ASMT-YTB0-0xxxx PLCC-6 Surface Mount Tricolor LED Data Sheet Description This family of Surface Mount Tricolor LEDs are housed in a PLCC-6 package. They are designed with a separate heat path for each LED die, enabling them to be driven at higher current. The high reliability package is able to withstand a wide range of environmental conditions making them ideally suited for interior and exterior full color sign applications. A super wide viewing angle of 115 combined with a built in reflector increase the intensity of the light output making these LEDs suitable for interior electronics signs applications. The black surface top provides better contrast enhancement especially in the full color sign applications. These LEDs are compatible with reflow soldering process and to facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Each reel will be shipped in single intensity and color bin; except red color to provide close uniformity. Features Industry Standard PLCC-6 package (Plastic Leaded Chip Carrier) with individual addressable pin-out for higher flexibility of driving configuration High reliability LED package with silicone encapsulation High brightness using AlInGaP and InGaN dice technologies Wide viewing angle at 115 Compatible with reflow soldering process JEDEC MSL 2a Water-Resistant (IPX6*) per IEC 60529:2001 * The test is conducted on component level by mounting the components on PCB with proper potting to protect the leads. It is strongly recommended that customers perform necessary tests on the components for their final application. Applications Indoor and outdoor full color display CAUTION:LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Please refer to Avago Application Note AN-1142 for additional details.
Package Dimensions 3.40 0.90±0.20 2.60±0.20 4.40±0.20 3.90 4 5 6 3 2 1 3.70±0.20 0.65 0.80 4.00±0.20 4.40±0.20 PIN 1 3.50±0.20 0.9±0.2 1.35 4 5 Red Green 3 2 Notes: 1. All Dimensions are in millimeters 2. Tolerance = ±0.2 mm unless otherwise specified 3. Terminal Finish: Ag plating 4. Encapsulantion material: silicone resin 6 Blue 1 Lead Configuration 1 Cathode Blue 2 Cathode Green 3 Cathode Red 4 Anode Red 5 Anode Green 6 Anode Blue Figure 1. Package drawing. Table 1. Device Selection Guide Part Number Color 1 Color 2 Color 3 ASMT-YTB0-0xxxx AlInGaP Red InGaN Green InGaN Blue Part Number Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) ASMT-YTB0-0AA02 U1 450 648 V2 900 1243 S2 224 238 Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance = ± 12 % 2 Color 1 - Red Color 2 - Green Color 3 - Blue Min. Iv @20mA Typ. Iv @20mA Min. Iv @ 20mA Typ. Iv @ 20mA Min. Iv @ 20mA Typ. Iv @ 20mA
Part Numbering System A S M T Y T B 0 X 1 X 2 X 3 X 4 X 5 Packaging Option Color Bin Selection Intensity Bin Limit Intensity Bin Selection Device Specification Configuration Table 2. Absolute Maximum Ratings (T A = 25 C) Parameter Red Green & Blue Unit DC forward current [1] 50 30 ma Peak forward current [2] 100 100 ma Power dissipation 120 117 mw Reverse voltage 4V [3] V Maximum junction temperature Tj max 125 C Operating temperature range - 40 to + 110 [4] C Storage temperature range - 40 to + 110 C Note: 1. Derate linearly as shown in Figure 5a & 5b. 2 Duty Factor = 0.5%, Frequency = 500Hz 3. Driving the LED in reverse bias condition is suitable for short term only 4 Refer to Figure 5a and figure 5b for more information Table 3. Optical Characteristics (T A = 25 C) Dominant Wavelength, λ d (nm) [5] Peak Wavelength, λ p (nm) Viewing Angle 2θ ½ [6] (Degrees) Luminous Efficac η V [7] (lm/w) Luminous Efficiency η e (lm/w) Total Flux / Luminous Intensity [8] Φ V / I V (lm/cd) Color Min Typ. Max Typ. Typ. Typ. Typ. Typ. Red 618 621 628 629 115 200 40 2.60 Green 525 528 535 521 115 530 50 2.60 Blue 465 470 475 465 115 70 10 2.60 Notes: 5. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 6. θ ½ is the off axis angle where the luminous intensity is ½ the peak intensity 7. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = I V / η V, where I V is the luminous intensity in candelas and η V is the luminous efficacy in lumens / watt. 8. Φ V is the total luminous flux output as measured with an integrating sphere at mono pulse condition. 3
Table 4. Electrical Characteristics (T A = 25 C) Forward Voltage, V F (V) [1] Reverse Voltage V R @ 100μA Color Min Typ. Max. Min. Min. Red 1.80 2.10 2.40 4 - Green2.80 3.20 3.90-4 Blue 2.80 3.20 3.90-4 Note: 1. Tolerance ± 0.1V. Reverse Voltage V R @ 10μA RELATIVE INTENSITY 1.0 InGaN Blue InGaN Green AlInGaP Red 0.8 0.6 0.4 0.2 0.0 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm Figure 2. Relative intensity vs. wavelength FORWARD CURRENT ma 50 45 40 35 30 25 20 15 10 5 0 AlInGaP InGaN 0 1 2 3 4 FORWARD VOLTAGE - V Figure 3. Forward current vs. forward voltage RELATIVE LUMINOUS INTENSITY (NORMALIZATION AT 20 ma) 3.00 2.50 2.00 1.50 1.00 0.50 AlInGaP InGaN 0.00 0 10 20 30 40 50 60 DC FORWARD CURRENT - ma Figure 4. Relative Intensity vs. forward current 4
