SN75ALS164 OCTAL GENERAL-PURPOSE INTERFACE BUS TRANSCEIVER

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Transcription:

8-Channel Bidirectional Transceiver Designed to Implement Control Bus Interface Designed for Multiple-Controller Systems High-Speed Advanced Low-Power Schottky Circuitry Low-Power Dissipation...46 mw Max Per Channel Fast Propagation Times... 0 ns Max High-Impedance pnp Inputs Receiver Hysteresis...650 mv Typ Bus-Terminating Resistors Provided on Driver Outputs No Loading of Bus When Device Is Powered Down (V CC = 0) Power-Up/Power-Down Protection (Glitch Free) description GPIB I/O Ports SC TE REN IFC NDAC NRFD DAV EOI ATN SRQ NC GND DW PACKAGE (TOP VIEW) 4 5 6 7 8 9 0 NC No internal connection 4 0 9 8 7 6 5 4 V CC ATN + EOI REN IFC NDAC NRFD DAV EOI ATN SRQ NC DC Terminal I/O Ports NOT RECOMMENDED FOR NEW DESIGNS The SN75ALS64 eight-channel general-purpose interface bus transceiver is a monolithic, high-speed, advanced low-power Schottky device designed to meet the requirements of IEEE Standard 488-978. Each transceiver is designed to provide the bus-management and data-transfer signals between operating units of a multiple-controller instrumentation system. When combined with the SN75ALS60 octal bus transceiver, the SN75ALS64 provides the complete 6-wire interface for the IEEE 488 bus. The SN75ALS64 features eight driver-receiver pairs connected in a front-to-back configuration to form input/output (I/O) ports at both the bus and terminal sides. All outputs are disabled (at the high-impedance state) during V CC power-up and power-down transitions for glitch-free operation. The direction of data flow through these driver-receiver pairs is determined by the DC, TE, and SC enable signals. The SN75ALS64 is identical to the SN75ALS6 with the addition of an OR gate to help simplify board layouts in several popular applications. The ATN and EOI signals are ORed to provide the ATN + EOI output, which is a standard totem-pole output. The driver outputs (GPIB I/O ports) feature active bus-terminating resistor circuits designed to provide a high impedance to the bus when supply voltage V CC is 0. The drivers are designed to handle loads up to 48 ma of sink current. Each receiver features pnp transistor inputs for high input impedance and hysteresis of 400 mv minimum for increased noise immunity. All receivers have -state outputs that present a high impedance to the terminal when disabled. The SN75ALS64 is characterized for operation from 0 C to 70 C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 998, Texas Instruments Incorporated POST OFFICE BOX 6550 DALLAS, TEXAS 7565

CHANNEL IDENTIFICATION TABLE NAME IDENTITY CLASS DC TE SC ATN SRQ REN IFC EOI Direction-Control Talk-Enable System Control Attention Service Request Remote Enable Interface Clear End or Identity Control ATN+EOI ATN Logical or EOI Logic DAV NDAC NRFD Data Valid No Data Accepted Not Ready for Data Bus Management Data Transfer Function Tables RECEIVE/TRANSMIT FUNCTION TABLE CONTROLS BUS-MANAGEMENT CHANNELS DATA-TRANSFER CHANNELS SC DC TE ATN ATN SRQ REN IFC EOI DAV NDAC NRFD H H H H H L L L H L L L (controlled by DC) (controlled by SC) (controlled by TE) R T T R T R R T T R R R T T H L X R T R R T T L H X T R T T R R H T T L R R H = high level, L = low level, R = receive, T = transmit, X = irrelevant Direction of data transmission is from the terminal side to the bus side, and the direction of data receiving is from the bus side to the terminal side. Data transfer is noninverting in both directions. ATN is a normal transceiver channel that functions additionally as an internal direction control or talk enable for EOI when the DC and TE inputs are in the same state. When DC and TE are in opposite states, the ATN channel functions as an independent transceiver only. ATN + EOI FUNCTION TABLE INPUTS OUTPUT ATN EOI ATN + EOI H X H X H H L L L POST OFFICE BOX 6550 DALLAS, TEXAS 7565

