CPC118N 6V Normally-Open Single-Pole 4-Pin SOP OptoMOS Relay Parameter Rating Units Blocking Voltage 6 V P Load Current 6 ma rms / ma DC On-Resistance (max).8 LED Current to operate 1 ma eatures Designed for Use in Security Systems Complying with EN13-4 Only 1mA of LED Current Required to Operate 1V rms nput/output solation Small 4-Pin SOP Package High Reliability Arc-ree With No Snubbing Circuits No EM/R Generation mmune to Radiated EM ields Tape & Reel Version Available lammability Rating UL 94 V- Applications Security Passive nfrared Detectors (PR) Data Signalling Sensor Circuitry nstrumentation Multiplexers Data Acquisition Electronic Switching /O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment Patient/Equipment solation Aerospace ndustrial Controls Description The CPC118N is a miniature single-pole, normally-open (1-orm-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSET technology to provide 1V rms of input to output isolation. The super efficient MOSET switches and photovoltaic die use XYS ntegrated Circuits Division s patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. XYS ntegrated Circuits Division s state of the art double-molded vertical construction packaging enables the CPC118N to be one of the world s smallest relays. t offers board space savings of at least 2% over the competitor s larger 4-pin SOP relay. Approvals UL Recognized Component: ile E7627 CSA Certified Component: Certificate 11727 EN/EC 69-1 Certified Component: TUV Certificate B 13 12 82667 3 Ordering nformation Part # CPC118N CPC118NTR Pin Configuration 1 + Control Description 4-Pin SOP (1/tube) 4-Pin SOP (2/reel) 4 Load 2 3 Control Load Switching Characteristics of Normally-Open Devices orm-a 9% 1% LOAD t on t off DS-CPC118N- www.ixysic.com 1
CPC118N Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Blocking Voltage 6 V P Reverse nput Voltage V nput Control Current ma Peak (1ms) 1 A nput Power Dissipation 1 7 mw Total Power Dissipation 2 4 mw solation Voltage, nput to Output 1 V rms Operational Temperature -4 to +8 C Storage Temperature -4 to +12 C 1 Derate linearly 1.33 mw / ºC 2 Derate linearly 3.33 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. unctional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +2 C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 2ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 =2mA L - - 6 ma rms / ma DC Peak t =1ms LPK - - ±1 A P On-Resistance 2 L =1mA R ON -.8.8 Off-State Leakage Current V L =6V P LEAK - - 1 µa Switching Speeds Turn-On t =ma, V L =1V on -.47 3 Turn-Off t off -.22 2 ms Output Capacitance =ma, V L =V, f=1mhz C OUT - 2 - p nput Characteristics nput Control Current to Activate 3 L =6mA -.2 1 ma nput Control Current to Deactivate -.1.2 - ma nput Voltage Drop =ma V.9 1. V Reverse nput Current V R =V R - - 1 µa Common Characteristics Capacitance, nput to Output V O =V, f=1mhz C O - 1 - p 1 Load current derates linearly from 6mA @ 2 o C to 48mA @8 o C. 2 Measurement taken within 1 second of on-time. 3 or applications requiring high temperature operation (greater than 6 o C) a minimum LED drive current of 3mA is recommended. 2 www.ixysic.com
CPC118N PERORMANCE DATA* 2 Typical LED orward Voltage Drop (N=, =ma) 2 Typical Turn-On Time (N=, =ma, L =1mA) 3 Typical Turn-Off Time (N=, =ma, L =1mA) 2 1 1 2 1 1 2 2 1 1 6 6 7 7 LED orward Voltage (V).3.4.4...6.6 Turn-On Time (ms)..6.7.8.9 1. Turn-Off Time (ms) 2 Typical for Switch Operation (N=, L =6mA) 2 Typical for Switch Dropout (N=, L =6mA) 2 Typical On-Resistance Distribution (N=, =1mA, L =.6A) 2 1 1 2 1 1 2 1 1.16.18.2.22.24.26.28.16.18.2.22.24.26..1.1.2.2.3.3 On-Resistance ( ) 3 Typical Blocking Voltage Distribution (N=) 3 2 2 1 1 63. 64. 64. 6. 6. 66. 66. Blocking Voltage (V P ) LED orward Current (ma) LED orward Voltage vs. Current 4 3 2 1 1.1 1.1 1.3 1.3 1. 1. LED orward Voltage(V) Turn-On Time (ms) 2. 1.8 1..8.6.4.2 Typical Turn-On Time vs. LED orward Current =8mA) 1 1 2 2 3 3 4 4 LED orward Current (ma) Turn-Off Time (ms).7.6..4.3.2.1 Typical Turn-Off Time vs. LED orward Current =8mA) 1 1 2 2 3 3 4 4 LED orward Current (ma) *Unless otherwise noted, data presented in these graphs is typical of device operation at 2ºC. or guaranteed parameters not indicated in the written specifications, please contact our application department. www.ixysic.com 3
