SE2622L: 2.4 GHz, 256 QAM Power Amplifier

DATA SHEET SE2622L: 2.4 GHz, 256 QAM Power Amplifier Applications DSSS 2.4 GHz WLAN (IEEE 802.11b) OFDM 2.4 GHz WLAN (IEEE 802.11g) OFDM 2.4 GHz WLAN (IEEE 802.11n) OFDM 2.4 GHz WLAN (256 QAM) Access points, PCMCIA, PC cards Features Single 3.3 V supply operation: 18 dbm, EVM = 35 db, 256 QAM OFDM 20 dbm, EVM = 30 db, 802.11n 23 dbm, ACPR < 32 dbc, 802.11b Small signal gain: 31 db typical Integrated temperature compensated power detector Digital power amplifier enable pin (VEN) Lead Free, Halogen Free and RoHS compliant Small footprint QFN (16-pin, 3 3 0.9 mm) package (MSL1, 260 C per JEDEC J-STD-020) Description The SE2622L is a 2.4 GHz power amplifier designed for use in the 2.4 GHz ISM band for wireless LAN applications. The device incorporates a power detector for closed loop monitoring of the output power. The SE2622L includes a digital enable control for device on/off control. The SE2622L temperature compensated power detector is highly immune to mismatch at its output with less than 1.5 db of variation with a 2:1 mismatch. The device package and pinout for the 16-pin QFN are shown in Figure 1. A block diagram of the SE2622L is shown in Figure 2. RF_IN EN 1 2 3 N/C 16 15 14 13 12 11 10 RF_OUT/ Skyworks Green products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green, document number SQ04-0074. 4 5 6 7 8 DET 9 Y1122 Figure 1. SE2622L Pinout 16-Pin QFN (Top View) EN Bias RF_IN Input Match Inter-Stage Match Inter-Stage Match RF_OUT Detector VDET ts042 Figure 2. SE2622L Block Diagram 202733C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice September 29, 2014 1

Electrical and Mechanical Specifications Signal pin assignments and functional pin descriptions are described in Table 1. The absolute maximum ratings of the SE2622L are provided in Table 2. Recommended operating conditions are specified in Table 3. Electrical specifications are provided in Tables 4, 5, and 6. Typical performance characteristics of the SE2622L are illustrated in Figure 3. Table 1. SE2622L Signal Descriptions Pin Name Description Pin Name Description 1 RF_IN Power amplifier RF input; DC block required 10 Not used 2 EN Digital pin used to power up and power down the IC 11 RF_OUT/ 3 Ground 12 Ground 4 Not used 13 Not used 5,6 Ground 14 N/C No connect Power Amplifier RF output / Final stage collector supply 7 DET Analog power detector output 15 Stages 1, 2 collector supply 8 Not used 16 Ground 9 Ground Paddle Exposed die paddle; electrical and thermal ground Table 2. SE2622L Absolute Maximum Ratings (Note 1) Parameter Symbol Minimum Maximum Units Supply voltage on pins 0.3 +4 V Power amplifier enable VEN 0.3 +3.6 V RF input power, RF_OUT terminated into 50 match RFIN +10 dbm Storage temperature range TSTG 40 +150 C Electrostatic discharge: Human Body Model (HBM), Class 1B ESD 500 V Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SE2622L Recommended Operating Conditions Parameter Symbol Minimum Maximum Units Supply voltage 3.0 3.6 V Supply voltage on pins 3 3 3.0 3.6 V Ambient temperature TA 40 85 C 2 September 29, 2014 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice 202733C

