CPC176 Single-Pole, Normally Open 4-Pin OptoMOS DC Power SIP Relay Parameter Rating Units Blocking Voltage 6 V P Load Current 4 A DC On-Resistance (max).9 Features Handle Load Currents Up to 4A DC 2V rms Input/Output Isolation Power SIP Package High Reliability Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Flammability Rating UL 94 V- Applications Industrial Controls Motor Control Robotics Medical Equipment Patient/Equipment Isolation Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) IC Equipment Home Appliances Description IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS technology, reliability, and compact size to a new family of high power solid state relays. The CPC176, a DC-switching, normally open (1-Form-A) Solid State Relay, is part of that family. Employing optically coupled MOSFET technology, the CPC176 provides 2V rms of input to output isolation. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. Approvals UL 8 Certified Component: File E69938 CSA Certified Component: Certificate 11727 Ordering Information Part # CPC176Y Pin Configuration Description 4-Pin (8-Pin Body) Power SIP Package (2 per tube) Switching Characteristics of Normally Open Devices Form-A 9% 1% I LOAD t on t off DS-CPC176-R4 www.ixysic.com 1
CPC176 Absolute Maximum Ratings @ 2ºC Parameter Min Max Units Blocking Voltage - 6 V P Reverse Input Voltage - V Input control Current - ma Peak (1ms) - 1 A Input Power Dissipation 1 - mw Total Power Dissipation 2-16 mw Isolation Voltage, Input to Output - 2 V rms Operational Temperature -4 +8 C Storage Temperature -4 +12 C 1 Derate linearly 3.33 mw / ºC 2 Derate linearly 16.667 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +2 C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 2ºC (Unless Otherwise Noted) Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current, Continuous =ma, Free air I L - - 4 A DC Peak Load Current =ma, t=1ms I LPK - - 9 A On-Resistance 1 =ma, I L =1A R ON -.7.9 Off-State Leakage Current =ma, V L =6V P I LEAK - - 1 µa Switching Speeds Turn-On t =ma, V L =1V on -. Turn-Off t off -.8 2 ms Output Capacitance =ma, V L =V, f=1mhz C OUT - 7 - pf Input Characteristics Input Control Current to Activate I L =1A - 1.4 ma Input Control Current to Deactivate -.4 - - ma Input Voltage Drop =ma V F.9 1.2 1.4 V Reverse Input Current V R =V I R - - 1 µa Input/Output Characteristics Capacitance Input-to-Output V IO =V, f=1mhz C IO - 2 - pf 1 Measurement taken within 1 second of on-time. Thermal Characteristics Parameter Conditions Symbol Min Typ Max Units Thermal Impedance (junction to case) - JC - 1. - C/W 2 www.ixysic.com R4
CPC176 PERFORMANCE DATA @2ºC (Unless Otherwise Noted)* 3 Typical LED Forward Voltage Drop (N=, =ma) 2 Typical Turn-On Time (N=, =ma, I L 2 Typical Turn-Off Time (N=, =ma, I L 2 2 1 2 1 1 1.23 1.24 1.24 1.2 1.2 1.26 1.26 LED Forward Voltage (V).29.37.46.4.63.7.8 Turn-On Time (ms).7.8.8.9.9.1. Turn-Off Time (ms) 2 Typical for Switch Operation (N=, I L 2 Typical On-Resistance Distribution (N=, =ma, I L 2 Typical Blocking Voltage Distribution (N=) 1 1 1 1.1 1.2 1.4 1. 1.6 1.8 LED Current (ma).8.62.66.7.74.78.82 On-Resistance ( ) 81. 81. 82. 82. 83. 83. 84. Blocking Voltage (V P ) 1.6 Typical LED Forward Voltage Drop 12 Typical Turn-On vs. LED Forward Current Typical Turn-Off vs. LED Forward Current LED Forward Voltage (V) 1. 1.4 1.3 =ma 1.2 =2mA =1mA =ma 1.1-4 -2 2 4 6 8 1 Turn-On Time ( s) 1 8 6 4 2 1 2 3 4 LED Forward Current (ma) Turn-Off Time ( s) 1 9 9 8 1 2 3 4 LED Forward Current (ma) LED Forward Current (ma) 1.8 1.7 1.6 1. 1.4 Typical for Switch Operation 1.3-4 -2 2 4 6 8 1 Turn-On Time ( s) Typical Turn-On 6 6 =ma 4 4 3 3 =1mA 2 2-4 -2 2 4 6 8 1 Turn-Off Time ( s) 13 12 11 1 9 8 Typical Turn-Off =ma =1mA 7-4 -2 2 4 6 8 1 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R4 www.ixysic.com 3
CPC176 PERFORMANCE DATA @2ºC (Unless Otherwise Noted)* On-Resistance ( ).1.9.8.7.6 DC-Only On-Resistance ( =ma, I L. -4-2 2 4 6 8 1 Load Current (A) Typical Load Current vs. Load Voltage ( =ma) 4. 3. 3. 2. 2. 1. 1......1..2.2.3 Load Voltage (V) Load Current (A) 4. 4. 3. 3. 2. 2. Maximum Load Current 1. -4-2 2 4 6 8 1 Blocking Voltage (V P ) Blocking Voltage 86 84 82 8 78 76-4 -2 2 4 6 8 1 Leakage Current (na) 7 6 4 3 2 1 Typical Leakage Measured Across Pins 3 & 4 (V L =6V) -4-2 2 4 6 8 1 Output Capacitance (pf) Output Capacitance vs. Load Voltage 4 4 3 3 2 2 1 1 2 3 4 6 Load Voltage (V) 16 Energy Rating Curve Load Current (A) 12 8 4 1 s 1 s 1ms 1ms 1ms 1s 1s 1s Time * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R4
CPC176 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Classification CPC176Y MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Soldering Profile Provided in the table below is the Classification Temperature (T C ) of this product and the maximum dwell time the body temperature of this device may be above (T C - )ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other processes, the guidelines of J-STD-2 must be observed. Board Wash Device Classification Temperature (T c ) Dwell Time (t p ) Max Reflow Cycles CPC176Y 24ºC 3 seconds 1 IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. Cleaning methods that employ ultrasonic energy should not be used. R4 www.ixysic.com
CPC176 MECHANICAL DIMENSIONS Pin 1 21.82±.381 (.83±.) 1.778 (.7) 1.16±.127 (.4±.).762±.76 1.16±.127 (.3±.3) (.4±.) 1.61±.12 (.6±.4) 2.4±.127.8±.127 (.1±.) (.2±.) 1.16±.127 (.4±.) 3.32±.1 (.13±.2) 7º TYP 4 Places 4.72±.127 (.18±.).381±.13 (.±.) 1.778 (.7) 1.7 (.69) Pin 1 PCB Hole Pattern 1. DIA. x4 (.4 DIA. x4).8 (.2) 1.16 (.4) 2.4 (.1) 7º TYP 4 Places Note: Pin-to-pin tolerances are non-cumulative. Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC176-R4 Copyright 216, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. /4/216