Microcomputer Peripheral LSIs CMOS LSIs for oltage Detection Overview The MN1380 series are elements that monitor the power supply voltage supplied to microcomputers and other LSI systems and issue reset signals for initializing the system after the power is first applied or for preventing runaway operation when the supply voltage fluctuates. There is a choice of three output types: CMOS output, N-channel open drain output, and inverted CMOS output. There are also three package types: M, TO-92, and a mini type for surface mounting. Choose the ideal element for your application from the series' wide selection of detection ranks (17 ranks between 2.0 and 4.9 volts), output types, and package types. Features Three-pin element requiring no adjustment Wide selection of detection ranks (17 ranks between 2.0 and 4.9 volts) Highly precise detection voltage Detection voltage with hysteresis characteristic D = 50 m for ranks C to K D = 100 m for ranks L to U Low current consumption: I DD = 1µA (typ.) for = 5 Low fluctuation in detection voltage with temperature (typ. 1 m/ C) Wide selection of output types: CMOS output, N- channel open drain output, and inverted CMOS output Wide selection of package types: M, TO-92, and a mini type for surface mounting. Applications Battery checkers Power outage detectors Level discriminators Memory backup systems Microcomputer reset circuits Reset circuits for other electronic circuits Pin Assignment 23 MN1380 - R 3 2 1 M type package 1381 23R 1 2 3 TO-92 type package 1 2 LCR 3 Mini type package 1= 2= 3= SS 1
Microcomputer Peripheral LSIs Naming Conventions The MN1380 series offers a wide selection of detection ranks, output types, package types, and packaging. All combinations use the following naming conventions. When ordering, be sure to give the correct part number using these naming conventions. MN13801 R (TA) Winding direction for tape packaging (TA)... Tape packaging for TO-92 type package (TX)... Embossed tape packing for mini type package (TW)... Embossed tape packing for mini type package For further details, see the package specifications. Detection voltage rank (C to U) Output type: Blank CMOS output 1 N-channel open drain output 2 inverted CMOS output Package: 0 M type package 1 TO-92 type package 2 Mini type package Matsushita Electronics Corporation MN1380 series of voltage detection CMOS LSIs with low current consumptions (Example) MN13821 R (TW) Embossed tape packaging R rank (detection voltage of 4.0 to 4.3 ) N-channel open drain output Mini type package MN1380 series of voltage detection CMOS LSIs with low current consumption Minimum Packaging Unit Bulk (M and TO-92 types) 1,000 Magazine (Mini type) 50 Taping (Mini and TO-92 types) 3,000 2
Microcomputer Peripheral LSIs Series Lineup Output Package M type Package TO-92 type Package Mini type Package CMOS output MN1380 MN1381 MN1382 N-channel open drain output MN13801 MN13811 MN13821 Inverted CMOS output MN13802 MN13812 MN13822 Detection Ranks (on oltage) Detection oltage for Drop in Power Supply oltage ( Rank DL ) Detection oltage Hysteresis Width ( D) Unit min max min max C 2.0 2.2 D 2.1 2.3 E 2.2 2.4 F 2.3 2.5 G 2.4 2.6 H 2.5 2.7 J 2.6 2.9 K 2.8 3.1 L 3.0 3.3 M 3.2 3.5 N 3.4 3.7 P 3.6 3.9 Unit 50 300 m 50 300 m Q 3.8 4.1 100 300 m R 4.0 4.3 S 4.2 4.5 T 4.4 4.7 U 4.6 4.9 3