Table 4. SE2622L Electrical Specifications: DC Characteristics (Note 1) ( = 3 = VEN = 3.3 V, TA = +25 C, as Measured on Evaluation Board, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical Max Units Supply current (Sum of Vcc0, Vcc, Vcc3) Supply current (Sum of Vcc, Vcc3) Icc-802.11b Icc-802.11g POUT = +23 dbm, 11 Mbps CCK signal, BT = 0.45, = 3 = 3.3 V Pout = +19 dbm, 54 Mbps OFDM signal, Vcc = Vcc3 = 3.3 V 250 ma 175 ma Supply current (Sum of Vcc, Vcc3) ICQ No RF 125 ma Supply current IOFF VEN = 0 V, No RF 2 10 A Logic high voltage VENH 1.3 V Logic low voltage VENL 0 0.5 V Input current logic high voltage IENH 300 A Input current logic low voltage IENL <1 A Enable pin input impedance ZEN Passive pull down 10 kω Note 1: Performance is guaranteed only under the conditions listed in this table. Table 5. SE2622L Electrical Specifications: AC Characteristics (Note 1) ( = 3 = VEN = 3.3 V, f = 2.45 GHz, TA = +25 C, as Measured on Evaluation Board, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typ Max Units Frequency range f 2400 2500 MHz Output power POUT OFDM, 256 QAM, HT40, 35 db EVM +18 OFDM, 256 QAM, HT20, 35 db EVM +19 OFDM, 256 QAM, HT40, 38 db EVM +16 OFDM, 64 QAM, HT20, 30 db EVM +20 CCK signal, BT = 0.045, Mask +23 802.11n, HT20, all data rates, Mask +23 802.11n, HT40, all data rates, Mask +22 Output 1dB compression point P1dB No modulation +24.5 +27 dbm Input return loss S11 12 10 db Small signal gain S21 PIN = 25 dbm 26 31 34 db Gain Variation over band S21 PIN = 25 dbm, f = 2400 to 2500 MHz 1 db Harmonic 2f 50 dbm/mhz POUT = +23 dbm, CW 3f 50 dbm/mhz Rise and fall time tr, tf 0.5 s Stability Tolerance to output load mismatching STAB VSVR Note 1: Performance is guaranteed only under the conditions listed in this table. POUT = +23 dbm, 54 Mbps OFDM signal, 64 QAM, VSWR = 6:1. All Phases POUT = +23 dbm, 54 Mbps OFDM signal, 64 QAM, VSWR = 10:1. All Phases dbm All non-harmonically related outputs less than 50 dbc/100 khz No damage 202733C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice September 29, 2014 3

Table 6. SE2622L Electrical Specifications: Power Detector Characteristics (Note 1) ( = 3 = VEN = 3.3 V, f = 2.45 GHz, TA = +25 C, as Measured on Evaluation Board, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical Max Units POUT detect range PDR 0 P1dB dbm Detector voltage VDET POUT = +23 dbm 1.04 V Detector voltage VDET POUT = +21 dbm 0.87 V Detector voltage VDET POUT = No RF 0.33 V Output impedance PDZOUT 2.3 k DC load impedance PDZLOAD 10 k Note 1: Performance is guaranteed only under the conditions listed in this table. 1.2 1.1 1 0.9 VDET (V) 0.8 0.7 0.6 2400 0.5 2450 0.4 2500 0.3 3 5 7 9 11 13 15 17 19 21 23 25 Output Power (dbm) Figure 3. SE2622L Power Detector Characteristics ts043 4 September 29, 2014 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice 202733C

