Electronic Costing & Technology Experts

Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes France Phone : +33 (0) 240 180 916 email : info@systemplus.fr www.systemplus.fr April 2016 - Version 1 written by Stéphane ELISABETH DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Glossary 1. Overview / Introduction 4 Executive Summary Reverse Costing Methodology 2. Company Profile 7 Maxim Integrated Profile 3. Physical Analysis 13 Samsung Galaxy S7 disassembly Synthesis of the Physical Analysis Package Package View, Dimensions & Opening Package Cross-Section LEDs Dies LEDs View & Dimensions RED LED Die Cross-Section RED LED Process Charcateristic IR LED Die Cross-Section IR LED Process Charcateristic RED LED Synthesis IR LED Synthesis Detector Die Die View, Dimensions & Marking Die Overview Die Delayering & main Blocks ID Die Process Die Cross-Section Die Process characteristics 4. Comparison with previous generation 76 Comparison with MAX30100 LED Comparison Detector comparison 5. Manufacturing Process Flow 80 Global Overview 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 2 IC Front-End Process Wafer Fabrication Unit LEDs Global Overview LEDs Fabrication Unit RED LED Process Flow IR LED Process Flow Packaging Process Flow Package Assembly Unit 6. Cost Analysis 105 Synthesis of the cost analysis Main steps of economic analysis Yields Hypotheses LEDs Epitaxy Step LEDs Epitaxial Wafer Cost LEDs Epitaxial Wafer Cost per process steps LEDs Carrier Wafer & Final Wafer Front-End Cost LEDs Final Wafer Cost per process steps LEDs Wafer Cost LEDs Back-End 0: Probe Test & Cleaving LEDs Die Cost IC Front-end & Back-End 0 Cost IC Die Cost Back-End : Packaging Cost Back-End : Packaging Cost per Process Steps Back-End : Final Test & Calibration Cost Component Cost 6. Estimated Price Analysis 127 Maxim Integrated Financial Ratios Component Estimated Price Contact 130

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the MAX30102 Optical Heart Sensor from Maxim Integrated found in the Samsung Galaxy S7. The sensor is an optical heart-rate module and a pulse oximeter sensor in LED reflective solution. The main die features a photodiode area and an analysis part with an integrated ambient light cancellation system comprising a photodetector and a wavelength cut-off filter based on Maxim s proprietary technology. The component features two LEDs: an IR and a RED led. The LEDs are bonded on silicon substrates, the IR led is manufactured using AlInGaP material and the RED led using GaAs material. The component is outsourced for the LED manufacturing and package assembly. Compared to the previous generation, the footprint of the component increased a little but the performance based on the packaging and the electrical part are much more reliable. Thanks to some innovations, the MAX30102 device is very cost effective which enforce Maxim s leadership in this domain. 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 3

The reverse costing analysis is conducted in 3 phases: Teardown analysis Package is analyzed and measured The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking Setup of the manufacturing process. Costing analysis Setup of the manufacturing environment Cost simulation of the process steps Selling price analysis Supply chain analysis Analysis of the selling price 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 4

Package Type : 14-pin OLGA Dimensions : 5.6 x 3.3 x 1.55 mm (18.48 mm² x 1.55mm) Pin Pitch : 0.8 mm Marking : C551GS5 Package Top view Package Side view Package Bottom view 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 5

Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 19