MIC94090/1/2/3/4/5. Features. General Description. Applications. Typical Application. High Side Load Switches for Consumer Applications

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High Side Load Switches for Consumer Applications General Description The is a family of high-side load switches designed for operation from 1.7V to 5.5V input voltage. The load switch pass element is an internal 130mΩ R DS(ON) P- channel MOSFET which enables the device to support up to 1.2A continuous current. Additionally, the load switch supports 1.5V logic level control and shutdown features. The MIC94090 and MIC94091 feature rapid turn on. The MIC94092 and MIC94093 provide a slew rate controlled softstart turn-on of 790µs, while the MIC94094 and MIC94095 provide a slew rate controlled soft-start turn-on of 120µs. The soft-start feature option prevents an in-rush current event from pulling down the input supply voltage. The MIC94091, MIC94093, and MIC94095 include a 250Ω auto discharge load circuit that is switched on when the load switch is disabled. An active pull-down on the enable input keeps the in a default OFF state until the enable pin is pulled above 1.25V. Internal level shift circuitry allows low voltage logic signals to switch higher supply voltages. The enable voltage can be as high as 5.5V and is not limited by the input voltage. The operating voltage range makes them ideal for Lithium ion and NiMH/NiCad/Alkaline battery powered systems, as well as non-battery powered applications. The devices provide low quiescent current and low shutdown current to maximize battery life. Datasheets and support documentation can be found on Micrel s web site at: www.micrel.com. Features 1.7V to 5.5V input voltage range 1.2A continuous operating current 130mΩ R DS(ON) Internal level shift for CMOS/TTL control logic Ultra low quiescent current Micro-power shutdown current Rapid turn-on: MIC94090/1 Soft-Start: MIC94092/3 (790µs), MIC94094/5 (120µs) Load discharge circuit: MIC94091/3/5 Space saving and thermally capable 1.2mm x 1.2mm Thin MLF package Industry standard SC-70-6 package Applications Cellular phones Portable Navigation Devices (PND) GPS modules Personal Media Players (PMP) Ultra Mobile PCs Other Portable applications PDAs Portable instrumentation Industrial and DataComm equipment Typical Application MIC94090 (ultra fast turn on) MIC94092 (790µs soft-start) MIC94094 (120µs soft-start) MIC94091 (ultra fast turn on with auto-discharge) MIC94093 (790µs soft-start with auto-discharge) MIC94095 (120µs soft-start with auto-discharge) MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc. Micrel Inc. 2180 Fortune Drive San Jose, CA 95131 USA tel +1 (408) 944-0800 fax + 1 (408) 474-1000 http://www.micrel.com March 2009 M9999-033109-A

Ordering Information Part Number Pb-Free Part Marking Pb-Free (1) Fast Turn On Soft- Start Load Discharge (2) (3) Package MIC94090YMT D1 4-Pin 1.2mm x 1.2mm Thin MLF MIC94091YMT D2 4-Pin 1.2mm x 1.2mm Thin MLF MIC94092YMT D5 790µs 4-Pin 1.2mm x 1.2mm Thin MLF MIC94093YMT D7 790µs 4-Pin 1.2mm x 1.2mm Thin MLF MIC94094YMT 0D 120µs 4-Pin 1.2mm x 1.2mm Thin MLF MIC94095YMT 1D 120µs 4-Pin 1.2mm x 1.2mm Thin MLF MIC94090YC6 D1D SC-70-6 MIC94091YC6 D2D SC-70-6 MIC94092YC6 D5D 790µs SC-70-6 MIC94093YC6 D7D 790µs SC-70-6 MIC94094YC6 0DD 120µs SC-70-6 MIC94095YC6 1DD 120µs SC-70-6 Notes: 1. Under bar symbol ( _ ) may not be to scale. 2. Thin MLF = Pin 1 identifier. 3. Thin MLF is a GREEN RoHS-compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free. Pin Configuration PIN 1 TRIANGLE BY MARKING VOUT 1 4 GND EN 2 3 VIN 4-Pin (1.2mm x 1.2mm) Thin MLF (MT) Top View 6-Pin SC-70-6 (C6) Top View Pin Description Pin Number TMLF-4 SC-70-6 Pin Name Pin Function 1 1 V OUT Drain of P-Channel MOSFET. 4 2, 5 GND Ground: Connect to electrical ground. 3 4 V IN Source of P-Channel MOSFET. 2 6 EN Enable (Input): Active-high CMOS-compatible control input for switch. Internal 2MΩ pull down resistor to GND, output will be off if this pin is left floating. -- 3 NC No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation. March 2009 2 M9999-033109-A

