UNA0216 (UN216) Silicon PNP epitaxial planar type (3 elements) Silicon NPN epitaxial planar type (3 elements) Small Signal Transistor Arrays

Similar documents
Maintenance/ Discontinued

XN04312 (XN4312) Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) Composite Transistors. For switching/digital circuits

Maintenance/ Discontinued

DMG Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) Unit: mm. For general amplification.

DMG Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) Unit: mm. For general amplification.

DMG Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) For general amplification DMG20401 in SMini6 type package

DME20B01. Silicon PNP epitaxial planar type (Tr1) Silicon NPN epitaxial planar type (Tr2) For general amplification. Features. Marking Symbol: A3

DMC904F0. Silicon NPN epitaxial planar type. For high frequency amplification. Features. Marking Symbol: D3. Basic Part Number.

DMG Silicon NPN epitaxial planar type (Tr1) Silicon PNP epitaxial planar type (Tr2) For digital circuits DMG26401 in SMini6 type package

DSA7101. Silicon PNP epitaxial planar type. For low frequency amplification Complementary to DSC7101. Features. Marking Symbol: 4C.

Maintenance/ Discontinued

Parameter Symbol Conditions Min Typ Max Unit Forward voltage V F I F = 10 ma V V

Maintenance/ Discontinued

Maintenance/ Discontinued

Maintenance/ Discontinued

Maintenance/ Discontinued

Maintenance/ Discontinued

Maintenance/ Discontinued

DATA SHEET. Part No. AN17821A

DATA SHEET AN5832SA. Part No. SEMICONDUCTOR COMPANY MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

DA2J10100L DA2J10100L. Silicon epitaxial planar type. Doc No. TT4-EA Revision. 3. For high speed switching circuits. Internal Connection

Maintenance/ Discontinued

BAS16 Silicon epitaxial planar type

I F = I R = 100 ma, I rr = 0.1 I R, Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.

Maintenance/ Discontinued

DA3J101F0L DA3J101F0L. Silicon epitaxial planar type. Doc No. TT4-EA Revision. 3

DA2S00100L DA2S00100L. Silicon epitaxial planar type. Doc No. TT4-EA Revision. 3. For band switching. Internal Connection

DA6X102S0R Silicon epitaxial planar type

DB2J50100L DB2J50100L. Silicon epitaxial planar type. Doc No. TT4-EA Revision. 2. For high speed switching circuits. Internal Connection

DA2J10400L DA2J10400L. Silicon epitaxial planar type. Doc No. TT4-EA Revision. 3. For high speed switching circuits. Internal Connection

Maintenance/ Discontinued

DB4X501K0R Silicon epitaxial planar type

BAS16 Silicon epitaxial planar type

DA6X106U0R Silicon epitaxial planar type

DA4X106U0R Silicon epitaxial planar type

DB L DB L. Silicon epitaxial planar type. Doc No. TT4-EA Revision. 2. For rectification. Internal Connection

FK Silicon N-channel MOS FET. For switching circuits. Overview. Package. Features. Marking Symbol: CV. Packaging

HN1B01F HN1B01F. Audio-Frequency General-Purpose Amplifier Applications Q1: Q2: Marking. Q1 Absolute Maximum Ratings (Ta = 25 C)

DA22F2100L DA22F2100L. Silicon epitaxial planar type. Doc No. TT4-EA Revision. 3. For high speed switching circuits. Internal Connection

130 Reverse current IR VR = 1 V. 20 A Temperature coefficient of zener voltage *3 SZ IZ = 5 ma mv/ C Note) 1.

DB2W31800L DB2W31800L. Silicon epitaxial planar type. Doc No. TT4-EA Revision. 4. For rectification. Internal Connection

HN1B04FU HN1B04FU. Audio Frequency General Purpose Amplifier Applications. Marking. Q1 Absolute Maximum Ratings (Ta = 25 C)

Maintenance/ Discontinued

DB L DB L. Silicon epitaxial planar type. Doc No. TT4-EA Revision. 2. For rectification. Internal Connection

TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT process) 2SC4213

TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process) 2SC2705

TOSHIBA Transistor Silicon NPN Epitaxial Type 2SC3225. JEITA Storage temperature range T stg 55 to 150 C

Maintenance/ Discontinued

LNJ757W86RA. High Bright Surface Mounting Chip LED. ESS Type. Absolute Maximum Ratings T a = 25 C. Lighting Color

TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process) 2SC3328. JEITA Storage temperature range T stg 55 to 150 C

TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process) RN1110MFV,RN1111MFV

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) 2SA1428. JEITA Junction temperature T j 150 C

TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT process) 2SC2240

Packaging 1. Cathode 2. Anode V Zener operating resistance. 40 Reverse current IR VR = 2.0 V

DB2J41100L DB2J41100L. Silicon epitaxial planar type. Doc No. TT4-EA Revision. 2. For rectification. Internal Connection

TOSHIBA Transistor Silicon PNP Triple Diffused Type 2SA2142

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT process) 2SA1736. mw 1000 (Note 1)

MTM761110LBF MTM761110LBF. Silicon P-channel MOSFET. for Switching. Internal Connection. Pin name

1.0 V Zener voltage *1, *2 VZ IZ = 5 ma Zener operating resistance RZ IZ = 5 ma. 40 Zener rise operating resistance RZK IZ = 0.

TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process) 2SC3423

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT process) 2SA1213. mw 1000 (Note 1)

FK L FK L. Silicon N-channel MOSFET. Doc No. TT4-EA Revision. 4. For switching FK in SMini3 type package

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) 2SA1145

TOSHIBA Transistor Silicon NPN Triple Diffused Type 2SD2012

Maintenance/ Discontinued

MTM232232LBF Silicon N-channel MOSFET

FK6K02010L FK6K02010L. Silicon N-channel MOS FET. Doc No. TT4-EA Revision. 2. For switching. Internal Connection. Pin Name

FK L Silicon N-channel MOS FET

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process) 2SA1145. JEDEC TO-92MOD Storage temperature range T stg 55 to 150 C

Maintenance/ Discontinued

Maintenance/ Discontinued

Maintenance/ Discontinued

FK330309EL FK330309EL. Silicon N-channel MOSFET For switching circuits. Doc No. TT4-EA Revision. 2. Internal Connection.

TOSHIBA Transistor Silicon PNP / NPN Epitaxial Type (PCT Process) HN4B101J. Rating Unit PNP NPN. DC (Note 1) I C A Pulse (Note 1) I CP

MTM232270LBF Silicon N-channel MOSFET

TOSHIBA Transistor Silicon NPN Epitaxial Planar Type 2SC5086. Characteristics Symbol Test Condition Min Typ. Max Unit

TOSHIBA Transistor Silicon NPN Triple Diffused Mesa Type 2SC5201

MTM861280LBF MTM861280LBF. Silicon P-channel MOSFET. Doc No. TT4-EA Revision. 2. For Switching. Internal Connection.

TOSHIBA Transistor Silicon NPN Triple Diffused Type TTC5200

RN2101MFV, RN2102MFV, RN2103MFV RN2104MFV, RN2105MFV, RN2106MFV

TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process) 2SC2655

TOSHIBA Transistor Silicon PNP / NPN Epitaxial Type (PCT Process) HN4B102J. Rating

Maintenance/ Discontinued

TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT process) 2SC3303. TOSHIBA 2-7J1A temperature/current/voltage and the significant change in

TOSHIBA TRANSISTOR SILICON NPN TRIPLE DIFFUSED MESA TYPE 2SC5612

Maintenance/ Discontinued

2SC5784 2SC5784. High-Speed Switching Applications DC-DC Converter Applications. Maximum Ratings (Ta = 25 C) Electrical Characteristics (Ta = 25 C)

TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT process) 2SA1244

2SC2873 2SC2873. Power Amplifier Applications Power Switching Applications. Maximum Ratings (Ta = 25 C)

TOSHIBA Transistor Silicon PNP Triple Diffused Type 2SA2142

Maintenance/ Discontinued

TOSHIBA Transistor Silicon PNP Triple Diffused Type 2SA1943

MTM761100LBF MTM761100LBF. Silicon P-channel MOSFET For Switching. Doc No. TT4-EA Revision. 2. Internal Connection. Pin Name

Maintenance/ Discontinued

Maintenance/ Discontinued

TOSHIBA Transistor Silicon NPN / PNP Epitaxial Type (PCT Process) TPCP8902. Unit PNP NPN V CEX V V CEO

2SC1923 2SC1923. High Frequency Amplifier Applications FM, RF, MIX, IF Amplifier Applications. Maximum Ratings (Ta 25 C)

1 000 pcs / reel (standard) Max 40. Min - Symbol VR VF IF = 1.0 A

FM6K62010L FM6K62010L. Silicon N-channel MOSFET(FET) Silicon epitaxial planar type(sbd) Doc No. TT4-EA Revision. 3

FK L FK L. Silicon N-channel MOSFET. Doc No. TT4-EA Revision. 2. For switching FK in SSSMini3 type package

Transcription:

Small Signal Transistor Arrays UNA26 (UN26) This product complies with the RoHS Directive (EU 22/95/EC). Silicon PNP epitaxial planar type (3 elements) Silicon NPN epitaxial planar type (3 elements) For motor drives Features Small and lightweight Low power consumption (low V CE(sat) transistor used) Low voltage drive With 6 elements incorporated Absolute Maximum Ratings T a = Parameter Symbol Rating Unit PNP Collector-base voltage V CBO 2 V (Emitter open) Collector-emitter voltage V CEO V (Base open) Emitter-base voltage V EBO 7 V (Collector open) 3 A Peak collector current I CP 4 A NPN Collector-base voltage V CBO 2 V (Emitter open) Collector-emitter voltage V CEO V (Base open) Emitter-base voltage V EBO 7 V (Collector open) 3 A Peak collector current I CP 4 A Overall Total power dissipation * P T.5 W Junction temperature T j 5 C Storage temperature T stg 55 to +5 C Note) *: When the dissipation on one device is T C = 4.4±. 32 9 6.5±.3.8 Marking Symbol: UN26 Internal Connection 8 2 3 4 5 6 7.9±. 2 5.5±.3 2.2 +.. 45.5 Unit: mm : Collector 5: Collector 9: Base 3: Base 2: Base 6: Base : Collector 4: Emitter 3: Collector 7: Emitter : Base 4: Base 8: Collector 2: Collector SO4-G Package 7.7±.3.5±..5 +.2. 4 3 2 9 8 2 3 4 5 6 7.5±.2 Note) The part number in the parenthesis shows conventional part number. Publication date: March 24 SJK44BED

UNA26 This product complies with the RoHS Directive (EU 22/95/EC). Electrical Characteristics T a = ± 3 C PNP Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) V CBO I C = µa, I E = 2 V Collector-emitter voltage (Base open) V CEO I C = ma, I B = V Emitter-base voltage (Collector open) V EBO I E = µa, I C = 7 V Collector-base cutoff current (Emitter open) I CBO V CB = V, I E = µa Forward current transfer ratio * h FE V CE = V, I C =.5 A 2 8 Collector-emitter saturation voltage * V CE(sat) I C = 2 A, I B = 5 ma.45 V Transition frequency f T V CB = 6 V, I E = 5 ma, f = 2 MHz 5 MHz Collector output capacitance C ob V CB = V, I E =, f = MHz 65 pf (Common base, input open circuited) Forward voltage *2 V F I F = A.5 V NPN Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) V CBO I C = µa, I E = 2 V Collector-emitter voltage (Base open) V CEO I C = ma, I B = V Emitter-base voltage (Collector open) V EBO I E = µa, I C = 7 V Collector-base cutoff current (Emitter open) I CBO V CB = V, I E = µa Forward current transfer ratio * h FE V CE = V, I C =.5 A 2 8 Collector-emitter saturation voltage * V CE(sat) I C = 2 A, I B = 5 ma.25 V Transition frequency f T V CB = 6 V, I E = 5 ma, f = 2 MHz 5 MHz Collector output capacitance C ob V CB = V, I E =, f = MHz 5 pf (Common base, input open circuited) Forward voltage * 2 V F I F = A.5 V Note). Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 73 measuring methods for transistors. 2. *: Pulse measurement *2: Application to the built-in diode 2 SJK44BED

This product complies with the RoHS Directive (EU 22/95/EC). UNA26 Common characteristics chart.6 P T T a Total power dissipation P T (W).5.4.3.2. 4 8 2 6 Ambient temperature T a ( C) Characteristics charts of PNP transistor block 6 5 4 3 2 I C V CE I C V BE V CE(sat) I C I B = 8 ma 7 ma 6 ma T a = 5 ma 4 ma 3 ma 2 ma ma 2 4 6 8 2 Collector-emitter voltage V CE (V) 6 5 4 3 2 V CE = V.4.8.2.6 2. 2.4 Base-emitter voltage V BE (V) Collector-emitter saturation voltage V CE(sat) (V) 2 I C / I B = 4 3.. Forward current transfer ratio h FE 8 7 6 5 4 3 2 h FE I C V CE = V.. Collector output capacitance (Common base, input open circuited) C ob (pf) 32 28 24 2 6 2 8 4 C ob V CB f = MHz I E = T a =. Collector-base voltage V CB (V) SJK44BED 3

UNA26 This product complies with the RoHS Directive (EU 22/95/EC). Characteristics charts of NPN transistor block 3. 2.5 2..5..5 I C V CE I C V BE V CE(sat) I C T a = I B = 8 ma 7 ma 6 ma 5 ma 4 ma 3 ma 2 ma ma 2 3 4 5 6 Collector-emitter voltage V CE (V) 6 5 4 3 2 V CE = V.4.8.2.6 2. 2.4 Base-emitter voltage V BE (V) Collector-emitter saturation voltage V CE(sat) (V) 2 IC / I B = 4 3.. Forward current transfer ratio h FE 8 7 6 5 4 3 2 h FE I C Ta = 75 C VCE = V.. Collector output capacitance (Common base, input open circuited) C ob (pf) 6 4 2 8 6 4 2 C ob V CB f = MHz IE = Ta =. Collector-base voltage V CB (V) 4 SJK44BED

This product complies with the RoHS Directive (EU 22/95/EC). Request for your special attention and precautions in using the technical information and semiconductors described in this material () An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 23 SEP