logic symbol logic diagram (positive logic) DC TE SC ATN 6 7 EOI 5 SRQ REN IFC 8 DAV 0 NDAC 9 NRFD EN/G4 EN/G5 EN 5 EN6 4 6 6 9 8 0 4 7 5 6 ATN ATN + EOI EOI SRQ REN IFC DAV NDAC NRFD DC TE SC ATN 6 9 EOI 7 8 SRQ 5 0 REN IFC 4 DAV 8 7 ATN ATN + EOI EOI SRQ REN IFC DAV This symbol is in accordance with ANSI/IEEE Std 9-984 and IEC Publication 67-. Designates -state outputs Designates passive-pullup outputs NDAC NRFD 0 9 5 6 NDAC NRFD POST OFFICE BOX 6550 DALLAS, TEXAS 7565

schematics of inputs and outputs EQUIVALENT OF ALL CONTROL INPUTS TYPICAL OF SRQ, NDAC, AND NRFD GPIB I/O PORT V CC 9 kω NOM.7 kω NOM 0 kω NOM V CC Input 4 kω NOM GND Input/Output Port GND Circuit inside dashed lines is on the driver outputs only. TYPICAL OF ALL I/O PORTS EXCEPT SRQ, NDAC, AND NRFD GPIB I/O PORTS ATN + EOI OUTPUT V CC R eq.7 kω NOM 0 kω NOM V CC 8 kω 00 kω 4 kω NOM 4 kω NOM 4.6 kω Output Input/Output Port GND. kω.5 kω Driver output R eq = 0 Ω NOM Receiver output R eq = 0 Ω NOM Circuit inside dashed lines is on the driver outputs only. GND absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, V CC (see Note )............................................................. 7 V Input voltage............................................................................. 5.5 V Low-level driver output current............................................................ 00 ma Package thermal impedance, θ JA (see Note )............................................. 8 C/W Storage temperature range, T stg.................................................. 65 C to 50 C Lead temperature,6 mm (/6 inch) from the case for 0 seconds............................ 60 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES:. All voltage values are with respect to network ground terminal.. The package thermal impedance is calculated in accordance with JESD 5. 4 POST OFFICE BOX 6550 DALLAS, TEXAS 7565

recommended operating conditions MIN NOM MAX UNIT Supply voltage, VCC 4.75 5 5.5 V High-level input voltage, VIH V Low-level input voltage, VIL 0.8 V Bus ports with -state outputs 5. ma High-level output current, IOH Terminal ports 800 ATN + EOI 400 µa Bus ports 48 Low-level output current, IOL Terminal ports 6 ma ATN + EOI 4 Operating free-air temperature, TA 0 70 C electrical characteristics over recommended supply-voltage and operating free-air temperature ranges (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIK Input clamp voltage II = 8 ma 0.8 Vhys Hysteresis (VT+ VT ) Bus 0.4 0.65 V Terminal IOH = 800 µa.7.5 VOH High-level output voltage Bus IOH = 5. ma.5. V ATN+EOI IOH = 400 µa.7 Terminal IOL = 6 ma 0. 0.5 VOL Low-level output voltage Bus IOL = 48 ma 0.5 0.5 V ATN+EOI IOL = 4 ma 0.4 Input current at maximum input Terminal VI = 5.5 V 0. 00 II voltage ATN, EOI VI = 5.5 V 00 IIHIH IILIL High-level input current Low-level input current Terminal control VI =.7 V 0. 0 ATN, EOI VI =.7 V 40 Terminal control VI/O(bus) Voltage at bus port Driver disabled II/O(bus) I/O(bus) Current into bus port VI = 0.5 V 0 00 ATN, EOI VI = 0.5 V 500 II(bus) = 0.5.0.7 II(bus) = ma.5 VI(bus) = to 0.4 V. VI(bus) = 0.4 V to.5 V 0. +.5 Power on Driver disabled VI(bus) =.5 V to.7 V. VI(bus) =.7 V to 5 V 0.5 VI(bus) = 5 V to 5.5 V 0.7.5 Power off VCC = 0, VI(bus) = 0 to.5 V 40 µa Terminal 5 5 75 IOS Short-circuit output current Bus 5 50 5 ma ATN + EOI 0 00 ICC Supply current No load, TE, DC, and SC low 55 75 ma CI/O(bus) Bus-port capacitance VCC = 0 to 5 V, VI/O = 0 to V, f = MHz 0 pf All typical values are at VCC = 5 V, TA = 5 C. VOH applies for -state outputs only. Except ATN and EOI terminals. µa µa µa V ma POST OFFICE BOX 6550 DALLAS, TEXAS 7565 5

