Apple iphone X IR Dot Projector

Similar documents
HTC Vive VR (Model 0PJT100) Virtual Reality Headset

Autoliv Night Vision System Safety Application Automotive IR Camera

ams Multi-Spectral Sensor True Color ambient light sensor from Apple iphone X

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts

Consumer Physics SCiO Molecular Sensor

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts

Electronic Costing & Technology Experts

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

Electronic Costing & Technology Experts

21 rue La Noue Bras de Fer Nantes - France Phone : +33 (0) w7-foldite :

21 rue La Nouë Bras de Fer Nantes - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

9 rue Alfred Kastler - BP Nantes Cedex 3 - France Phone : +33 (0) website :

MOSFET Technology Review 100V Industrial Mosfet

Apple iphone X IR Dot Projector

STMicroelectronics ToF Proximity Sensor & Flood Illuminator in the Apple iphone X

Apple iphone 6s Plus Teardown & Physical Analyses of Key Components

RF Front-End Module & Components Comparison 2018

Status of Panel Level Packaging & Manufacturing

Capacitive Fingerprint Sensors Technology and Patent Infringement Risk Analysis

ARCHIVE Brandon Prior Senior Consultant Prismark Partners ABSTRACT

Sony IMX145 8 Mp, 1.4 µm Pixel Pitch Back Illuminated (BSI) CMOS Image Sensor from the Apple iphone 4S Smartphone

TechSearch International, Inc. Corporate Overview E. Jan Vardaman, President

Olympus EVOLT E-410/Matsushita LiveMOS Image Sensor

Knowles MEMS Microphones in Apple iphone 7 Plus

SUPPLEMENTARY INFORMATION

Vixar High Power Array Technology

850NM SINGLE MODE VCSEL TO-46 PACKAGE

VCSEL SENSOR FLAT WINDOW TO CAN

Opto Devices Product Information LED

Hermetic Packaging Solutions using Borosilicate Glass Thin Films. Lithoglas Hermetic Packaging Solutions using Borosilicate Glass Thin Films

2.5GBPS 850NM VCSEL LC TOSA PACKAGE

1/2/4/8 GBPS 850NM VCSEL LC TOSA PACKAGES

LED Cost and Technology Trends: How to enable massive adoption in general lighting

FLIR Systems Indigo ISC0601B from Extech i5 Infrared Camera

Sony IMX118CQT 18.5 Mp, 1.25 µm Pixel Pitch Back Illuminated CIS from the Sony DSC-WX100 Camera

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 1: Overview Analysis

Sony IMX128AQP 24.3 Mp 5.9 µm Pixel Pitch CMOS Image Sensor from Nikon D600. Module 1: Overview Analysis

PHOTOREFLECTIVE SENSOR LEADFRAME PACKAGE

GaN Power Epitaxy, Devices, Applications and Technology Trends

Yole Developpement. Developpement-v2585/ Publisher Sample

BMC s heritage deformable mirror technology that uses hysteresis free electrostatic

Samsung LTN097QL01-A01 Display Module with LED Backlit LCD and Capacitive Touch Screen

Samsung S5K3BAFB 2 Megapixel CMOS Image Sensor 0.13 µm Copper CMOS Process Process Review Report

QUALITY & RELIABILITY

Sony. IMX Mp BSI CMOS Image Sensor

Glass Substrates for Semiconductor Manufacturing

Panasonic DMC-GH Mp, 4.4 µm Pixel Size LiveMOS Image Sensor from Panasonic LUMIX DMC-GH1 Micro Four Thirds Digital Interchangeable Lens Camera

The 3D silicon leader. March 2012

CMOS Image Sensors in Cell Phones, Cars and Beyond. Patrick Feng General manager BYD Microelectronics October 8, 2013

Nikon 12.1 Mp CMOS Image Sensor from a D3s DSLR Camera with NC81361A Die Markings

Proceedings. BiTS Shanghai October 21, Archive - Session BiTS Workshop Image: Zhu Difeng/Dollar Photo Club

1310NM FP LASER FOR 10GBASE-LRM SC AND LC TOSA

Confocal NEXIV VMZ-K Series. CNC Video Measuring System CONFOCAL NEXIV. VMZ-K Series

