Reflective sensor with InGas photodiode and infrared housed in a compact package This reflective sensor houses an InGas PIN photodiode and 1.45 μm band in a compact package. The irradiates infrared light on the target object, and the photodiode signal generated from the reflected light is output digitally through an I 2 C interface. Features pplications I 2 C interface Low supply voltage: Vdd=2.25 V to 3.63 V I 2 C bus voltage: 1.65 V Low current consumption Small package (5.5 1.7 1. mm) Supports lead-free reflow soldering Built-in 16-bit /D converter Built-in driver Moisture level detection NIR (near infrared) photometry bsolute maximum ratings (Ta=25 C) Parameter Symbol Condition Value Unit Supply voltage Vdd -.3 to +4 V Load current Io ±1 m Power dissipation P 1 mw Operating temperature Topr No dew condensation* -3 to +8 C Storage temperature Tstg No dew condensation* -4 to +85 C Forward current IF 8 m Pulse forward current IFP Duty ratio=1%, pulse width=1 μs 1 Reverse voltage VR 1 V Reflow soldering conditions Tsol Moisture absorption and reflow conditions: Peak temperature: 26 C max., 3 times JEDEC J-STD-2D LEVEL5a - * When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. lways be sure to use the product within the absolute maximum ratings. www.hamamatsu.com 1
Recommended operating conditions Parameter Symbol Condition Min. Typ. Max. Unit Supply voltage Vdd 2.25-3.63 V I 2 C bus pull-up voltage* 1 Vbus Rp=2.2 kω 1.65 - Vdd +.5 V High level input voltage Vih SD, SCL 1.55 - Vdd +.5 V Low level input voltage Vil SD, SCL -.5 -.3Vdd V Bus capacitance Cbus SD, SCL - - 4 pf Maximum incident light level - Light source - - 1 lx *1: The pull-up resistance is determined by the Cbus capacitance and Vbus voltage. Satisfy the following condition: Vdd - Vbus < 1.2 V. Electrical and optical characteristics Sensor section (Ta=25 C, Vdd=Vbus=Vanode=3.3 V, : λp=1.45 μm, initial setting: high gain, integration time: 1 ms, unless otherwise noted) Parameter Symbol Condition Min. Typ. Max. Unit Spectral response range λ -.9 to 1.7 - μm Peak sensitivity wavelength λp - 1.55 - μm Current Operation mode Iddc 3 75 15 E= consumption lx (dark state), excluding output current Standby mode Idds.1 1. 3. μ Dark count (when is in standby) Sd Dark state, initial setting - - 1 counts Dark count (when is being driven) Sdl Dark state driver: DC mode, 8 m 3 75 counts Sensitivity High gain Sh 225 5 8 counts/mw Sensitivity gain ratio High/Low - 4.8-7.9 times I 2 C section (Ta=25 C, Vdd=Vbus=3.3 V, unless otherwise noted) Parameter Symbol Condition Min. Typ. Max. Unit I 2 C address DDR 7-bit 2 I 2 C clock frequency fclk 1-4 khz High level Voh Rp=2.2 kω.8vbus - - V SD output voltage Low level Vol Rp=2.2 kω -.4 V I/O terminal capacitance Ci - - 2 pf SD output fall time* 2 tf Rp=2.2 kω, Cp=4 pf - - 25 ns *2: The SCL/SD output rise time is determined by the time constant defined by Cbus Rp. Note: I 2 C interface (SD, SCL) timing complies with The I 2 C-bus specification version 2.1. section (Ta=25 C, Vanode=Vdd=3.3 V, unless otherwise noted) Parameter Symbol Condition Min. Typ. Max. Unit Peak emission wavelength λp IF=5 m 1.4 1.45 1.5 μm Spectral half width λ IF=5 m - 12 17 nm Radiant flux ϕe IF=5 m 1.8 2.4 - mw Forward voltage VF IF=5 m - 1. 1.5 V Reverse voltage lr VR=1 V - - 1 μ Cutoff frequency* 3 fc IF=5 m ± 1 mp-p - 15 - MHz Rise time tr 2% to 8%* 4-22 - μs Fall time tf 8% to 2%* 4-27 - μs *3: Frequency at which the light output drops by 3 db relative to the output at 1 khz *4: When IF=8 m in pulse mode 2