switching characteristics over recommended operating free-air temperature range, V CC = 5 V tplh tphl tplh tphl tplh tphl PARAMETER Propagation delay time, low-to-high-level output Propagation delay time, high-to-low-level output Propagation delay time, low-to-high-level output Propagation delay time, high-to-low-level output Propagation delay time, low-to-high-level output Propagation delay time, high-to-low-level output FROM (INPUT) Terminal TO (OUTPUT) Bus TEST CONDITIONS CL = 0 pf, See Figure CL = 0 pf, Bus Terminal See Figure Terminal ATN or Terminal EOI Terminal ATN or Terminal EOI ATN+EOI ATN+EOI CL = 5 pf, See Figure CL = 5 pf, See Figure MIN TYP MAX UNIT 0 0 0 5 0 7 4 ns ns.5 0 ns 7 5 ns tpzh Output enable time to high level 0 tphz Output disable time from high level Bus (ATN, EOI, CL = 5 pf, 0 TE, DC, or SC REN, IFC, and tpzl Output enable time to low level See Figure 4 DAV) 45 tplz Output disable time from low level 0 tpzh Output enable time to high level 0 tphz Output disable time from high level CL = 5 pf, 5 TE, DC, or SC Terminal tpzl Output enable time to low level See Figure 5 0 tplz Output disable time from low level 5 ns ns 6 POST OFFICE BOX 6550 DALLAS, TEXAS 7565

PARAMETER MEASUREMENT INFORMATION 5 V 00 Ω From (bus) Output Under Test Test Point CL = 0 pf (see Note A) 480 Ω Terminal Input Bus Output tplh LOAD CIRCUIT (see Note B) tphl. V.0 V V 0 V VOH VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The input pulse is supplied by a generator having the following characteristics: PRR MHz, 50% duty cycle, tr 6 ns, tf 6 ns, ZO = 50 Ω. Figure. Terminal-to-Bus Load Circuit and Voltage Waveforms 4. V 40 Ω From (terminal) Output Under Test Test Point CL = 0 pf (see Note A) kω LOAD CIRCUIT Bus Input V (see Note B) 0 V tplh tphl Terminal Output VOH VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The input pulse is supplied by a generator having the following characteristics: PRR MHz, 50% duty cycle, tr 6 ns, tf 6 ns, ZO = 50 Ω. Figure. Bus-to-Terminal Load Circuit and Voltage Waveforms POST OFFICE BOX 6550 DALLAS, TEXAS 7565 7

PARAMETER MEASUREMENT INFORMATION Test Point VCC kω Terminal ATN +EOI V 0 V From ATN +EOI CL (see Note A) (see Note B) tplh ATN + EOI tphl VOLTAGE WAVEFORMS VOH VOL LOAD CIRCUIT NOTES: A. CL includes probe and jig capacitance. B. All diodes are N96 or N064 Figure. ATN + EOI Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 6550 DALLAS, TEXAS 7565

PARAMETER MEASUREMENT INFORMATION S 5 V From (bus) Output Under Test 00 Ω CL = 5 pf (see Note A) 480 Ω Test Point LOAD CIRCUIT V Control Input tpzh Bus Output S Open tpzl Bus Output S Closed (see Note B) tphz V tplz V 90% 0.5 V 0 V VOH 0 V.5 V VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The input pulse is supplied by a generator having the following characteristics: PRR MHz, 50% duty cycle, tr 6 ns, tf 6 ns, ZO = 50 Ω. Figure 4. Bus Load Circuit and Voltage Waveforms POST OFFICE BOX 6550 DALLAS, TEXAS 7565 9

