Description The KAQW series contains two normally open switches that can be used as two independent SPST relays or as one DPST relay. The relay is constructed using a GaAlAs LED for actuation control and an integrated monolithic dies for the switch output. The die, Schematic fabricated in a high-voltage dielectrically isolated technology, is comprised of a photodiode array, switch control circuitry and MOSFET switches. DUAL FORM A NORMALLY OPEN Features. Normally open, double pole single throw. Control V AC or DC voltage. Switch ma loads. Controls low-level analog signals. High sensitivity, low ON resistance. Low-level off-state leakage current. High isolation voltage KV (DIP / SMD). Pb free and RoHS compliant 9. MSL class. Agency Approvals: UL Approved (No. E): UL C-UL Approved (No. E) FIMKO Approved: EN, EN9 Application Telecommunications (PC, electronic notepad) Modem Telephone equipment Security equipment Sensors Measuring and testing equipment Factory automation equipment High speed inspection machines Document No. 9M. - -
Outside Dimension Unit:mm. Dual-in-line type.. Surface mount type. KAQW KAQWA.. 9... 9..............±. ~.±..... Small outline for surface mount type. KAQWS. 9... + -..±..±..Max... TOLERANCE:±.mm Device Marking cosmo W YWW Notes: cosmo W YWW :Pin forming Y:Year code / W:Week code Document No. 9M. - -
Absolute Maximum Ratings Item Symbol Rating Unit Continuous forward current I F ma Peak forward current I FP A Input Reverse voltage V R V Power dissipation P in mw Derate linearly from -. mw/ Breakdown voltage V B V Output Continuous load current I L ma Power dissipation P out mw Isolation voltage V iso KAQWS KAQW Vrms Vrms Isolation resistance (Vio=V) R iso Ω Total power dissipation P t mw Derate linearly from -. mw/ Operating temperature T opr - to + Storage temperature T stg - to + Junction temperature T j Soldering temperature seconds T sot (Ta= ) Electro-optical Characteristics (Ta= ) Parameter Symbol Conditions Min. Typ. Max. Unit Forward voltage V F I F =ma -.. V Input Operation input current I FON V L =V, I L =ma - -. ma Recovery input current I FOFF V L =V, I L μa. - - ma Output Breakdown voltage V B I B =μa - - V Off-state leakage current I LEAK V L =V, I F =ma -.. μa I/O capacitance C iso V B =V, f=mhz - - pf ON resistance R ON I F =ma, I L =ma -.. Ω Turn-on time T ON I F =ma, V L =V -.. ms Turn-off time T OFF I L =ma, t=ms -.. ms Turn-on / Turn-off Time Input Output 9% % T ON T OFF Document No. 9M. - -
Schematic and Wiring Diagrams Schematic Output Configuration Connection Wiring Diagrams () Two independent Form A use VIN I F I L VL VIN I F I L VL VIN I F I L V L VIN I F I L VL a AC DC - () Form A use VIN I F I L I L VL VL I L V L VIN I F I L VL Document No. 9M. - -
Fig. Current Fig. On Resistance Current (ma) - - On Resistance (Ω) - - Ambient Temperature Ta ( ) Ambient Temperature Ta ( ) Fig. Turn-on Time. Fig. Turn-off Time. Turn-on Time (ms).... Turn-off Time (ms).... - - - - Ambient Temperature Ta ( ) Ambient Temperature Ta ( ) Fig. LED Operate Current Fig. LED Turn-off Current. LED Operate Current (ma) - - LED Turn-off Current (ma).... - - Ambient Temperature Ta ( ) Ambient Temperature Ta ( ) Document No. 9M. - -
Fig. LED Dropout Voltage Fig. Voltage vs. Current Characteristics of Output at MOSFET Portion LED Dropout Voltage (V).9.....9 m A m A m A m A m A - - Ambient Temperature Ta ( ) Fig.9 Turn-on Time vs. LED forward Current Current (ma) -. -. -. -. -...... - - - - - - Voltage (V) Fig. Off-state Leakage Current vs. Voltage. - Turn-on Time (ms).... Off-state Leakage Current (A) - - - -9 - LED Forward Current (ma) Fig. Turn-off Time vs. LED Forward Current Voltage (V) Fig. Output Capacitance vs. Applied Voltage. Turn-off Time (ms).... Output Capacitance (PF) LED Forward Current (ma) Applied Voltage (V) Document No. 9M. - -