Register map drs Function bit 7 6 5 4 3 2 1 RGB sensor control Reset Standby Standby Register Gain Integration function Integration time setting function reset selection mode monitor 1 Manual timing (high byte) 2 Manual timing (low byte) Manual timing (low byte) 3 Output data (high byte) 4 Output data (low byte) node channel data (16 bits) 5-6 - 7-8 - 9 - Not used - B - C - D - E drive control 1 reset standby function DC mode F drive control 2 1 drive current selection 1 Monitor Standby function monitor Note: We recommend that the s be used in DC mode. 1/1 mode Details of, E, F E F drs Initial setting Function Initial setting Function Initial setting Function bit 7 6 5 4 3 2 1 Standby function Register Integration Reset Standby Gain Integration time monitor reset mode 1 1-1 1 : Reset release : Fixed time mode : Operation : Operation : High gain () 32 μs (1) 1 ms Readout only 1: ddress 3-1: manual 1: reset 1: Standby 1: Low gain (1) 16.4 ms (11) 131 ms Data reset setting mode DC mode 1/1 mode reset standby 1 1 : Operation 1: reset : m 1: 64 m : Operation 1: Standby : Pulse mode 1: DC mode : Normal mode 1: 1/1 mode drive current : m : m 1: 32 m 1: 16 m : m 1: 8 m 3
Program example Condition 1: Initial settings [manual setting mode, Tint= (32 μs), integration time=1 ms/ch (manual timing register set to xc3)] command ction Data body ck Remark ddress call (x2) S 1 1 1 W 7-bit address Register call (x) Specifies the control byte Register write (x84) 1 1 DC reset, standby release ddress call (x2) Sr 1 1 1 W Restart, address Register call (x) Specifies the control byte Register write (x4) 1 P DC reset release, bus release Stands by for longer than the integration time (standby time > 4 ms) ddress call (x2) S 1 1 1 W 7-bit address Register call (x5) 1 1 Specifies the sensor data byte ddress call (x2) Sr 1 1 1 R Changes to read mode Data read out (MSB) X X X X X X X X Data output Data read out (LSB) X X X X X X X X Ā P S=Start condition, Sr=Restart condition, =cknowledge, =cknowledge by host, P=Stop condition, R=Read mode (1), W=Write mode (), Ā=not acknowledge Format The rest is the same as the above command list. S x2 (7 bits) W x x84 Sr x2 (7 bits) W x x4 P When the SCL clock is 4 khz, the write time is 135 μs. Standby S x2 (7 bits) W x5 Sr x2 (7 bits) R Sensor data Sensor data P The readout time is 112.5 μs. from master to slave from slave to master 4
Condition 2: [Fixed time mode, Tint=1 (.5 ms), integration time=1. ms/ch] Command ction Data body ck Remark ddress call (x2) S 1 1 1 W 7-bit address Register call (x) Specifies the control byte Register write (x81) 1 1 DC reset, standby release ddress call (x2) Sr 1 1 1 W Restart, bit address Register call (x) Specifies the control byte Register write (x1) 1 P DC reset release, bus release Stands by for longer than the integration time. Measurement takes place during standby (standby time > 4 ms). Measurements are repeated continuously. ddress call (x2) S 1 1 1 W 7-bit address Register call (x5) 1 1 Specifies the sensor data byte ddress call (x2) Sr 1 1 1 R Changes to read mode Data read out (infrared: MSB) X X X X X X X X Data output Data read out (infrared: LSB) X X X X X X X X Ā P S=Start condition, Sr=Restart condition, =cknowledge, =cknowledge by host, P=Stop condition, R=Read mode (1), W=Write mode (), Ā=not acknowledge Format The rest is the same as the above command list. S x2 (7 bits) W x x81 Sr x2 (7 bits) W x x1 P When the SCL clock is 4 khz, the write time is 135 μs. Standby S x2 (7 bits) W x5 Sr x2 (7 bits) R Sensor data Sensor data P The readout time is 112.5 μs. from master to slave from slave to master Condition 3: [Manual setting mode, Tint=1 (.5 ms), manual timing=357 (x165), integration time=357 ms/ch, low gain] Command ction Data body ck Remark ddress call (x2) S 1 1 1 W 7-bit address Register call (x) Specifies the control byte Register write (x8d) 1 