HLMP-Yxxx T-1 (3 mm) GaP/GaAsP LED Lamps Data Sheet Description This family of T-1 lamps is widely used in general purpose indicator and back lighting applications. The optical design is balanced to yield superior light output and wide viewing angles. Several intensity choices are available in each color for increased design flexibility. Features Low power consumption High efficiency Versatile mounting on PCB or panel I.C. Compatible/low current requirement Popular T-1 package RoHS compliant Applications Status indicator Backlighting front panels Light pipe sources Lighted switches Package Dimension.2.2 4.1 ±.2.161 ±.8 1..4 (MAX) 24..94 (MIN) 1..4 (MIN) CATHODE 3.8.1 3..138 3.1 ±.2.122 ±.8 2.4.1.4 x.4.18 x.16 TYP Notes: 1. All dimensions are in millimeter (inches). 2. Tolerance is ±.2 mm (.1) unless otherwise stated. 3. Lead spacing is measured where the leads emerge from the package.
Selection Guide Part Number Color Package Description Luminous Intensity, Iv (mcd) @ 1 ma Min. Typ. Max. HLMP-Y31-Fxx GaAsP HER Tinted, Non-diffused 6.1 19 4 -Gxx GaAsP Orange 9.7 29 4 -Fxx GaP Green 12 4 Viewing Angle, 2θ½ ( ) Part Numbering System HLMP Y x x x x x x xx Mechanical Options : Bulk Color Bin Options : Full Color Bin Distribution Maximum IV Bin Options : Open (no max. limit) Others: Please refer to the IV Bin Table Minimum IV Bin Options Please refer to the IV Bin Table Absolute Maximum Ratings at T A = 2 C Parameter HLMP-Y31 Units DC Forward Current 2 2 2 ma Peak Forward Current 9 6 12 ma (1/1 Duty Cycle,.1 ms Pulse Width) Reverse Voltage (I R = 1 μa) V Junction Temperature 11 11 11 C Power Dissipation 2 2 2 mw Storage Temperature Range -4 to +1 C Operating Temperature Range -4 to +1 C Solder Temperature 26 C sec 2
Electrical /Optical Characteristic at T A = 2 C Description Symbol Part Number Min. Typ. Max. Units Test Conditions Peak Wavelength λ PEAK HLMP-Y31 Dominant Wavelength λ d HLMP-Y31 Spectrum Half Width Δλ HLMP-Y31 Forward Voltage V F HLMP-Y31 Reverse Voltage V R HLMP-Y31 Thermal Resistance Rθ J-PIN HLMP-Y31 61 99. 61. 63 61 6 626 6 73 4 3 3 632 613. 76. nm nm Note 1 Notes: 1. The dominant wavelength, λ d, is derived from the Chromaticity Diagram and represents the color of the lamp. 2.1 2.1 2.2 31 31 31 2.6 2.6 2.6 nm V μa C/W Measurement at peak I F = 2 ma (Figure 1) I R = 1 μa Junction to Cathode Lead 3
FORWARD CURRENT-mA 2 18 16 14 12 1 8 6 4 2 GREEN HER, ORANGE 1 2 3 FORWARD VOLTAGE-V Figure 1. Forward Current vs. Forward Voltage RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 2 ma) 1.8.6.4.2 1 1 2 DC FORWARD CURRENT - ma Figure 2. Relative Luminous Intensity vs. Forward Current 2 1 FORWARD CURRENT - ma 2 1 1 NORMALIZED INTENSITY.7..2 1 2 3 4 6 7 8 9 AMBIENT TEMPERATURE - C Figure 3. Ambient Temperature vs. Maximum DC Forward Current -9-6 -3 3 6 9 ANGULAR DISPLACEMENT - DEGREES Figure 4. Relative Luminous Intensity vs. Angular Displacement for 1 1. NORMALIZED INTENSITY.7..2 RELATIVE INTENSITY.8..3 GREEN HER ORANGE -9-6 -3 3 6 9 ANGULAR DISPLACEMENT - DEGREES Figure. Relative Luminous Intensity vs. Angular Displacement for HLMP-Y31 and. 38 43 48 3 8 63 68 73 78 WAVELENGTH - nm Figure 6. Wavelength vs. Relative Luminous Intensity 4
Intensity Bin Limits Intensity Range (mcd) Color Bin Min. Max. HER/Orange F 6.1 9.7 G 9.7 1. H 1. 24.8 I 24.8 39.6 J 39.6 63.4 K 63.4 11. L 11. 162.4 M 162.4 234.6 N 234.6 34. O 34. 4. P 4. 8. Green F 12. 19.1 G 19.1 3.7 H 3.7 49.1 I 49.1 78. J 78. 12.7 K 12.7 21.1 L 21.1 289. M 289. 417. O 417. 68. Tolerance for each bin limit is ±1%. Color Bin Limits Table Lambda (nm) Color Category # Min. Max. Orange 2 99. 62. 3 62. 64. 4 64. 67. 67. 61. 6 61. 613. Green 6 61. 64. 64. 67. 4 67. 7. 3 7. 73. 2 73. 76. Tolerance for each bin limit is ±1. nm.
Precautions: Assembly method: This product is not meant for auto-insertion. Lead Forming: The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. During lead forming, the leads should be bent at a point at least 3mm from the base of the lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering at normal temperature. It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions: Care must be taken during PCB assembly and soldering process to prevent damage to LED component. The closest LED is allowed to solder on board is 1.9 mm below the body (encapsulant epoxy) for those parts without standoff. Recommended soldering conditions: Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 2 C, before handling. Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. Recommended PC board plated through-hole sizes for LED component leads: Led Component Lead Size.47 x.47 mm (.18 x.18 inch).8 x.8 mm (.2 x.2 inch) Diagonal.646 mm (.2 inch).718 mm (.28 inch) Plated Through Hole Diameter.976 to 1.78 mm (.38 to.42 inch) 1.49 to 1.1 mm (.41 to.4 inch) Note: Refer to application note AN127 for more information on soldering LED component. Wave Soldering Manual Solder Dipping Pre-heat Temperature 1 C Max. Preheat Time 6 sec Max Peak Temperature 2 C Max. 26 C Max. Dwell Time 3 sec Max. sec Max 6
2 TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC3 (Lead free solder alloy) Flux: Rosin flux TEMPERATURE ( C) 2 1 1 Solder bath temperature: 24 C ± C (maximum peak temperature = 2 C) Dwell time: 1. sec - 3. sec (maximum = 3 sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. PREHEAT 1 2 3 4 6 7 8 9 1 TIME (MINUTES) Figure 7. Recommended Wave Soldering Profile DISCLAIMER: Avago s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 2-211 Avago Technologies. All rights reserved. AV2-281EN - January 14, 211