Paul Deffenbaugh, Ph.D Senior Scientist nscrypt, Inc. Direct Digital Manufacturing: 3D Printed Electronics Enables Printed Circuit Structures sme.org/smartmfgseries
Direct Digital Manufacturing: 3D Printed Electronics Enables Printed Circuit Structures sme.org/smartmfgseries nscrypt.com
DDM: 3DP Electronics Enables PCS Paul I. Deffenbaugh, Ph.D. nscrypt, Inc., Orlando, FL
Real multimaterial Conductive Silver paste Structural Thermoplastic Active Pick and Place Resistive Carbon paste Flexible Thermoplastic urethane Smooth Milling Dry/cure/sinter Laser heat Dielectric High-K or low RF loss Adhesive Epoxy, silicone Strong Metal Stiff Carbon Fiber
Printing Plastic filament, 1.75 mm Feed motor Feed system Thermal isolation Heater, max 400 C Nozzle, 12.5 μm nscrypt nfd
Pick and Place
nmill Well-adjusted printing is smooth, but not 1 μm smooth 1 μm runout 50k rpm
Laser drying/curing/sintering 200 W CW 40 W 150 ns pulsed 10 W 8 ps pulsed Controlled temperature
Conventional printed electronics Printed on nscrypt equipment Functional, circa 2011
Fully 3D printed electronics Digital, shape agnostic Multi-material Pick and placed actives On one machine Minimal touch-up Print and play Nonstop operation Temperature cycled
How it s made ABS Filament Silver Paste 3D Printed Electronics FDM nscrypt
How it s made
Draw electronics
Draw electronics
Draw in 3D
3D print
3D print wires
3D print electronics
Test it out
World s first 3D printed PAA element
RF Design Dr. Weller @ the University of South Florida HFSS, ADS
Model Real device manufacturing requires modeling
Prototype Power dividers Phase shifters Switches Capacitively-loaded phase delay lines Tuned split ring filter Antenna balun Antenna matching High impedance surface Main antenna elements 2 ground planes 4 substrate thicknesses
Gain and beam steering test
Measure Precision measurements Process optimization not one-off
PAA elements
Enablers
Accuracy nscrypt 3Dn-Tabletop 100 nm resolution, 10 µm accuracy 0.5 G acceleration, 0 to 100 mm/s in 20 ms nscrypt 3Dn-Gantry 10 nm resolution, 1 µm accuracy 5 G acceleration, 0 to 1 m/s in 20 ms Flow-optimized nozzles 12.5 µm to 1.75 mm (0.0005 to 0.070 ) Common size is 125 µm (0.005, 32 gauge)
Reliability Humidity Heat cycle Cryo Long-term fatigue Environmental, encapsulation Fine features, opens and shorts Thermal tension, wire breaks Thermal management, lifetime Mech. Stress, adhesion 21,000 hours
Rapid manufacturing High speed, high acceleration Multi-nozzle Multi-material Many printers interconnected nscrypt machines are SMEMA standard 3Dn-500PF has linear stage for movement between 2 work areas Closed loop motion control Feedback mechanisms ensuring high yield
Closed loop Motion control with encoders Laser height sensing In-process vision Laser heat control Localized heat, no oven
Software integration Many steps, process of CAD to print nscrypt software supports sequential jobs with arbitrary devices nscrypt-solidworks plugin for 5-axis Autodesk is contributing Drafting software 3D printing
Automation Fully automated 2 thermoplastics Silver paste Pick and place LED SMEMA standard Plays well with others
Terms DDM Flex circuits Printed electronics 3D printing 3D printed electronics PCS digital manufacturing of any kind 2D conductors on non-printed media 2D circuits on non-printed media plastic or metal shapes electronically functional volumetrically arbitrary, customizable everything
Printed Circuit Structures Volumetrically arbitrary Customizable everything Multi everything Structure and circuits tightly integrated
Beyond PCBs Structure can benefit circuitry
Satellites
Arbitrary 3D is PCS Dr. Raymond C. Rumpf, UTEP http://emlab.utep.edu/ US Provisional Patent 62,016,478
Spatially-variant RF Dr. Raymond C. Rumpf, UTEP emlab.utep.edu US Provisional Patent 62,016,478
Structural phased array antenna Wing + PAA structurally are one
World s first 3D printed phased array antenna
Printed circuit structures Smaller size, electrically functional mechanical members Fit into tight or oddly shaped non planar/flat spaces Weight savings Cost of assembly savings Concealment Mass customization Medicine, shoes, phones, food
Printed circuit structures PCB industry is $70B 3DP is only $5B Many groups are leading and most are following America, Germany, Japan are known for worlds best precision equipment Accuracy, precision, speed these are necessary for real devices
Thank you. Paul I. Deffenbaugh, Ph.D. nscrypt, Inc., Orlando, FL nscrypt.com pdeffenbaugh@sciperio.com