24 1. add package description 2. this version is only for TSV package Commercial 1.3 2011.11.22 1. edit figure4 2. edit I 2 C description Commercial 1.4 2011.12.08 1. edit application diagram 2. add electric characteristics including DC specifications and examination item 3. edit package and pin description Commercial 1.5 2011.12.12 1. edit table 2 package dimensions Commercial 1.6 2012.03.23 1. edit pixel array structure Commercial 1.7 2012.03.26 1. add Package chapter Superpix Specification 20