CPC118N PERORMANCE DATA* LED orward Voltage (V) 1. 1.3 Typical LED orward Voltage Drop =ma =2mA =1mA =ma 1.1 =2mA =1mA 1. -4-2 2 4 6 8 1 Turn-On Time (ms) Typical Turn-On Time =8mA) 2. 1.8 1. =ma.8.6.4.2 =1mA. -4-2 2 4 6 8 1 Turn-Off Time (ms) Typical Turn-Off Time =8mA).6...4.4.3.3.2 =ma.2.1.1 =1mA -4-2 2 4 6 8 1 Typical for Switch Operation =48mA).36.34.32.3.28.26.24.22.2.18.16-4 -2 2 4 6 8 1.36.34.32 Typical for Switch Dropout =48mA).3.28.26.24.22.2.18.16-4 -2 2 4 6 8 1 On-Resistance ( ) Typical On-Resistance =48mA).9 =ma.8 =1mA.7 Steady State.6..4.3-4 -2 2 4 6 8 1 Load Current (ma) 6 4 2-2 -4 Typical Load Current vs. Load Voltage ( =1mA) -6 -.3 -.2 -.1.1.2.3 Load Voltage (V) Load Current (A) Typical Maximum Load Current.8.7.7.6.6. =1mA..4 =ma.4.3-4 -2 2 4 6 8 1 12 Blocking Voltage (V P ) 72 7 68 66 64 62 6 8-4 Typical Blocking Voltage -2 2 4 6 8 1 Leakage (µa).16.14.12.1.8.6.4.2-4 Typical Leakage Measured Across Pins 3&4 (V L =6V) -2 2 4 6 8 1 Output Capacitance (p) 2 1 1 Output Capacitance vs. Load Voltage ( =ma, f=1mhz) 1 2 3 4 Load Voltage (V) Load Current (A) Energy Rating Curve ( =1mA) 2. 1.8 1..8.6.4.2 1μs 1μs 1ms 1ms 1ms 1s 1s 1s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 2ºC. or guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com
CPC118N Manufacturing nformation Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. XYS ntegrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, PC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. ailure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard PC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Classification CPC118N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Soldering Profile Provided in the table below is the Classification Temperature (T C ) of this product and the maximum dwell time the body temperature of this device may be (T C - )ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. or through-hole devices, and any other processes, the guidelines of J-STD-2 must be observed. Board Wash Device Classification Temperature (T c ) Dwell Time (t p ) Max Reflow Cycles CPC118N 26ºC 3 seconds 3 XYS ntegrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or luorine-based. www.ixysic.com
CPC118N CPC118N 4.89 ±.2 (.161 ±.1) MECHANCAL DMENSONS.23 Typ (.8 Typ) Recommended PCB Land Pattern. (.22) 3.81 ±.2 (.1 ±.1) Pin 1 2.4 Typ (.1 Typ) 2.3±.2 (.8±.1).481 (.19) -.1 (-.4) 6.96 ±.12 (.24 ±.4) Package standoff:.64 ±.4 (.2 ±.1).381 TYP. (.1 TYP.).91 ±.2 (.36 ±.1).9 ±.127 (.22 ±.) (.7) 2.4 (.1). (.217) Dimensions mm (inches) CPC118NTR Tape & Reel 33.2 Dia (13. Dia) Top Cover Tape Thickness.12 Max (.4 Max) B =4.7 (.18) W=12. (.472) K =2.7 (.16) K 1 =2.3 (.91) A =6. (.26) P1=8. (.31) User Direction of eed Embossed Carrier Dimensions mm (inches) Embossment NOTE: All dimensional tolerances per Standard EA-481-2 except as noted or additional information please visit our website at: www.ixysic.com XYS ntegrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in XYS ntegrated Circuits Division s Standard Terms and Conditions of Sale, XYS ntegrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of XYS ntegrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. XYS ntegrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC118N- Copyright 218, XYS ntegrated Circuits Division OptoMOS is a registered trademark of XYS ntegrated Circuits Division All rights reserved. Printed in USA. 1/3/218