Absolute Maximum Ratings (1) Input Voltage (V IN )... +6V Enable Voltage (V EN )... +6V Continuous Drain Current (I D ) (3) T A = 25 C (MLF )... ±1.2A T A = 25 C (SC-70)... ±1.2A Pulsed Drain Current (I DP ) (4)... ±6.0A Continuous Diode Current (I S ) (5)... 50mA Storage Temperature (T s )... 55 C to +150 C ESD Rating HBM (6)...3kV Operating Ratings (2) Input Voltage (V IN )... +1.7 to +5.5V Junction Temperature (T J )... 40 C to +125 C Package Thermal Resistance Thin MLF (θ JC ) (3)...60 C/W Thin MLF (θ JA ) (3)...140 C/W SC-70-6 (θ JC )...100 C/W SC-70-6 (θ JA )...240 C/W Electrical Characteristics T A = 25 C, bold values indicate 40 C< T A < +85 C, unless noted. Symbol Parameter Condition Min Typ Max Units V EN_TH Enable Threshold Voltage V IN = 1.7V to 4.5V, I D = 250μA 0.4 1.25 V I Q Quiescent Current Measured on the V IN Pin V IN = V EN = 5.5V, I D = OPEN Measured on V IN MIC94090/1 0.1 1 µa V IN = V EN = 5.5V, I D = OPEN 8 15 µa Measured on V IN MIC94092/3/4/5 I EN Enable Input Current V IN = V EN = 5.5V, I D = OPEN 2.5 4 µa I SD Shutdown Current V IN = +5.5V, V EN = 0V, I D = OPEN Measured on the V IN pin (7) 0.01 1 µa I SHUT-SWITCH OFF State Leakage Current V IN = +5.5V, V EN = 0V, I D = SHORT 0.01 1 µa (7) Measured on V OUT R DS(ON) P-Channel Drain to Source ON Resistance R SHUTDOWN Turn-Off Resistance V IN = +3.6V, I TEST = 1mA, V EN = 0V MIC94091/3/5 V IN = +5.0V, I D = 100mA, V EN = 1.5V 130 225 mω V IN = +4.5V, I D = 100mA, V EN = 1.5V 135 235 mω V IN = +3.6V, I D = 100mA, V EN = 1.5V 140 255 mω V IN = +2.5V, I D = 100mA, V EN = 1.5V 170 315 mω V IN = +1.8V, I D = 100mA, V EN = 1.5V 235 355 mω V IN = +1.7V, I D = 100mA, V EN = 1.5V 260 375 mω 250 400 Ω March 2009 3 M9999-033109-A

Electrical Characteristics (Dynamic) T A = 25 C, bold values indicate 40 C< T A < +85 C, unless noted. Symbol Parameter Condition Min Typ Max Units t ON_DLY t ON_RISE Turn-On Delay Time V IN = +3.6V, ID = 100mA, V EN = 1.5V MIC94090/1 0.4 1.5 µs V IN = +3.6V, ID = 100mA, V EN = 1.5V MIC94092/3 200 740 1500 µs V IN = +3.6V, ID = 100mA, V EN = 1.5V 65 110 165 µs MIC94094/5 Turn-On Rise Time V IN = +3.6V, ID = 100mA, V EN = 1.5V 0.4 1.5 µs MIC94090/1 V IN = +3.6V, ID = 100mA, V EN = 1.5V 400 790 1500 µs MIC94092/3 V IN = +3.6V, ID = 100mA, V EN = 1.5V 65 120 175 µs MIC94094/5 t OFF_DLY Turn-Off Delay Time V IN = +3.6V, ID = 100mA, V EN = 1.5V 60 200 ns t OFF_FALL Turn-Off Fall Time V IN = +3.6V, ID = 100mA, V EN = 1.5V 10 100 ns Notes: 1. Exceeding the absolute maximum rating may damage the device. 2. The device is not guaranteed to function outside its operating rating. 3. With backside thermal contact to PCB. See thermal considerations section. 4. Pulse width <300μs with < 2% duty cycle. 5. Continuous body diode current conduction (reverse conduction, i.e. V OUT to V IN ) is not recommended. 6. Devices are ESD sensitive. Handling precautions recommended. HBM (Human body model), 1.5kΩ in series with 100pF. 7. Measured on the MIC94090YMT. March 2009 4 M9999-033109-A

