Fusile Thin Film Chip Resistor M25SI fusile thin film chip resistors re designed for overlod protection in modern professionl electronics. Typicl pplictions include utomotive, telecommuniction nd industril equipment. FEATURES Metl film on high qulity cermic Specil protective top cot Flme retrdnt Sn solder contcts on Ni rrier lyer Fusile resistor for constnt voltge Automtic plcement comptiility Complint to RoHS directive 2002/95/EC METRIC SIZE INCH: 1206 METRIC: RR 3216M TECHNICA SPECIFICATIONS DESCRIPTION M25SI Metric size RR 3216M Resistnce rnge 5 Ω to 3.9 kω Resistnce tolernce ± 5 % Temperture coefficient ± ppm/k Climtic ctegory (CT/UCT/dys) 55/125/56 Rted dissiption, P (1) 70 0.25 W imiting element voltge, U mx. DC/AC RMS P x R Mximum permissile film temperture 125 C Insultion voltge (1 min), U ins DC/AC pek > 300 V Therml resistnce (2) 220 K/W Insultion resistnce > 10 9 Ω Filure rte 1 x 10-9 h -1 E-Series 24 Notes (1) The power dissiption on the resistor genertes temperture rise ginst the locl mient, depending on the het flow support of the printed-circuit ord (therml resistnce). The rted dissiption pplies only if the permitted film temperture is not exceeded. Furthermore, high level of mient temperture or of power dissiption my rise the temperture of the solder joint, hence specil solder lloys or ord mterils my e required to mintin the reliility of the ssemly. (2) Mesuring conditions in ccordnce with EN 140401-801 Mrking: 3 digits Tolernce 1 % on request Beige top cot PUSE TEST DATA Pulse power (squre pulse) 0.9 W 0.3 W Pulse durtion t i µs ms Pulse puse t p ms 1 s Numer of pulses 10 5 10 5 Drift fter pulse test < 0.1 % < 0.1 % Document Numer: 20031 For technicl questions, contct: thinfilmchip@vishy.com www.vishy.com Revision: 17-Sep-09 235
Fusile Thin Film Chip Resistor PART NUMBER AND PRODUCT DESCRIPTION (1) PART NUMBER: M251206BB9109JP500 M 2 5 1 2 0 6 B B 9 1 0 9 J P 5 0 0 MODE/SIZE SPECIA CHARACTER TC VAUE TOERANCE PACKAGING SPECIA M251206 B = SI B = ± ppm/k 3 digit vlue 1 digit multiplier J = ± 5 % P5 Up to 2 digits 00 = Stndrd PRODUCT DESCRIPTION: M25SI 91R 5 % P5 MUTIPIER 8 = *10-2 9 = *10-1 0 = *10 0 1 = *10 1 M25SI 91R 5 % P5 MODE TCR RESISTANCE VAUE TOERANCE PACKAGING M25SI ± ppm/k 91R = 91 Ω ± 5 % P5 Note (1) Products cn e ordered using the PART NUMBER or PRODUCT DESCRIPTION PACKAGING MODE DIMENSIONS TAPE WIDTH [mm] PITCH REE DIAMETER [mm/inch] PIECES PER REE PACKAGING CODE TYPE OF CARRIER TAPE M25SI 8 4 180/7 5000 P5 Pper T 1 W H DIMENSIONS AND MASS SIZE H W T 1 T 2 MASS INCH METRIC (mg) 1206 3216 0.55 ± 0.05 3.2 + 0.10/- 0.20 1.6 ± 0.15 0.45 ± 0.2 0.4 ± 0.2 10 SODER PAD DIMENSIONS T 2 l RECOMMENDED SODER PAD DIMENSIONS INCH SIZE WAVE SODERING REFOW SODERING METRIC l 1206 3216 0.9 1.7 2.0 1.1 1.7 2.3 www.vishy.com For technicl questions, contct: thinfilmchip@vishy.com Document Numer: 20031 236 Revision: 17-Sep-09
Fusile Thin Film Chip Resistor M25SI DESCRIPTION Production is strictly controlled nd follows n extensive set of instructions estlished for reproduciility. A homogeneous film of metl lloy is deposited on high grde Al 2 O 3 cermic sustrte. Specilly designed inner contcts re deposited on oth sides. A specil lser is used to chieve the trget vlue y smoothly cutting mender groove in the resistive lyer without dmging the cermics. The resistor elements re covered y protective coting designed for electricl, mechnicl nd climtic protection. The termintions receive finl pure tin on nickel plting. The result of the determined production is verified y n extensive testing procedure. Only