AS LF: GaAs IC High-Isolation Positive Control SPDT Nonreflective Switch LF to 4 GHz

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DATA SHEET AS186-32LF: GaAs IC High-Isolation Positive Control SPDT Nonreflective Switch LF to 4 GHz Applications GSM, PCS, WCDMA, 2.4 GHz ISM and 3.5 GHz wireless local loop V1 J2 Features Positive voltage control (/3 to /5 V) High isolation (55 @.9 GHz and 1.9 GHz) Three-switch solution for base station synthesizer switch Nonreflective Operation to 6 GHz Miniature lead (Pb)-free and RoHS-compliant MSOP-8 exposed pad package (MSL-1 @ 26 C per JEDEC J-STD-2) Skyworks Green TM products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green TM, document number SQ4 74. V2 J1 Description 5 Ω 5 Ω 214-1 Figure 1. AS186-32LF Functional Block Diagram The AS186-32LF is a GaAs FET IC SPDT nonreflective switch, packaged in an MSOP-8 exposed pad plastic package for lowcost, high-isolation commercial applications. A functional block diagram for the AS186-32LF is shown in Figure 1. This device is available in an ultra-miniature SOT-6 package. The pin configuration and package are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1. J3 V1 V2 J1 GND 1 2 3 4 8 7 6 5 J2 GND GND J3 Y1869 CBL = 47 pf for operation > 5 MHz Figure 1. AS186-32LF Pinout Diagram 214F Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice May 12, 217 1

Table 1. AS186-32LF Signal Descriptions Pin Name Description Pin Name Description 1 V1 DC control voltage 5 J3 RF output 2 V2 DC control voltage 6 GND Ground 3 J1 RF output 7 GND Ground 4 GND Ground 8 J2 RF output Electrical and Mechanical Specifications The absolute maximum ratings of the AS186-32LF are provided in Table 2. Electrical specifications are provided in Tables 3 through 6. The truth table is shown in Table 7. Typical performance characteristics of the AS186-32LF are shown in Figures 2 through 8. Table 2. Absolute Maximum Ratings 1 Parameter Symbol Minimum Typical Maximum Units RF input power (VCTL = /8 V) f > 5 MHz f < 5 MHz PIN 1 1 W mw Control voltage VCTL.2 8 V Operating temperature TOP 4 +85 C Storage temperature TSTG 65 +15 C Electrostatic discharge: Human Body Model (HBM), Class 1A ESD 5 V 1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. ESD HANDLING: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD when handling or transporting. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD handling precautions should be used at all times. 2 May 12, 217 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice 214F

Table 3. Electrical Specifications 1 ( 4 C TOP +85 C, VCTL = /5 V, ZO = 5, Unless Otherwise Noted) Parameter Symbol Test Condition Minimum Typical Maximum Units Insertion loss IL LF to 2 GHz LF to 3 GHz LF to 4 GHz.8.9 1. 1.5 1.15 Isolation (Note 2) ISO LF to 2 GHz LF to 3 GHz LF to 4 GHz 5 45 35 55 5 4 VSWR (On state) VSWR LF to 2 GHz LF to 4 GHz 1.3:1 1.3:1 1.5:1 1.6:1 VSWR (Off state) VSWR.5 to 4 GHz 1.35:1 1.7:1 1 Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. 2 Backside of exposed pad must be connected to RF ground to obtain specified isolation. Table 4. Electrical Specifications: Operating Characteristics ( 4 C < TOP < +85 C, VCTL = /5 V, ZO = 5, Unless Otherwise Noted) Control voltages Parameter Symbol Test Condition Minimum Typical Maximum Units Low @ 2 A max High VCTL_L VCTL_H 3 (@ 1 A).2 5 (@ 2 A) V V Input power for 1 compression IP1.9 to 4 GHz: VCTL = /3 V VCTL = /5 V 23 27 25 3 m m Input third order intermodulation intercept point IIP3.9 to 4 GHz, for two-tone input power 8 m: VCTL = /3 V VCTL = /5 V 27 42 38 46 m m Switching characteristics: Rise, fall time On, off time Video feedthru tr, tf ton, toff VFT 1/9% or 9/1% RF 5% CTL to 9/1% RF tr = 3 ns, BW = 5 MHz 3 5 25 ns ns mv Thermal resistance JA 25 C/W Table 5. Compression Point vs Voltage and Temperature @ 9 MHz Control voltage (V) Temperature ( C) Input Power @ 1 Compression (m) Input Power @.1 Compression (m) 3 4 2.5 16.5 3 +25 2 15.3 3 +85 19 14 5 4 28.5 23 5 +25 28 23 5 +85 27.5 23 214F Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice May 12, 217 3

Table 6. IP3 vs Voltage and Temperature @ Tone Frequency: 9 and 91 MHz Control voltage (V) Temperature ( C) IP3 @ 8 m Each Tone (m) 3 4 44 3 +25 38 3 +85 29.5 5 4 47.5 5 +25 46.5 5 +85 45.5 Table 7. Truth Table V1 V2 J1 to J2 J1 to J3 VHIGH Isolation Insertion loss VHIGH Insertion loss Isolation 4 May 12, 217 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice 214F

Typical Performance Characteristics ( 4 C TOP +85 C, VCTL = /5 V, Zo = 5, Unless Otherwise Noted) Insertion Loss () -.5-1. -1.5-2. -2.5 J1 to J2 J1 to J3 Insertion Loss () -.5-1. -1.5-2. -2.5 4 C 25 C -3. Figure 2. Insertion Loss vs Frequency ts495-3. Figure 3. Insertion Loss vs Frequency at 4, 25, 85 C ts496-1 -1-2 -2 Isolation () -3-4 -5 J1 to J3 J1 to J2 Isolation () -3-4 -5 25 C -6-7 Figure 4. Isolation vs Frequency ts497-6 -7 4 C Figure 5. Isolation vs Frequency at 4, 25, 85 C ts498 2.5 2.25 2. J3 Off 2.5 2.25 2. VSWR 1.75 1.5 J2 On VSWR 1.75 1.5 4 C 1. J3 On Figure 6. VSWR vs Frequency ts499 25 C 1. Figure 7. VSWR vs Frequency at 4, 25, 85 C (J3 Off) ts5 214F Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice May 12, 217 5

2.5 2.25 2. VSWR 1.75 1.5 25 C 1. 4 C Figure 8. Input VSWR vs Frequency at 4, 25, 85 C ts51 Package Information The MSOP-8 exposed pad plastic package is shown in Figure 9. For the recommended solder reflow profiles, refer to the Recommended Solder Reflow Profile Application Note. For tape and reel information, refer to the Discrete Devices and IC Switch/Attenuators Tape and Reel Package Orientation Application Note..122 (3.9 mm).114 (2.89 mm) 8.256 (.65 mm) Typ.122 (3.9 mm).114 (2.89 mm).72 (1.83 mm).62 (1.57 mm).73 (1.85 mm).63 (1.6 mm) 1 Pin 1 Indicator.2 (5.8 mm).114 (4.67 mm) Exposed Paddle.12 (.3 mm).8 (.2 mm).6 (.15 mm).2 (.5 mm).44 (1.12 mm) Max Y187 Figure 9. MSOP-8 Exposed Pad Package Dimension Drawing 6 May 12, 217 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice 214F

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