Foveon FX17-78-F13D Mp, 7.8 µm Pixel Size CIS from Sigma DP1 Compact Digital Camera 0.18 µm Dongbu Process

From Technologies to Market. Advanced RF SiP for Cell Phones

Sony IMX Mp, 1.2 µm Pixel Pitch Back Illuminated (Exmor R) CMOS Image Sensor from the Sony Cyber-shot HX300 Digital Compact Camera

Sharp NC Megapixel CCD Imager Process Review

Confocal NEXIV VMZ-K Series. CNC Video Measuring System CONFOCAL NEXIV. VMZ-K Series

INTERACTIVE. data book. thick film power resistors. vishay sfernice. vse-db

Photonique sur silicium: Tendances et perspectives de marché

New Wave SiP solution for Power

From Technologies to Market. Laser Technologies for. Semiconductor. Manufacturing. Sample. October 2017

Silicon carbide Semiconductor Products

Lithography in our Connected World

Miniaturization trends in medical imaging enabled by full wafer level integration if micro camera modules

Making Vehicles Smarter and Safer with Diode Laser-Based 3D Sensing

WLP Probing Technology Opportunity and Challenge. Clark Liu

Sony IMX096AQL 24.3 Mp, 3.9 µm Pixel Pitch APS-C CMOS Image Sensor from the Sony α77 (SLT-A77) Digital Single Lens Reflex (DSLR) Camera

SiTime SIT8002AC-13-18E50 One Time Programmable Oscillator

Silicon Light Machines Patents

Sintec Optronics Technology Pte Ltd is a leading supplier and manufacturer of a wide range of

Micromachining of Glass by Laser Induced Deep Etching (LIDE) LPKF Vitrion 5000

Agilent 2AZ1A CMOS Image Sensor Process Review

Sony PMW-F55 CineAlta 4K PMW Series HD Super 35 mm Digital Motion Camera with Global Shutter CMOS Image Sensor. Module 3: Planar Pixel Analysis

FUJIFILM MS3897A CCD Image Sensor Imager Process Review

10 Gb/s Radiation-Hard VCSEL Array Driver

Fan-Out Wafer Level Packaging Patent Landscape Analysis

LIGHT READING - VCSEL TESTING

General Rules for Bonding and Packaging

Uncooled Infrared Imagers Technology & Market Trends 2017

AEROSPACE AND DEFENSE

Silicon carbide Semiconductor Products

DOCUMENT CAMERA. TT-02s. Teacher s Tool

CNC Video Measuring System NEXIV VMZ-K series. CNC Video Measuring System. Confocal Model

Integrated High Speed VCSELs for Bi-Directional Optical Interconnects

Sony IMX Megapixel, 1.4 µm Pixel 1/3.2 Optical Format CMOS Image Sensor

Using Optics to Optimize Your Machine Vision Application

MEMS On-wafer Evaluation in Mass Production Testing At the Earliest Stage is the Key to Lowering Costs

PROJECT. DOCUMENT IDENTIFICATION D2.2 - Report on low cost filter deposition process DISSEMINATION STATUS PUBLIC DUE DATE 30/09/2011 ISSUE 2 PAGES 16

1.3 Megapixel CMOS Image Sensor Process Review (including MN101E19A Signal Processing DSP Basic Device Analysis)

MagnaChip MC511DB 1.3 Megapixel CMOS Image Sensor 0.18 µm Process

Optical Characterization and Defect Inspection for 3D Stacked IC Technology

Nikon NC81369R 24.2 Mp, 3.8 µm Pixel Size, APS-C Format CMOS Image Sensor from the Nikon D3200. Module 5: Substrate Dopant Analysis

Transcription:

Apple iphone X IR Dot Projector Dot Projector bundle including Heptagon Imaging report by Sylvain HALLEREAU December 2017 21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr 2017 System Plus Consulting Apple iphone X 3D Dot Projector 1

