eatures Package in 8mm tape on 7 diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. Mono-color type. Pb-free. The product itself will remain within RoHS compliant version. Description The 8-225 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. Besides, lightweight makes them ideal for miniature applications. etc. Applications Backlighting in dashboard and switch. Telecommunication: indicator and backlighting in telephone and fax. lat backlight for LCD, switch and symbol. General use. Copyright 200, Everlight All Rights Reserved. Release Date : 29-May.203. Issue No: DSE-0005366 Rev.4 www.everlight.com
Device Selection Guide Code Chip Materials Emitted Color Resin Color R6 AlGaInP Brilliant Red G6 AlGaInP Brilliant Yellow Green Water Clear Absolute Maximum Ratings (Ta=25 ) Parameter Symbol Code Rating Unit Reverse Voltage V R 5 V R6 25 orward Current I G6 25 ma eak orward Current (Duty /0 @KHz) I P R6 60 G6 60 ma R6 60 Power Dissipation Pd G6 60 mw Electrostatic Discharge ESD HBM 2000 V Operating Temperature T opr -40 ~ +85 Storage Temperature Tstg -40 ~ +90 Soldering Temperature Tsol Reflow Soldering : 260 for 0 sec. Hand Soldering : 350 for 3 sec. 2
Electro-Optical Characteristics (Ta=25 ) Parameter Symbol Code Min. Typ. Max. Unit Condition Luminous Intensity Iv R6 45.0 ----- 2 mcd G6 28.5 ----- 72.0 Viewing Angle 2θ /2 ----- 20 ----- deg Peak Wavelength λp R6 ----- 632 ----- nm G6 ----- 575 ----- Dominant Wavelength λd R6 67.0 ----- 625.0 G6 567.5 ----- 575.5 nm I =20mA Spectrum Bandwidth Radiation λ R6 ----- 20 ----- G6 ----- 20 ----- nm orward Voltage V R6.7 2.0 2.4 G6.7 2.0 2.4 V Reverse Current I R R6 ----- ----- 0 G6 ----- ----- 0 μa V R =5V Note:.Tolerance of Luminous Intensity: ±% 2.Tolerance of Dominant Wavelength ±nm 3. Tolerance of orward Voltage: ±0.0V 3
R6 Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition P 45.0 57.0 P2 57.0 72.0 Q 72.0 90.0 Q2 90.0 2 mcd I =20mA G6 Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition N 28.5 36.0 N2 36.0 45.0 P 45.0 57.0 P2 57.0 72.0 mcd I =20mA Bin Range Of Dom. Wavelength Bin Code Min. Max. Unit Condition C5 567.5 569.5 C6 569.5 57.5 C7 57.5 573.5 C8 573.5 575.5 nm I =20mA Note:.Tolerance of Luminous Intensity: ±% 2.Tolerance of Dominant Wavelength ±nm 4
Typical Electro-Optical Characteristics Curves R6 Relative luminous intensity (%) 00 75 50 25 0 500 Spectrum Distribution I (ma) orward Current 0 550 600 650 700.2 Wavelength λ (nm) 50 40 30 25 20 0 orward Current vs. orward Voltage.6 2.0 2.4 2.8 3.0 orward Voltage V (V) Relative luminous intensity (%) 000 00 0-60 Luminous Intensity vs. Ambient Temperature -40-20 0 20 40 60 80 00 Relative luminous intensity (%) 000 00 0 0 0 Luminous Intensity vs. orward Current 0 0 2 Ambient Temperature Ta ( C) orward Current I (ma) orward Current Derating Curve Radiation Diagram orward Current I (ma) 50 40 30 25 20 0 0 0 20 40 60 85 00 Ambient Temperature Ta ( C).0 0.9 0.8 0.7 0 0 0.5 0.3 0. 0.2 0.4 20 30 40 50 60 70 80 90 0.6 5
Typical Electro-Optical Characteristics Curves G6 Spectrum Distribution orward Current vs. orward Voltage Relative luminous intensity (%) orward Current I (ma) Wavelength λ (nm) Luminous Intensity vs. Ambient Temperature orward Voltage V (V) Luminous Intensity vs. orward Current orward Current I (ma) Relative luminous intensity ( % ) Ambient Temperature Ta ( C) orward Current Derating Curve Relative luminous intensity ( % ) orward Current Radiation Diagram I (ma) Ambient Temperature Ta ( C) 6
Package Dimension.6 0.8 4 3 2 - + 4 3 - + 2 Red Yellow Green Top Polarity.6 0.5 0.8 Side Recommend Soldering Pad 0.32 0.32 2 4 0.4 0.8 0.4 Bottom 0.5 3 Cathode Mark 0.3±0. 0.4±0. 0.5±0. 4 2 0.8.3±0.2 3 0.7±0. Suggested pad dimension is just for reference only. Please modify the pad dimension based on individual need. Note: Tolerances unless mentioned ±0.mm. Unit = mm 7
Label Explanation Pb CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX QTY : XXX LOT NO : XXXXXXXXXX EVERLIGHT CAT : XXX HUE : XXX RE : XXX RoHS CPN: Customer s Product Number P/N: Product Number QTY: Packing Quantity CAT: Luminous Intensity Rank HUE: Chromaticity Coordinates & Dom. Wavelength Rank RE: orward Voltage Rank LOT No: Lot Number Reference : XXXXXXXX MADE IN TAIWAN Reel Dimensions Note: The tolerances unless mentioned is ±0.mm,Unit = mm 8
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel - - + + Note: The tolerances unless mentioned is ±0.mm,Unit = mm Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label 9
Precautions or Use. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2. Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is year under 30 or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5 for 24 hours. 3. Soldering Condition 3. Pb-free solder temperature profile Above255 C 30sec.Max. 3 C/sec.Max. Pre-heating 50~200 C 60~20sec. Above 27 C 60~50sec. 260 C Max. 0sec. Max. 6 C/sec.Max. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 0
Application Restrictions High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document.