Microcomputer Peripheral LSIs Block Diagram 2 oltage Reference 1 Level Converter oltage Reference 2 + Comparator + Comparator *1 Output Circuit 1 3 SS Note *1: Circuits vary slightly depending on the output type (CMOS output, N-channel open drain output, or inverted CMOS output) Pin Descriptions Pin No. Symbol Function Description 1 Reset signal output pin 2 Power supply pin 3 SS Ground pin 4
Microcomputer Peripheral LSIs Absolute Maximum Ratings SS =0, Ta=25 C Parameter Symbol Rating Unit Power supply voltage 7.0 Output voltage O 0.3 to +0.3 Operating ambient temperature Ta 20 to +70 C Storage temperature T stg 55 to +125 C Recommended Operating Conditions SS =0, Ta=25 C Parameter Symbol Conditions min typ max Unit Power supply See Figures 1 and 4. 1.5 6.0 voltage Electrical Characteristics 1) DC Characteristics SS =0, Ta= 20 C to +70 C Parameter Symbol Conditions min typ max Unit Power supply current I DD = 5 *1 Load resistance = 10 kw 1 5 µa Detection voltage for drop DL in power supply voltage *2 Ta=25 C *2 *2 Detection voltage hysteresis See Figures 1 and 4. D width *2 *2 *2 m "H" level output voltage OH CMOS output I OH = 40µA 0.8 Inverted =1.8 0.8 CMOS output I OH = 0.5mA 1.5 "L" level output voltage OL N-channel open =1.8 SS 0.4 drain output I OL =0.7mA Inverted =6.0 SS 0.6 CMOS output I OH =0.3mA Notes *1: This includes the output pin's leakage current. *2: For particulars, see the detection voltage rank table. 5
Microcomputer Peripheral LSIs Electrical Characteristics (continued) 2) AC Characteristics SS =0, Ta=25 C Parameter Symbol Conditions Allowable alue (typ) MN1380 MN13801 MN13802 Unit MN1381 MN13811 MN13812 Rank MN1382 MN13821 MN13822 C D E 3.0 2.5 230.0 F G See H Reset release time t OH Figures J 3.0 3.0 100.0 µs 2 and 3. K L M N P Q 2.0 4.0 30.0 R S T C D E 250.0 160.0 3.0 F G See H Reset time t OL Figures J 115.0 100.0 3.0 µs 2 and 3. K L M N P Q 15.0 35.0 3.0 R S T 6
Microcomputer Peripheral LSIs Description of Operation DH DL 1.5 0 t CMOS output, N-channel open drain output MN1380/1381/1382 MN13801/13811/13821 t OH t OH t OL t OL 0 Inverted CMOS output Figure MN13802/13812/13822 t t OL t OL t OH t OH 0 t Figure 1. Description of Operation Notes 1: Output cannot be specified for power supply voltages under 1.5 because operation is not guaranteed for that range. 2: DL : Detection voltage for drop in power supply voltage DH : Detection voltage for rise in power supply voltage t OL : Time lag between the time that the power supply voltage reaches the detection voltage ( DL or DH ) and the time that the output pin () goes to "L" level. t OH : Time lag between the time that the power supply voltage reaches the detection voltage ( DL or DH ) and the time that the output pin () goes to "H" level. 3: These characteristics for the N-channel open drain output are when a load resistor is connected between the and pins. 7
Microcomputer Peripheral LSIs Description for Measuring the Output Characteristics 6.0 1.6 0 6.0 CMOS output, N-channel open drain output t MN1380/1381/1382 MN13801/13811/13821 1.5 t OH 1.0 t OL 0 Inverted CMOS output MN13802/13812/13822 t 6.0 1.6 1.5 t OH 1.0 t OH 0 t Figure 2. Description chart of Measuring the Output Characteristics 100kΩ Switch: Connect when measuring N-channel open drain output (MN13801/MN13811/MN13821) 100pF Figure 3. Circuit for Measuring the Output Characteristics 8