Table of Contents 3 o Executive Summary o Reverse Costing Methodology Company Profile 7 o Supply chain o Heptagon o Lumentum o TrueDepth Module Supply o Apple iphone X Teardown 22 o Synthesis of the o Methodology o Dot Projector teardown o Ceramic Package 39 View, Dimensions & Marking Cross-Section Process Characteristics Broadcomm BCM15952 IC Schottky Diode o NIR VCSEL 62 Die View, Dimensions & Marking Cavity Cross-Section Process Characteristics o Folded Optic 71 View, Dimensions & Marking Disassembly & Main Blocks Identification Lens Cross-Section Process Characteristics o Active DOE 99 DOE Dimensions DOE Disassembly & Main Blocks Identification DOE Cross Section Process Characteristics o Comparison: Apple Dot Projector, Intel Real Sense, PMD/Infineon 126 130 o Global Overview of the Dot Projector o Package Front-End Process Flow o Package Fabrication Unit o NIR VCSEL Front-End Process o NIR VCSEL Wafer Fabrication Unit o Folded Optic Wafer Process Flow o Folded Optic Wafer Fabrication Unit o DOE Wafer Process Flow o DOE Wafer Fabrication Unit o Final Assembly Unit 150 o Overview of the o Yields Explanation and Hypotheses o Integrated Circuit o Ceramic Package o NIR VCSEL o Folded Optic Folded Optic Front-End Cost Folded Optic Front-End Cost per process steps Folded Optic Back-End 0 : Probe Test and Dicing Folded Optic Wafer and Die Cost Folded Optic Component Cost o DOE Active o Back-End : Final Assembly Cost o Back-End : Final Assembly Cost per Process Step o 3D Illumination Module Component Cost Estimated Price Analysis 180 o 3D Illumination Module 181 Company services 183 2017 System Plus Consulting Apple iphone X 3D Dot Projector 2

Executive Summary o Executive Summary o Reverse Costing Methodology o Glossary The Apple iphone X brings totally new functionality based on the TrueDepth technology. This project is issued from a collaboration including Lumentum for the VCSEL diode and Heptagon for the active DOE and folded optic. The iphone X implements this technology using a Dot Projector. The subsystem features a 30,000 dots projector from Heptagon. We estimate that the Active DOE and the folded optic are manufactured by Heptagon. The electronic package is assembled by an OSAT. The IC driver is designed by Broadcom. The nogrid VCSEL array diode is manufactured by Lumentum. Heptagon performs the assembly of the Dot Projector. To provide the 30,000 dots, the VCSEL supplies the IR light and the Folded Optic directs the IR light to the Active Diffractive Optical Element (DOE). Finally, the Active DOE divides the light beam into 30,000 dots of light. The VCSEL is driven in power, beam shape and frequency by an ASIC from Broadcom. The report includes technology and cost analysis of the Dot Projector. These analyses provide the technical intelligence necessary to understand this technology. A comparison between the Dot Projector and the Intel Real Sense projector and the PMD/Infineon solution are performed. 2017 System Plus Consulting Apple iphone X 3D Dot Projector 3

Dot Projector Teardown Dot Projector o o o o o o o o Synthesis Teardown Ceramic Package IC Broadcom NIR VCSEL Folded Optic Active DOE Comparison RGB Camera Dot Projector Global View 2017 by System Plus Consulting Dot Projector Bottom View Dot Projector Flex Marking 2017 by System Plus Consulting Flex 2017 by System Plus Consulting Ceramic Dot Projector Flex Removal 2017 by System Plus Consulting The Dot Projector module has a ceramic substrate with a separate ceramic block under the VCSEL. Ceramic substrate Dot Projector Flex Removal 2017 by System Plus Consulting 2017 System Plus Consulting Apple iphone X 3D Dot Projector 4

Dot Projector Dimension XXmm DOE o Synthesis o Teardown o Ceramic Package o IC Broadcom o NIR VCSEL o Folded Optic o Active DOE o Comparison XXmm XXXmm Top Lenses Light Guide Bottom Lenses Substrate XXmm Ceramic Substrate Dot Projector Global View 2017 by System Plus Consulting Flex DOE Top Lenses Light Guide Bottom Lenses Substrate Ceramic Substrate Flex 2017 System Plus Consulting Apple iphone X 3D Dot Projector 5

Dot Projector Teardown The optical block is glued on top of the ceramic substrate. o Synthesis o Teardown o Ceramic Package o IC Broadcom o NIR VCSEL o Folded Optic o Active DOE o Comparison Light Guide Bottom Lenses Substrate VCSEL Dot Projector Opened View 2017 by System Plus Consulting 2017 System Plus Consulting Apple iphone X 3D Dot Projector 6