Using Methods Examples of resistance value to control LED forward current (I F =ma) R E R E E R.V Approx. Ω V Approx. Ω V Approx..9K Ω V Approx..K Ω V Approx..K Ω. LED forward current must be more than ma,at E min.. LED forward current must be less than ma,at E max. Emin. Emax. Regulate the spike voltage generated on the inductive load as follows: R-C Snubber Document No. 9M. - -
Recommended Soldering Conditions (a) Infrared reflow soldering: Peak reflow soldering: or below (package surface temperature) Time of peak reflow temperature: sec Time of temperature higher than : - sec Time to preheat temperature from ~9 : - sec Number of reflows: Two Flux: Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of. Wt% is recommended.) Recommended Temperature Profile of Infrared Reflow se c M a x. temperature 9 - s e c - se c t (s ) (b) Wave soldering: Temperature: Time: Preheating conditions: Number of times: Flux: or below (molten solder temperature) seconds or less or below (package surface temperature) One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of. Wt% is recommended.) (c) Cautions: Fluxes: Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. Avoid shorting between portion of frame and leads. Document No. 9M. - -
Numbering System KAQW X (Y) Note: KAQW = Part No. X = Lead form option ( blank S or A ) Y = Tape and reel option ( TL TR ) Option Description Packing quantity A (TL) surface mount type package + TL tape & reel option units per reel A (TR) surface mount type package + TR tape & reel option units per reel S (TL) S (TR) small outline for surface mount type package + TL tape & reel option small outline for surface mount type package + TR tape & reel option units per reel units per reel Recommended Pad Layout for Surface Mount Lead Form. Surface m ount type.. Sm all outline for surface m ount type. -pin SMD -pin SOP..9......... Unit:mm Document No. 9M. - 9 -
-pin SMD Carrier Tape & Reel... Unit: mm..±... TL. TOLERANCE:±.mm..9 TR Direction of feed from reel Direction of feed from reel... Document No. 9M. - -
-pin SOP Carrier Tape & Reel... Unit: mm..±..... TOLERANCE : ±.mm TL TR Direction of feed from reel Direction of feed from reel... Document No. 9M. - -
Application Notice The content of datasheet is the guidance for product use only. cosmo takes no responsibility to the accuracy of the information provided here. For continuously improving all of products, including quality, reliability, function...etc., cosmo reserves the right to change the specification, characteristics, data, materials, and structure of products without notice. Please contact with cosmo to obtain the latest specification. It would be required to comply with the absolute maximum ratings listed in the specification. cosmo has no liability and responsibility to the damage caused by improper use of the products. cosmo products are intended to be designed for use in general electronics application list below: a. Personal computer b. OA machine c. Audio / Video d. Instrumentation e. Electrical application f. Measurement equipment g. Consumer electronics h. Telecommunication cosmo devices shall not be used or related with equipment requiring higher level of quality / reliability, or malfunction, or failure which may cause loss of human life, bodily injury, includes, without limitation: a. Medical and other life supporting equipments b. Space application c. Telecommunication equipment (trunk lines) d. Nuclear power control e. Equipment used for automotive vehicles, trains, ships...etc. This publication is the property of cosmo. No part of this publication may be reproduced or copied in any form or any means electronically or mechanically for any purpose, in whole or in part without any written permission expressed from cosmo. Document No. 9M. - -