Microcomputer Peripheral LSIs Description for Measuring the I/O Characteristics CMOS output, N-channel open drain output MN1380/1381/1382 MN13801/13811/13821 D Operation indeterminate 0 0 1.5 DL DH Inverted CMOS output MN13802/13812/13822 D 0 Operation indeterminate 0 1.5 DL DH Figure 4. Description chart for Measuring the I/O Characteristics Notes 1: Output cannot be specified for power supply voltages under 1.5 because operation is not guaranteed for that range. 2: DL : Detection voltage for drop in power supply voltage DH : Detection voltage for rise in power supply voltage 3: These characteristics for the N-channel open drain output are when a load resistor is connected between the and pins. 9
Microcomputer Peripheral LSIs Application Circuit Example Connect resistors, capacitors, and the like only to the output pin on the MN1380 series element. Note that connecting them to the Power source pins changes DH, DL, and D. Sample Circuit 1 Sample Circuit 2 MN1380 Series MN1380 Series R C C Select the values of R and C to match the application. 10
Microcomputer Peripheral LSIs Package Dimensions (Unit:mm) M type package 6.9±0.2 1.5 1.5 2.5±0.2 1.0 0.4 1.0 4.5±0.2 0.7R 4.1±0.2 0.85 0.55±0.10 0.45±0.10 2.5±0.5 2.5±0.5 1 2 3 1.25 1.25 2.5 1.25 11
Microcomputer Peripheral LSIs Package Dimensions (continued)(unit:mm) TO-92 type package 5.0±0.2 4.0±0.2 13.5±0.5 5.1±0.2 0.45 +0.2-0.1 2.54 1 2 3 2.3±0.2 12
Microcomputer Peripheral LSIs Package Dimensions (continued)(unit:mm) Mini type package 2.9 +0.20-0.05 0.4 +0.10-0.05 2 1.5 1 3 0.95 0.95 1.9±0.2 0.8 1.1 +0.2-0.1 0.65±0.15 0.16 +0.10-0.05 +0.25-0.05 2.8 +0.2-0.3 0.3 0.4±0.2 0.1 13
Microcomputer Peripheral LSIs Reference Characteristics The following characteristics curves represent results from a specific sample therefore they do not guarantee the characteristics for the final product. 1.4 1.2 1.0 SS I DD (µa ) 0.8 0.6 A 0.4 0.2 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 () Figure 5.a. I DD vs. Characteristic (Rank Q) Figure 5.b. Measurement Circuit 2.0 1.5 SS I DD (µa ) A 1.0 5 0.5 40 20 0 20 40 60 80 Ambient temperature, Ta ( C) Figure 6.a. I DD Temperature Characteristic (Rank Q) Figure 6.b. Measurement Circuit 14
Microcomputer Peripheral LSIs Reference Characteristics (continued) 4.8 4.6 4.4 SS DL, DH () 4.2 4.0 3.8 DH DL 3.6 3.4 40 20 0 20 40 60 80 Temperature Ta( C) Figure 7.a. DL / DH Temperature Characteristic (Rank Q) Figure 7.b. Measurement Circuit 0.3 0.25 0.2 SS D() 0.15 0.1 0.05 0 40 20 0 20 40 60 80 Ambient temperature, Ta ( C) Figure 8.a. D Temperature Characteristic (Rank Q) Figure 8.b. Measurement Circuit 15
Microcomputer Peripheral LSIs Reference Characteristics (continued) 3 30 C Room temperature 80 C 2 SS I OL (ma) 1 1.8 A 0 0 0.5 1.0 1.5 2.0 2.5 3.0 OL () Figure 9.a. I OL vs. OL Characteristic Figure 9.b. Measurement Circuit 20 30 C Room temperature 15 80 C SS I OH (ma) 10 5 5 A 0 0 1 2 3 4 5 OL () Figure 10.a. I OH vs. OH Characteristic Figure 10.b. Measurement Circuit 16
Microcomputer Peripheral LSIs Reference Characteristics (continued) 2.5 2.0 SS 1.5 I OL (ma) 1.0 A 0.5 1.8 0 40 20 0 20 40 60 80 Ambient temperature, Ta ( C) Figure 11.a. I OL vs. Temperature Characteristic Figure 11.b. Measurement Circuit 7.0 6.5 SS I OH (ma) 6.0 5.5 5.0 5 A 4.5 40 20 0 20 40 60 80 Ambient temperature, Ta ( C) Figure 12.a. I OH vs. Temperature Characteristic Figure 12.b. Measurement Circuit 17
