Features. Parameter Frequency Min. Typ. Max. Units

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v1.6 Typical Applications The HMC545A / HMC545AE is ideal for: Cellular/3G Infrastructure Private Mobile Radio Handsets WLAN, WiMAX & WiBro Automotive Telematics Test Equipment Functional Diagram Features Low Insertion Loss:.27 High Input IP3: +54 m Low DC Power Consumption Positive Control: /+3V to /+8V Ultra Small Package: SOT26 General Description The HMC545A and HMC545AE are low-cost SPDT switches in 6-lead SOT26 plastic packages for use in general switching applications which require very low insertion loss and very small size. With. typical loss, these devices can control signals from DC to 3. GHz and are especially suited for IF and RF applications including Cellular/3G, ISM, automotive and portables. The design provides exceptional insertion loss performance, ideal for filter and receiver switching. RF1 and RF2 are reflective shorts when Off. The two control voltages require a minimal amount of DC current and offer compatibility with CMOS and some TTL logic families. Electrical Specifications T A = + C, Vctl = /+5 Vdc (Unless Otherwise Stated), 5 Ohm System Insertion Loss Isolation Return Loss Input Power for 1 Compression Input Third Order Intercept (Two-tone Input Power = +17 m Each Tone) Switching Characteristics Parameter Frequency Min. Typ. Max. Units Vctl = /+3V Vctl = /+5V Vctl = /+8V Vctl = /+3V Vctl = /+5V Vctl = /+8V trise, tfall (1/9% RF) ton, toff (5% CTL to 1/9% RF) DC - 1. GHz DC - 2.5 GHz DC - 3. GHz DC - 2. GHz DC - 2.5 GHz DC - 3. GHz DC - 1. GHz DC - 2. GHz DC - 2.5 GHz DC - 3. GHz.5-3. GHz.5-3. GHz DC - 3. GHz 26 22 19 2 27.27.3.4 31 26 22 24 2 19 17 23 33 31 51 54 7 9.4.5.7 m m m m m m ns ns 1

v1.6 Insertion Loss Return Loss INSERTION LOSS () -.5-1 -1.5-2.5 1 1.5 2 2.5 3 3.5 4 + C +85 C - C Isolation Between Ports RFC and RF1/RF2 RETURN LOSS () -5-1 - -2 - - - -.5 1 1.5 2 2.5 3 3.5 4 RFC RF1, RF2 ON Isolation Between Ports RF1 and RF2-5 -1-5 -1 ISOLATION () - -2 - - ISOLATION () - -2 - - - - - - -45.5 1 1.5 2 2.5 3 3.5 4-45.5 1 1.5 2 2.5 3 3.5 4 RF1 RF2 RF1 ON RF2 ON Input P.1 vs. Vctl Input P1 vs. Vctl INPUT P.1 (m) 2 1 5.5 1 1.5 2 2.5 3 INPUT P1 (m) 2 1 5.5 1 1.5 2 2.5 3 2

v1.6 Low Frequency Input P.1 vs. Vctl Low Frequency Input P1 vs. Vctl INPUT P.1 (m) Input Third Order Intercept Point vs. Control Voltage INPUT IP3 (m) 2 1.1.1 1 7 65 6 55 5 45.5 1 1.5 2 2.5 3 INPUT P1 (m) 2 1.1.1 1 Absolute Maximum Ratings RF Input Power (Vctl = /+8V) Control Voltage Range (A & B) Hot Switch Power Level (Vctl = /+8V) +34 m -.2 to +12 Vdc +32 m Channel Temperature C Continuous Pdiss (T= 85 C) (derate 5.6 mw/ C above 85 C) Thermal Resistance.1 W 169 C/W Storage Temperature -65 to + C Operating Temperature - to +85 C ESD Sensitivity (HBM) Class 1A DC blocks are required at ports RFC, RF1 and RF2. Insertion Loss, T = + C INPUT IP3 (m) 7 65 6 55 5 45.5 1 1.5 2 2.5 3 Truth Table Control Voltages State Low High ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Control Input Control Current A B RFC to RF1 RFC to RF2 Low High Off On High Low On Off Bias Condition to.2 Vdc @ 1 µa Typical +3 Vdc @.5 µa Typical to +8 Vdc @ 14 µa Typical (±.2 Vdc) 3

v1.6 Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF.mm PER SIDE. 5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking HMC545A Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H545A HMC545AE RoHS-compliant Low Stress Injection Molded Plastic 1% matte Sn MSL1 [2] 545AE [1] Max peak reflow temperature of 2 C [2] Max peak reflow temperature of 26 C 4

v1.6 Typical Application Circuit Notes: 1. Set logic gate Vdd = +3V to +5V and use HCT series logic to provide a TTL driver interface. 2. Control inputs A/B can be driven directly with CMOS logic (HC) with Vdd of +3V to +8V applied to the CMOS logic gates. 3. DC Blocking capacitors are required for each RF port as shown. Capacitor value determines lowest frequency of operation. 4. Highest RF signal power capability is achieved with Vdd = +8V and A/B set to /+8V. Pin Descriptions Pin Number Function Description Interface Schematic 1, 3, 5 RF2, RF1, RFC These pins are DC coupled and matched to 5 Ohms. Blocking capacitors are required. 2 GND This pin must be connected to RF/DC ground. 4 B See truth and control voltage tables. 6 A See truth and control voltage tables. 5

v1.6 Evaluation PCB List of Materials for Evaluation PCB EV1HMC545A [1] Item J1 - J3 J4 - J6 R1 - R2 C1 - C3 U1 PCB [2] Description PCB Mount SMA RF Connector DC Pin 1K Ohm resistor, 2 Pkg. 3 pf capacitor, 2 Pkg. HMC545A / HMC545AE SPDT Switch 11659 Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers The circuit board used in the application should be generated with proper RF circuit design techniques. Signal lines at the RF port should have 5 Ohm impedance and the package ground leads should be connected directly to the ground plane similar to that shown above. The evaluation circuit board shown above is available from Hittite Microwave Corporation upon request. 6