Typical Characteristics March 2009 5 M9999-033109-A

Typical Characteristics March 2009 6 M9999-033109-A

Functional Characteristics MIC94090 March 2009 7 M9999-033109-A

MIC94091 March 2009 8 M9999-033109-A

MIC94092 March 2009 9 M9999-033109-A

MIC94093 March 2009 10 M9999-033109-A

MIC94094 March 2009 11 M9999-033109-A

MIC94095 March 2009 12 M9999-033109-A

Application Information Power Dissipation Considerations As with all power switches, the ultimate current rating of the switch is limited by the thermal properties of the package and the PCB it is mounted on. There is a simple, ohms law type relationship between thermal resistance, power dissipation and temperature which are analogous to an electrical circuit: A switch is intended to drive a 500mA load and is placed on a printed circuit board which has a ground plane area of at least 25mm square. The Voltage source is a Li-ion battery with a lower operating threshold of 3V and the ambient temperature of the assembly can be up to 50 o C. Summary of variables: I SW = 0.5A VIN = 3V to 4.2V Tamb = 50 o C Rθ JC = 60 o C/W from Datasheet (P. 3) Rθ CA = 53 o C/W Read from Graph in Fig. 3 Figure 1. Electrical Circuit From this simple circuit we can calculate Vx if we know Isource, Vz and the resistor values, Rxy and Ryz using the equation: Vx = Isource Rxy + Ryz + ( ) Vz Thermal circuits can be considered using these same rules and can be drawn similarly replacing current sources with Power dissipation (in Watts), Resistance with Thermal Resistance (in o C/W) and Voltage sources with temperature (in o C). Figure 3. Excerpt from the LDO Book (1) Figure 2. Thermal Equivalent Circuit Now replacing the variables in the equation for Vx, we can find the junction temperature (Tj) from power dissipation, ambient temperature and the known thermal resistance of the PCB (Rθ CA ) and the package (Rθ JA ). T = P Rθ + Rθ + T (1) J DISS ( JC CA ) AMB It is this equation that is used to determine the graphs on page 7. P DISS is calculated as (I 2 SWITCH x R SWmax ). Rθ JC is found in the operating ratings section of the datasheet and Rθ CA (the PCB thermal resistance) values for various PCB copper areas can be taken from Designing with Low Dropout Voltage Regulators (1) available from the Micrel website (LDO Application Hints). Example: P DISS = I 2 SW x R SWmax The worst case switch resistance (R SWmax ) at the lowest VIN of 3V is not available in the datasheet, so the next lower value of VIN is used. R SWmax @ 2.5v = 315mΩ If this were a figure for worst case R SWmax for 25 o C, an additional consideration is to allow for the maximum junction temperature of 125 o C, the actual worst case resistance in this case will be 30% higher (See R DS(on) variance vs. temperature graph). R SWmax @ 2.5v (@ 125 C) = 315 x 1.3 = 410mΩ Therefore junction temperature (T J ): T J = 0.5 2 x 0.41 x (60+53) + 50 from (Eqn. 1) T J = 62 o C This is well below the maximum 125 o C. March 2009 13 M9999-033109-A

Package Information 6-Pin SC-70 (C6) March 2009 14 M9999-033109-A

4-Pin Thin MLF (MT) March 2009 15 M9999-033109-A

Landing Pattern Optional for maximum thermal performance. Heatsink should be connected to GND plane of PCB for maximum thermal performance. Suggested Land Pattern 4-Pin Thin MLF (MT) MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. 2009 Micrel, Incorporated. March 2009 16 M9999-033109-A