Evaluation Board Description The SE2622L-EK1 Evaluation Board is used to test the performance of the SE2622L-R PA. A typical application schematic diagram is provided in Figure 4. Table 7 provides the Bill of Materials (BOM) list for Evaluation Board components. Header 6 J3 1 2 3 4 5 6 VDET VEN C4 1500 pf C3 10 pf C5 C6 Pad 16 15 14 13 C9 10 pf C10 C11 4.7 μf J1 SMA C2 RFIN VEN 1 2 3 4 RF_IN EN N/C U1 SE2622L RF_OUT/ 12 11 10 9 L2 4.7 nh T1 T3 T2 C15 15 pf T5 T4 L3 1.5 nh C17 1.0 pf J2 SMA C14 1.8 pf C16 1.5 pf DET = Do Not Install C13 5 6 7 8 Notes: VDET R1 C19 T1: L = 0.9 mm, W = 0.424 mm T1 length is measured from the outside edge of the device lead to the middle edge of the C14 land pad. T2: L = 1.95 mm, W = 0.424 mm T2 length is measured from the middle edge of the C14 land pad to the inside edge of the C15 land pad. T3: L = 1.04 mm, W = 0.424 mm T3 length is measured from the outside edge of the TX line to the inside edge of the C14 land pad. T4: L = 1.04 mm, W = 0.424 mm T4 length is measured from the outside edge of the TX line to the inside edge of the C16 land pad. C16 is centered on the middle edge of the right land pad of C15. T5: L = 1.50 mm, W = 0.424 mm T5 length is measured from the inside edge of the C15 land pad to the inside edge of the L3 land pad. C17 is placed immediately after L3 with the top land pad directly on the TX track. L2 is placed 1.4 mm away from the device. This dimension is measured from the outside edge of the device lead to the middle edge of the land pad of L2. The outer edge of the land pad is aligned with the center of the TX track. All trace dimensions are based on having a ground plane immediately below the trace with 0.254 mm off FR406 as the substrate. Y1118 Figure 4. SE2622L Evaluation Board Schematic Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration: Paths to ground should be made as short as possible. The ground pad of the SE2622L-R has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. For further information, refer to the Skyworks Application Note, PCB Design Guidelines for High Power Dissipation Packages, document number 201211. Bypass capacitors should be used on the DC supply lines. An RF inductor is required on the supply line to block RF signals from the DC supply. Refer to the schematic drawing below for further details. The RF lines should be well separated from each other with solid ground between traces to maximize input-to-output isolation. 202733C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice September 29, 2014 5

Evaluation Board Test Procedure 1. Connect to all ground pins. 2. Connect a power supply to the 1, 2, and the two RF_OUT pins. 3. If desired, connect a voltage meter to the VDET pin. 4. Connect a +3.3 V supply to EN pin. 5. Connect a signal generator to the RF signal input port. Set it to the desired RF frequency at a power level of 30 dbm or less to the Evaluation Board. DO NOT enable the RF signal. 6. Connect a spectrum analyzer to the RF signal output port. 7. Enable the power supply. 8. Enable the RF signal. 9. Take measurements. CAUTION: If the input signal exceeds the rated power, the Evaluation Board can be permanently damaged. NOTE: It is important to adjust the voltage source so that the target supply voltage (+5) is measured at the board. The high collector currents will drop the collector voltage significantly if long leads are used. Adjust the bias voltage to compensate." Table 7. SE2622L Evaluation Board Bill of Materials Component Part number Description Manufacturer U1 SE2622L Skyworks PCB Z053-B Skyworks R1, C2, C5, C6, C10, C13, C19 C3, C9 10 pf GRM1555C1H100JZ01 Murata C4 1500 pf GRM155R71H152KA01 Murata C11 4.7 F GRM188R60J475KE19 Murata C14 1.8 pf GRM1555C1H1R8CZ01 Murata C15 15 pf GRM1555C1H150JZ01 Murata C16 1.5 pf GRM1555C1H1R5CZ01 Murata C17 1.0 pf GRM1555C1H1R0CZ01 Murata J1, J2 SMA 142-0701-851 Johnson J3 HEADER 6 22-28-4063 Molex L2 4.7 nh LQG18HN4N7S00D Murata L3 1.5 nh LQG15HN1N5S02D Murata Package Dimensions The PCB layout footprint for the SE2622L is provided in Figure 5. Typical case markings are shown in Figure 6. Package dimensions for the 16-pin QFN are shown in Figure 7, and tape and reel dimensions are provided in Figure 8. Package and Handling Information Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SE2622L is capable of withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For details on both attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to: Skyworks Application Note: Quad Flat No-Lead Module Solder Reflow & Rework Information, Document Number QAD-00045. Skyworks Application Note: Handling, Packing, Shipping and Use of Moisture Sensitive QFN, Document Number QAD-00044. 6 September 29, 2014 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice 202733C