PARAMETER MEASUREMENT INFORMATION From (terminal) Output Under Test S 40 Ω 4. V Test Point CL = 5 pf (see Note A) kω LOAD CIRCUIT Control Input tpzh Terminal Output S Open tpzl Terminal Output S Closed (see Note B) tphz tplz V 90% 0.7 V V 0 V VOH 0 V 4 V VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The input pulse is supplied by a generator having the following characteristics: PRR MHz, 50% duty cycle, tr 6 ns, tf 6 ns, ZO = 50 Ω. Figure 5. Terminal Load Circuit and Voltage Waveforms 0 POST OFFICE BOX 6550 DALLAS, TEXAS 7565

TYPICAL CHARACTERISTICS TERMINAL HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT TERMINAL LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 4 0.6 High-Level Output Voltage V.5.5.5 VCC = 5 V TA = 5 C Low-Level Output Voltage V 0.5 0.4 0. 0. VCC = 5 V TA = 5 C V OH 0.5 V OL 0. 0 0 5 0 5 0 5 0 5 40 IOH High-Level Output Current ma Figure 6 0 0 0 0 0 40 50 60 IOL Low-Level Output Current ma Figure 7 TERMINAL OUTPUT VOLTAGE vs BUS INPUT VOLTAGE 4.5 VCC = 5 V No Load TA = 5 C Output Voltage V.5.5 VT VT+ V O 0.5 0 0 0. 0.4 0.6 0.8..4.6.8 VI Input Voltage V Figure 8 POST OFFICE BOX 6550 DALLAS, TEXAS 7565

TYPICAL CHARACTERISTICS BUS HIGH-LEVEL OUTPUT VOLTAGE vs BUS HIGH-LEVEL OUTPUT CURRENT BUS LOW-LEVEL OUTPUT VOLTAGE vs BUS LOW-LEVEL OUTPUT CURRENT High-Level Output Voltage V V OH 4 VCC = 5 V TA = 5 C Low-Level Output Voltage V V OL 0.6 0.5 0.4 0. 0. 0. VCC = 5 V TA = 5 C 0 0 0 0 0 40 50 60 0 0 0 0 0 40 50 60 70 80 90 00 IOH High-Level Output Current ma Figure 9 IOL Low-Level Output Current ma Figure 0 BUS OUTPUT VOLTAGE vs TERMINAL INPUT VOLTAGE BUS CURRENT vs BUS VOLTAGE Output Voltage V V O 4 VCC = 5 V No Load TA = 5 C II/O(bus) Bus Current ma 0 4 5 6 VCC = 5 V TA = 5 C The Unshaded Area Conforms to Paragraph.5. of IEEE Standard 488-978 0 0.9....4 VI Input Voltage V Figure.5.6.7 7 0 4 5 6 VI/O(bus) Bus Voltage V Figure POST OFFICE BOX 6550 DALLAS, TEXAS 7565

PACKAGE OPTION ADDENDUM www.ti.com 7-Mar-07 PACKAGING INFORMATION Orderable Device Status () Package Type Package Drawing Pins Package Qty Eco Plan SN75ALS64DW ACTIVE SOIC DW 4 5 Green (RoHS & no Sb/Br) SN75ALS64DWR ACTIVE SOIC DW 4 000 Green (RoHS & no Sb/Br) () Lead/Ball Finish (6) MSL Peak Temp () Op Temp ( C) Device Marking (4/5) CU NIPDAU Level--60C-UNLIM 0 to 70 75ALS64 CU NIPDAU Level--60C-UNLIM 0 to 70 75ALS64 Samples () The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. () Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either ) lead-based flip-chip solder bumps used between the die and package, or ) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.% by weight in homogeneous material) () MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page

PACKAGE OPTION ADDENDUM www.ti.com 7-Mar-07 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page

PACKAGE MATERIALS INFORMATION www.ti.com 4-Jul-0 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W (mm) A0 (mm) B0 (mm) K0 (mm) P (mm) W (mm) Pin Quadrant SN75ALS64DWR SOIC DW 4 000 0.0 4.4 0.75 5.7.7.0 4.0 Q Pack Materials-Page

PACKAGE MATERIALS INFORMATION www.ti.com 4-Jul-0 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN75ALS64DWR SOIC DW 4 000 67.0 67.0 45.0 Pack Materials-Page

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TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED AS IS AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 6949 and ISO 66), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q00, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer s noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 6550, Dallas, Texas 7565 Copyright 07, Texas Instruments Incorporated