S (surface mount) Issue date

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S (surface mount) Issue date

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Transcription:

Plastic thermal enhanced very thin small outline package; no leads; 16 terminals 10 June 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive code Package type industry code Package style descriptive code Package body material type IE package outline code --- JEDE package outline code JEIT package outline code --- Mounting method type D (double) HVSON16 HVSON16 HVSON (thermal enhanced very thin small outline; no leads) P (plastic) MO-229 S (surface mount) Issue date 4-7-2011 Symbol Parameter Min Typ Nom Max Unit D package length 5.4-5.5 5.6 mm E package width 3.4-3.5 3.6 mm seated height 0.8-0.85 1 mm e nominal pitch - - 0.65 - mm n 2 actual quantity of termination - - 16 -

2. Package outline HVSON16: plastic thermal enhanced very thin small outline package; no leads; 16 terminals; body 3.5 x 5.5 x 0.85 mm X D B E 1 3 terminal 1 index area detail X terminal 1 index area L e 1 e b 1 8 v w B y 1 y E 1 K 16 9 D 1 Dimensions 0 3 6 mm scale Unit 1 3 b D D 1 E E 1 e e 1 k L v w y y 1 mm max nom min 1.00 0.85 0.80 0.00 0.2 0.35 0.32 0.29 5.6 5.5 5.4 3.75 3.70 3.65 3.6 3.5 1.85 1.80 0.65 4.55 3.4 1.75 0.2 0.55 0.50 0.45 0.1 0.1 sot1308-1_po Outline version References IE JEDE JEIT MO-229 European projection Issue date 11-07-04 11-11-25 Fig. 1. Package outline HVSON16 () ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. ll rights reserved Package information 10 June 2016 2 / 5

3. Soldering Footprint information for reflow soldering of HVSON16 package Gx D P (0.105) nspx SPx SPy Hy Gy SPy tot nspy SLy By y SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P y By D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hy nspx nspy 0.65 4.45 2.60 0.925 0.35 3.75 1.85 2.05 0.70 0.70 0.70 5.75 3.75 4.70 Issue date 11-08-01 11-08-25 2 1 sot1308-1_fr Fig. 2. Reflow soldering footprint for HVSON16 () ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. ll rights reserved Package information 10 June 2016 3 / 5

4. Legal information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. ll rights reserved Package information 10 June 2016 4 / 5

5. ontents 1. Package summary...1 2. Package outline... 2 3. Soldering... 3 4. Legal information... 4 NXP Semiconductors N.V. 2016. ll rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 June 2016 ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2016. ll rights reserved Package information 10 June 2016 5 / 5

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