3.40 0.98 1.32 1.27 3X 0.61 0 3X 0.61 2X 1.32 2X 1.40 1.09 0.500 Typ 3.40 1.90 3X 0.61 0 0 1.27 0.25 Typ 3X 0.61 1.40 1.55 0.60 Typ 1.90 Board Metal 0 Via Pattern (Note 4) 13X ø0.254 3.50 3.40 0.20 0.65 Typ 0.500 Typ 0.500 Typ 0.65 Typ 3.50 1.70 0.20 3.40 0.35 Typ 0.25 Typ 0.70 Typ 1.70 Solder Mask Pattern (Note 6) Package Outline Notes: 1. All dimensions are in millimeters. 2. Dimensions and tolerances according to ASME Y14.5M-1994. 3. Unless specified, dimensions are symmetrical about center lines. 4. Via hole recommendations: 0.025 mm Cu via wall plating (minimum), via hole to be filled with conductive paste and plated over. 5. Stencil recommendations: 0.125 mm stencil thickness, laser cut apertures, trapezoidal walls and rounded corners offer better paste release. 6. Solder mask recommendations: contact board fabricator for recommended solder mask offset and tolerance. Figure 5. PCB Layout Footprint for the SE2622L 0.60 Typ Stencil Pattern (Note 5) 58% solder coverage on center pad Y1177 Pin 1 Indicator Part Number Lot Code Y1121 Figure 6. Typical Case Markings (Top View) 202733C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice September 29, 2014 7

2X 0.10 C 3.000 ± 0.050 A 1.700 ± 0.050 B See Note 3 0.850 ± 0.050 0.203 Ref 0.30 X 45 3.000 ± 0.050 1.700 ± 0.050 R0.075 Typ 0.500 2X Notes: 0.10 C Top View 0.10 C 0.000 0.050 C Seating Plane 16X 0.230 ±0.050 0.10 M C A B 0.05 M C 16X 0.375 ±0.050 Bottom View 1. Dimensions and tolerances according to ASME Y14.5M-1994. 2. All measurements are in millimeters. Unless otherwise specified, the following values apply: Decimal Tolerance: Angular Tolerance: X.X (1 place) ± 0.1 mm ± 0.5 X.XX (2 places) ± 0.05 mm X.XXX (3 places) ± 0.025 mm 3. Terminal 1 identification mark located within marked area. 4. Unless specified, dimensions are symmetrical about center lines. Y1123 Figure 7. SE2622L 16-Pin QFN Package Dimensions 0.30 ± 0.05 Ø1.55 + 0.05 Y 2.00 ± 0.051 (Note 1) 4.0 ± 0.1 (Note 2) 1.75 + 0.10 3.30 ± 0.10 Ø1.5 Min. A (Note 1) 5.50 ± 0.10 12.00 ± 0.30 Ref. 3º Pin #1 Section Y-Y 1.10 ± 0.10 Y 8.00 ± 0.10 3.30 ± 0.10 Ref. 0.25 Ref. R0.25 Notes: 1. Measured from centreline of sprocket hole to centreline of pocket. 2. Cumulative tolerance of 10 sprocket holes is ±0.20 mm. 3. Other material available. 4. All measurements are in millimeters unless otherwise stated. Figure 8. SE2622L Tape and Reel Dimensions View A ts019 8 September 29, 2014 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice 202733C

Ordering Information Model Name Manufacturing Part Number Evaluation Board Part Number SE2622L 2.4 GHz, 256 QAM Power Amplifier SE2622L SE2622L-EK1 Copyright 2013-2014 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ( Skyworks ) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED AS IS WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference. 202733C Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice September 29, 2014 9