1 1 1 DC reset, standby release Register write (x1) 1 Manual timing high byte Register write (x65) 1 1 1 1 Manual timing low byte ddress call (x2) Sr 1 1 1 W Restart, 7-bit address Register call (x) Specifies the control byte Register write (xd) 1 1 1 P DC reset release, bus release Stands by for longer than the integration time. Measurement takes place during standby (standby time > 1428 ms). Measurements are repeated continuously. ddress call (x2) S 1 1 1 W 7-bit address Register call (x5) 1 1 Specifies the sensor data byte ddress call (x2) Sr 1 1 1 R Changes to read mode Data read out (MSB) X X X X X X X X Data output Data read out (LSB) X X X X X X X X Ā P S=Start condition, Sr=Restart condition, =cknowledge, =cknowledge by host, P=Stop condition, R=Read mode (1), W=Write mode (), Ā=not acknowledge 5
Format The rest is the same as the above command list. S x2 (7 bits) W x x85 x1 x65 Sr x2 (7 bits) W x xd P Standby When the SCL clock is 4 khz, the write time is 18 μs. S x2 (7 bits) W x5 Sr x2 (7 bits) R Sensor data Sensor data P The readout time is 112.5 μs. from master to slave from slave to master Command When starting operation Condition 4: ( drive DC mode, drive current=48 m) ction Data body ck Remark ddress call (x2) S 1 1 1 W 7-bit address Register call (xe) 1 1 1 Specifies the control byte Register write (x) 1 1 Standby release, DC mode Register write (x6) 1 1 Drive current ddress call (x2) Sr 1 1 1 W Restart, 7-bit address Register call (xe) 1 1 1 Specifies the control byte Register write (x2) 1 P driver reset release, bus release When ending operation ction Data body ck Remark ddress call (x2) S 1 1 1 W 7-bit address Register call (xe) 1 1 1 Specifies the control byte Register write (xc) 1 1 P Standby S=Start condition, Sr=Restart condition, =cknowledge, =cknowledge by host, P=Stop condition, R=Read mode (1), W=Write mode (), Ā=not acknowledge Format The rest is the same as the above command list. When starting operation S x2 (7 bits) W xe x1 x6 Sr x2 (7 bits) W xe x2 P When ending operation S x2 (7 bits) W xe xc P from master to slave from slave to master 6
Flowcharts Sensor section 1. Power-on 2. Power-on reset, initialize 3. DC reset = 1, standby release 4. Set measurement conditions Gain, integration mode, integration time setting, integration timing register setting 5. DC reset = Integration mode? Fixed time mode 6. Measure Manual setting mode 6. Measure fter power-on, the built-in power-on reset circuit operates to set all registers to their initial conditions (2.). With the initial settings, the product is in standby mode, waiting for commands. To set measurement conditions, enter commands via the I 2 C bus. This product starts measuring when DC reset changes from 1 to. Therefore, to write to registers, DC reset must be set to 1 (3.). fter setting measurement conditions (4.), release DC reset to start measuring (5.). There are two operation modes: fixed time mode and manual setting mode. In manual setting mode, the product automatically enters standby mode after completing a single measurement. In fixed time mode, the product repeats measurement and data storage. During this repetition, if DC reset or standby is set to 1 with an I 2 C command, the product stops its operation. 7. Save data to register 7. Save data to register Standby= 1? No Yes 8. Stop (standby mode) driver 1. Power-on 2. Power-on reset, initialize 3. reset = 1, sleep release With the initial settings, the drivers are also in standby mode. Therefore, first disable the standby mode (3.). Next, set the current, 1/1 mode, DC mode, and the like. Then, release the reset to start operating (4. 5.). drivers continue to operate until they are set to standby mode. To end operation, enable standby mode. 5. reset = driver operation No sleep = 1? Yes Stop (standby mode) 7