Microcomputer Peripheral LSIs TO-92 Type Package Taping-Specifications (MN1381/MN13811/MN13812) P1 P A1 h1 T 0 h2 H0 l1 H1 W0 W2 H t2 t1 A F1 F2 d W Drawing direction P0 ød0 Figure 13. TO-92 Type Package Taping-Dimensions (Ammunition pack) TO-92 Type Package Taping Dimensions (Ammunition pack) Name Symbol Length (mm) Product height* A 5.3 max Product width* A1 5.2 max Product thickness* T 4.2 max Lead width* d 0.45 Taped lead length l1 2.0 max Product pitch P 12.7±1.0 Feed hole pitch P0 12.7±0.3 Feed hole position P1 6.35±0.5 Lead spacing F1, F2 2.5 Product deflection angle h1, h2 2.0 max +0.15 0.1 +0.5 0.2 Tape width W 18.0 +1.0 0.5 Name Symbol Length (mm) Adhesive tape width W0 6.0±0.5 Feed hole position W1 9.0±0.5 Adhesive tape position W2 0.5 max Distance to top of product H 25.0 max Distance to bottom of product H0 19.0±0.5 Lead clinch height H1 16.0±0.5 Feed hole diameter D0 4.0±0.2 Tape thickness t1 0.7±0.2 Total tape thickness t2 1.5 max Note*1: For further details, see the specifications issued separately. 25 elements (example) W H D 330 250 41 Leave the space for at least three elements Unit: mm H E B W D Figure 14. Box Dimensions for TO-92 Type Packages with Ammunition pack 18
Microcomputer Peripheral LSIs Embossed Taping Specifications for Mini Type Package (MN1382/MN13821/MN13822) There is a choice of two orientations, TW and TX, for the product relative to the tape. TW Tape feed hole TX Tape feed hole Drawing direction Drawing direction (Marking surface on top) (Marking surface on top) Figure 15. TW Orientation Figure 16. TX Orientation 8.0±0.3 1.75±0.1 3.5±0.05 A ø1.5 +0.1-0 4.0±0.1 B 3.3±0.1 1.75±0.1 Unit: mm t+0.3±0.1 4.0±0.1 3.2±0.1 Product orientation A is labeled TW; orientation B, TX. Figure 17. Embossed Taping Dimensions for Mini Type Package ø21±0.8 Unit: mm 2±0.5 ø13±0.5 ø80±1.0 ø178±2.0 2±0.5 10±1.5 3,000 packages per reel Figure 18. Embossed Taping Reel Dimensions for Mini Type Package 19
Microcomputer Peripheral LSIs Reliability Testing Results for (1) M type package (MN1380/MN13801/MN13802) and TO-92 type package (MN1381/MN13811/MN13812) Test Subjects Test Conditions Results Operating lifetime test =5.5, Ta=125 C, t=1000hrs 0/15 High-temperature storage test Ta=150 C, t=1000hrs 0/15 Low-temperature storage test Ta= 65 C, t=1000hrs 0/15 High-temperature, Ta=85 C, RH=85%, t=1000hrs 0/15 high-humidity storage test High-temperature, =5.5, Ta=85 C, RH=85%, t=1000hrs 0/15 high-humidity bias test Thermal shock test Ta=150 C and 65 C. 0/15 Five minutes at each temperature for ten cycles Temperature cycle test Ta=150 C and 65 C. 0/15 Thirty minutes at each temperature for ten cycles Pressure cooker test Two atmospheres for 50 hours at ambient temperature (Ta) of 121 C 0/15 Soldering test Ambient temperature (Ta) of 230 C for five seconds 0/15 Solder heat resistance test Ambient temperature (Ta) of 270 C for ten seconds 0/15 (2) Mini type package (MN1382/MN13821/MN13822) Test Subjects Test Conditions Results Operating lifetime test =5.5, Ta=125 C, t=1000hrs 0/15 High-temperature storage test Ta=150 C, t=1000hrs 0/15 Low-temperature storage test Ta= 65 C, t=1000hrs 0/15 High-temperature, Ta=85 C, RH=85%, t=1000hrs 0/15 high-humidity storage test High-temperature, =5.5, Ta=85 C, RH=85%, t=1000hrs 0/15 high-humidity bias test Thermal shock test Ta=150 C and 65 C. 0/15 Five minutes at each temperature for ten cycles Temperature cycle test Ta=150 C and 65 C. 0/15 Thirty minutes at each temperature for ten cycles Pressure cooker test *1 Two atmospheres for 24 hours at ambient temperature (Ta) of 121 C 0/15 Soldering test Ambient temperature (Ta) of 230 C for five seconds 0/15 Solder heat resistance test *1 Ambient temperature (Ta) of 260 C for five seconds 0/15 Note*1: Note that the testing conditions for the mini package differ from those for the other two packages. 20