ccepted products re lid directly into the pper tpe in ccordnce with IEC 60286-3. ASSEMBY The resistors re suitle for processing on utomtic SMD ssemly systems. They re suitle for utomtic soldering using wve, reflow or vpour phse s shown in IEC 61760-1 (3). The encpsultion is resistnt to ll clening solvents commonly used in the electronics industry, including lcohols, esters nd queous solutions. The use of conforml coting is not permitted. The resistors re RoHS complint; the pure tin plting provides comptiility with led (P)-free nd led-contining soldering processes. Solderility is specified for 2 yers fter production or requlifiction. The permitted storge time is 20 yers. The immunity of the plting ginst tin whisker growth hs een proven under extensive testing. All products comply with the GADS (1) nd the CEFIC-EECA-EICTA (2) list of legl restrictions on hzrdous sustnces. This includes full complince with the following directives: 2000/53/EC End of Vehicle life Directive (EV) nd Annex II (EV II) 2002/95/EC Restriction of the use of Hzrdous Sustnces directive (RoHS) 2002/96/EC Wste Electricl nd Electronic Equipment Directive (WEEE) Notes (1) Glol Automotive Declrle Sustnce ist, see www.gdsl.org (2) CEFIC (Europen Chemicl Industry Council), EECA (Europen Electronic Component Mnufcturers Assocition), EICTA (Europen trde orgnistion representing the informtion nd communictions technology nd consumer electronics), see www.eict.org issues environment policy chemicls chemicls for electronics (3) The quoted IEC stndrds re lso relesed s EN stndrds with the sme numer nd identicl contents FUNCTIONA PERFORMANCE Time to Fuse in s 0 10 Voltge in V 0 1 0.1 10 0.01 0.001 0 1 2 3 4 5 6 7 8 9 10 Power in W Fusing Performnce 1 1 10 0 10 000 Resistnce Vlue in Ω Mximum Applicle Voltge fter Fusing Document Numer: 20031 For technicl questions, contct: thinfilmchip@vishy.com www.vishy.com Revision: 17-Sep-09 237
Fusile Thin Film Chip Resistor Rted Power in % 120 80 60 Temperture Rise in C 75 60 45 40 30 20 15 Derting 0-55 - 25 0 25 50 75 125 150 175 70 Amient Temperture in C 0 0 0.1 0.2 0.3 0.4 Power in W Temperture Rise TEST AND REQUIREMENTS All tests except the fusing chrcteristics re crried out in ccordnce with the following specifictions: EN 60115-1, generic specifiction EN 140400, sectionl specifiction The tests re crried out in ccordnce with IEC 60068 (3) nd under stndrd tmospheric conditions in ccordnce with IEC 60068-1, 5.3 (3). Climtic ctegory CT/UCT/56 (rted temperture rnge: ower ctegory temperture, upper ctegory temperture; dmp het, long term, 56 dys) is vlid. Unless otherwise specified the following vlues pply: Temperture: 15 C to 35 C Reltive humidity: 45 % to 75 % Air pressure: 86 kp to 106 kp (860 mr to 1060 mr). The components re mounted for testing on ords in ccordnce with EN 60115-1, 4.31 unless otherwise specified. TEST PROCEDURES AND REQUIREMENTS TEST CONDITIONS OF TEST REQUIREMENTS PERMISSIBE CHANGE (ΔR) Endurnce test t 70 C IEC 60115-1 4.25.1 0 h t 70 C 1.5 h ON, 0.5 h OFF ± 1 % Endurnce t UCT IEC 60115-1 4.25.3 0 h t 125 C without lod ± 1 % Therml shock IEC 60115-1 4.19, IEC 60068-2-14 Rpid chnge etween upper nd lower ctegory temperture ± 0.2 % Dmp het stedy stte IEC 60115-1 4.24, IEC 60068-2-78 56 dys t 40 C nd 93 % reltive humidity ± 0.5 % Resistnce to soldering het IEC 60115-1 4.18, IEC 60068-2-58 10 s t 260 C solder th temperture ± 0.2 % www.vishy.com For technicl questions, contct: thinfilmchip@vishy.com Document Numer: 20031 238 Revision: 17-Sep-09
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