Spectral response 1 (Typ. Ta=25 C) 8 Relative sensitivity (%) 6 4 2.8 1. 1.2 1.4 1.6 1.8 Wavelength (μm) KPICB215EB Directivity (Typ. Ta=25 C, tungsten lamp) 4 3 2 1 1 2 3 4 5 5 6 6 7 X direction 7 8 8 Y direction 9 9 1 8 6 4 2 2 4 6 8 1 KPICB219E 8
Emission spectrum Forward current vs. forward voltage () 1 (Typ. Ta=25 C, IF=5 m) 1 (Typ. Ta=25 C, tw=1 μs,.1%) 9 8 Relative light output (%) 7 6 5 4 3 2 Forward current (m) 1 1 12 13 14 15 16.5 1. 1.5 2. 2.5 Wavelength (nm) Forward voltage (V) KPICB221E KPICB222E Light output vs. ambient temperature llowable forward current vs. ambient temperature +3 (Typ. IF=5 m) 12 (Typ.) Relative light output (db) +2 +1-1 -2-3 -4 Relative allowable forward current (%) 1 8 6 4 2-5 -4-2 2 4 6 8 1-4 -2 2 4 6 8 1 mbient temperature ( C) mbient temperature ( C) KPICB223E KPICB224E 9
Current consumption (μ) Current consumption vs. ambient temperature 1 9 8 7 6 5 4 3 2 1 Operation mode Standby mode (Typ.) -4-2 2 4 6 8 Output (counts) Measurement example of moisture level 62 615 61 65 6 595 [Target object: copy paper (through 1.2 mm thick glass), Ta=32.5 C, integration time: 1 ms, output:.8 m (DC mode)] Humidity Output 59 3 6 9 12 15 18 21 1 9 8 7 6 5 4 3 2 1 Humidity (%) mbient temperature ( C) KPICB217E Time (min) KPICB236E The moisture level of the copy paper is detected when the humidity is changed (4% to 8% to 2%). Cross section (unit: mm) 1.2 Copy paper Glass Sensor KPICC313E Distance between the sensor and target object 6 [Target object: aluminum, Ta=25 C, integration time: 1 ms, output:.8 m (DC mode)] 5 Output (counts) 4 3 2 1 2 4 6 8 1 Distance (mm) KPICB235E The sensor output is maximum when the distance between the sensor and target object is about 1 mm. 1
Block diagram Vdd Photodiode Current-to-frequency converter Timer /D converter Counter Register I 2 C interface driver SD SCL node Cathode GND KPICC299E Connection example Vbus Vdd Rp (2.2 kω) Rp (2.2 kω).1 μf node 33 μf Vdd SCL SD GND anode SCL SD Microcontroller Note: When the is emitting light, do not externally control the. If you are using Vdd and Vbus at different voltages, use them in the range that satisfies Vdd - Vbus<1.2 V. Set the s anode voltage to VF + α or higher of the in use. KPICC31E 11
Timing chart Sensor section (manual mode) Current consumption I 2 C Command Iddc Start mode Integration time Standby time Idds Time The photodiode data is stored temporarily in a buffer register (not the I 2 C register). fter the completion of the measurement, the entire set of data is stored in the I 2 C register. If this product is set to manual mode, after the integration time elapses, it will automatically switch to sleep mode. I 2 C register values are not initialized with DC reset or in standby mode. They are initialized only during a power-on reset when the power is turned on. The integration time per cycle is the sum of the three detection times indicated in the timing chart on the left. Initialization, measurement instruction Standby time (>integration time) Readout time Initialization, measurement instruction Readout KPICC293E Sensor section (fixed time mode) Current consumption I 2 C Command Start mode Integration time (1 cycle) Standby time Iddc Time The measurement time is the shortest under the following conditions. <Conditions> Fixed time mode, Tint= (32 μs) Integration time: 32 μs/ch SCL frequency: 4 khz Initialization, measurement instruction: 135 μs Standby time (>integration time): 128 μs Readout time: 112.5 μs Measurement time: 375.5 μs Initialization, measurement instruction Readout KPICC294E driver (pulse drive) I 2 C command Initialization, measurement instruction pulse width 1.6 ms (625 Hz fixed) Readout The driver can set the light emission pulse width in the range of μs to 24 μs in 16 μs steps (16 levels total). The light emission cycle is approximately 1.6 ms. The drive current is fixed at 8 m. When set to low current mode, the drive current is reduced to one-tenth (.8 m). We recommend that you use the driver in DC mode. : Standby KPICC3E 12