MAX. ALLOWABLE DC CURRENT (ma) 60 50 40 30 20 10 0 AlInGaP InGaN 0 20 40 60 80 100 120 AMBIENT TEMPERATURE ( C) Figure 5a. Maximum forward current vs. ambient temperature. Derated based on T J MAX = 125 C.(3 chips) MAX. ALLOWABLE DC CURRENT (ma) 60 50 40 30 20 10 0 AlInGaP InGaN 0 20 40 60 80 100 120 AMBIENT TEMPERATURE ( C) Figure 5b. Maximum forward current vs. ambient temperature. Derated based on T J MAX = 125 C. (single chip) DOMINANT WAVELENGTH SHIFT (NORMALIZED AT 20mA) - nm 7 6 5 4 3 2 1 0-1 0 10 20 30 40 50-2 -3 Blue Green Red FORWARD CURRENT - ma Figure 6. Dominant wavelength shift (normalized at 20mA) Figure 7a. Component Axis for Radiation Patterns NORMALIZED INTENSIT Y 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 RED GREEN BLUE -90-60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 7b. Radiation Pattern for X axis NORMALIZED INTENSIT Y 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 RED GREEN BLUE -90-60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 7c. Radiation Pattern for Y axis 5
NORMALIZED LUMINOUS INTENSITY 10 1 0.1 RED GREEN BLUE -50-25 0 25 50 75 100 125 T J - JUNCTION TEMPERATURE - C Figure 8. Relative Intensity vs Junction Temperature FORWARD VOLTAGE SHIFT - V 0.30 0.20 0.10 0.00-0.10-0.20-0.30-0.40 RED GREEN BLUE -50-25 0 25 50 75 100 125 T J - JUNCTION TEMPERATURE - C Figure 9. Forward Voltage vs Junction Temperature 4.20 1.60 1.60 4.20 0.40 Reflow soldering direction +ve +ve 3.15 0.80 0.65 3.15 SOLDER MASK 1.10 0.80 2.60 1.10 8.40 -ve -ve +ve -ve 4.20 4.20 Figure 10. Recommended soldering land pattern. H L Dimension of LxH should be > 3.9mm x 3.4mm Figure 11. Recommended pick and place nozzle tip 6
TEMPERATURE 20 SEC. MAX. 240 C MAX. 3 C/SEC. MAX. 100-150 C 3 C/SEC. MAX. 183 C -6 C/SEC. MAX. TEMPERATURE 217 C 200 C 150 C 255-260 C 3 C/SEC. MAX. 3 C/SEC. MAX. 10 to 30 SEC. 6 C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME Figure 12. Recommended leaded reflow soldering profile 60-120 SEC. 100 SEC. MAX. TIME Figure 13. Recommended Pb-free reflow soldering profile. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components 8.00 ± 0.10 4.00 ± 0.10 1.75 ± 0.10 2.00 ± 0.05 Ø1.50 +0.10 3.83 ± 0.10 12.00 +0.30-0.10 5.50 ± 0.05 4.85 ± 0.10 Ø1.50 +0.25 0.32 ± 0.02 Figure 14. Carrier Tape Dimension 7
2.30 2.30 Ø3.50±0.50 2.50±0.50 330.0 Ø330.0+1.0 Ø99.5+1.0 Label Area Figure 15. Reel Dimension Pin 1 Printed Label Figure 16. Reeling Orientation 8
Intensity Bin Select (X 2, X 3 ) Individual reel will contain parts from 1 half bin only Min Iv Bin (Minimum Intensity Bin) X 2 Red Green Blue 0 0 0 0 A U1 V2 S2 X 3 Red Green Blue Number of Half bin from X 2 0 0 0 0 A 4 4 4 Note: 0 represents no maximum bin limit Color Bin Select (X 4 ) Individual Reel will contain part from 1 full bin only Color Bin Combinations X 4 Red Green Blue 0 Full distribution C & D B & C Intensity Bin Limits Bin ID Min (mcd) Max (mcd) S2 224.0 285.0 T1 285.0 355.0 T2 355.0 450.0 U1 450.0 560.0 U2 560.0 715.0 V1 715.0 900.0 V2 900.0 1125.0 W1 1125.0 1400.0 W2 1400.0 1800.0 X1 1800.0 2240.0 Tolerance of each bin limit ± 12% Color Bin Limits Red Min (nm) Max (nm) Full distribution 618.0 628.0 Green Min (nm) Max (nm) C 525.0 530.0 D 530.0 535.0 Blue Min (nm) Max (nm) B 465.0 470.0 C 470.0 475.0 Tolerance of each bin limit is ± 1 nm 9
Packaging Option (X 5 ) Option Test Current Package Type Reel Size 2 20mA Top mount 13 inch Note: Each reel contains 1000pcs LED 0.90 0.80 0.70 Green C D 0.60 Y - COORDINATE 0.50 0.40 0.30 Red 0.20 0.10 Blue C B 0.00 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 X-COORDINATE 10
Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use Unopen moisture barrier bag (MBB) can be stored at <40 C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB The humidity indicator card (HIC) shall be read immediately upon opening of MBB. The LEDs must be kept at <30 C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours E. Baking is required if: The HIC indicator is not GREEN at 10% and is AZURE at 5% The LEDs are exposed to condition of >30 C / 60% RH at any time. The Led floor life exceeded 672hrs. Recommended baking condition: 60±5 C for 20hrs. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright 2005-2010 Avago Technologies. All rights reserved. AV02-1095EN - April 15, 2010