Dimensional outline (unit: mm) Photosensitive area ɸ.3 5.5 IC.7.3.7 1. Y direction (.5) 1.7 X direction Photosensitive surface Shielded section P.8 4=3.2.8 ( 1) ϕ.3 Vdd NC NC NC NC anode cathode GND SD SCL Tolerance unless otherwise noted: ±.2 KPIC16E Note: When using this product, contact us for the technical note. Please check the technical note first, and then create an appropriate device design. Recommended land pattern (unit: mm) P.8 4=3.2.8 (1 )ϕ.4 KPICC251E 13
Standard packing specifications Reel Dimensions Hub diameter Tape width Material Electrostatic characteristics 18 mm 6 mm 12 mm PS Conductive Embossed tape (unit: mm, material: PS, conductive) ϕ1.5- +.1 4. ±.1 2. ±.5 4. ±.1 5.5 ±.5 1.75 ±.1 +.3 -.1 12. 5.8 ±.5 ϕ1.- +.1 Reel feed direction.25 ±.5 1.3 ±.5 2. ±.5 KPICC297E Packing quantity 2 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-sealed) 14
Measured example of temperature profile with our hot-air reflow oven for product testing Peak temperature - 5 C 3 s max. Peak temperature: 26 C Temperature ( C) 217 C 2 C 15 C Preheating 6 to 12 s 3 C/s max. -6 C/s max. Soldering 6 to 15 s 25 C to peak temperature: 8 min max. Time (s) KPICC22E This product supports lead-free soldering. fter unpacking, store it in an environment at a temperature of 3 C or less and a humidity of 6% or less, and perform soldering within 168 hours. If it is not stored in the above environment after unpacking or more than three months has passed without unpacking, perform baking. For the baking method, see the related information Precautions of Surface mount type products. The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. When you set reflow soldering conditions, check that problems do not occur in the product by testing out the conditions in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions Disclaimer Surface mount type products Information described in this material is current as of June 217. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet to check the latest specifications. The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use. Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission. www.hamamatsu.com HMMTSU PHOTONICS K.K., Solid State Division 1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184 U.S..: Hamamatsu Corporation: 36 Foothill Road, Bridgewater, N.J. 887, U.S.., Telephone: (1) 98-231-96, Fax: (1) 98-231-1218 Germany: Hamamatsu Photonics Deutschland GmbH: rzbergerstr. 1, D-82211 Herrsching am mmersee, Germany, Telephone: (49) 8152-375-, Fax: (49) 8152-265-8 France: Hamamatsu Photonics France S..R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71, Fax: 33-(1) 69 53 71 1 United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 1 Tewin Road, Welwyn Garden City, Hertfordshire L7 1BW, United Kingdom, Telephone: (44) 177-294888, Fax: (44) 177-325777 North Europe: Hamamatsu Photonics Norden B: Torshamnsgatan 35 1644 Kista, Sweden, Telephone: (46) 8-59-31-, Fax: (46) 8-59-31-1 Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 22 rese (Milano), Italy, Telephone: (39) 2-93581733, Fax: (39) 2-93581741 China: Hamamatsu Photonics (China) Co., Ltd.: B121, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 12, China, Telephone: (86) 1-6586-66, Fax: (86) 1-6586-2866 15 Cat. No. KPIC112E2 Jun. 217 DN