Dot Projector AlN Ceramic o Synthesis o Teardown o Ceramic Package o IC Broadcom o NIR VCSEL o Folded Optic o Active DOE o Comparison 2017 System Plus Consulting Apple iphone X 3D Dot Projector 7

NIR VCSEL Die View and Dimensions XX mm o Synthesis o Teardown o Ceramic Package o IC Broadcom o NIR VCSEL o Folded Optic o Active DOE o Comparison Die Area: XXmm² (xx x xx mm) Nb of PGDW per 3-inch wafer: XX Pad number: x Wire Bonding: XX XXmm VCSEL Optical View 2017 by System Plus Consulting 2017 System Plus Consulting Apple iphone X 3D Dot Projector 8

NIR VCSEL Die Cross-Section o Synthesis o Teardown o Ceramic Package o IC Broadcom o NIR VCSEL o Folded Optic o Active DOE o Comparison Seed layer in titanium for the gold layer: 0.05µm 2017 System Plus Consulting Apple iphone X 3D Dot Projector 9

Folded Optic - Disassembly o Synthesis o Teardown o Ceramic Package o IC Broadcom o NIR VCSEL o Folded Optic o Active DOE o Comparison 2017 System Plus Consulting Apple iphone X 3D Dot Projector 10

Active Diffractive Optical Element - Disassembly o Synthesis o Teardown o Ceramic Package o IC Broadcom o NIR VCSEL o Folded Optic o Active DOE o Comparison DOE Disassembly Optical View 2017 by System Plus Consulting 2017 System Plus Consulting Apple iphone X 3D Dot Projector 11

Broadcom BCM15952 Front-End Cost o Synthesis o Supply o Yields o Broadcom BCM15952 Cost o NIR VCSEL Wafer & Die Cost o Ceramic Package Cost o Folded Optic Cost o Active DOE Cost o Assembly Cost o Component Cost 2017 System Plus Consulting Apple iphone X 3D Dot Projector 12

NIR VCSEL Front-End Cost per Process Steps o Synthesis o Supply o Yields o Broadcom BCM15952 Cost o NIR VCSEL Wafer & Die Cost o Ceramic Package Cost o Folded Optic Cost o Active DOE Cost o Assembly Cost o Component Cost Sensor Manufacturing Steps Cost (Simulated with LED CoSim+ Cost Simulation Tool) 2017 System Plus Consulting Apple iphone X 3D Dot Projector 13

3D Illumination Module Estimated Manufacturer Price o Financial Ratios o Manufacturer Price 2017 System Plus Consulting Apple iphone X 3D Dot Projector 14

COMPANY SERVICES 2017 System Plus Consulting Apple iphone X 3D Dot Projector 15

Business Models a Fields of Expertise o Company services o Feedbacks o Contact o Legal Custom Analyses (>130 analyses per year) Reports (>40 reports per year) Costing Tools Trainings 2017 System Plus Consulting Apple iphone X 3D Dot Projector 16

Feedbacks o Company services o Feedbacks o Contact o Legal Dear Customer, Thank you for giving us the opportunity to serve you better. Please help us by taking only a few seconds to give us your thoughts about the Reverse Costing Report that you have received. We appreciate to work with you and want to make sure we meet your expectations. Sincerely, Wilfried THERON Quality Manager Click below to access to our online Customer Satisfaction Survey. 2017 System Plus Consulting Apple iphone X 3D Dot Projector 17

Contact PHOENIX YOLE Inc. FRANKFURT/MAIN Europa Sales Office NANTES Headquarter LYON YOLE HQ TOKYO YOLE KK o Company services o Feedbacks o Contact o Legal GREATER CHINA YOLE Headquarters 21 rue La Noue Bras de Fer 44200 Nantes FRANCE +33 2 40 18 09 16 sales@systemplus.fr www.systemplus.fr Europe Sales Office Lizzie LEVENEZ Frankfurt am Main GERMANY +49 151 23 54 41 82 llevenez@systemplus.fr America Sales Office Steve LAFERRIERE Phoenix USA laferriere@yole.fr Asia Sales Office Takashi ONOZAWA Tokyo JAPAN onozawa@yole.fr Mavis WANG GREATER CHINA wang@yole.fr 2017 System Plus Consulting Apple iphone X 3D Dot Projector 18

Legal o Company services o Feedbacks o Contact o Legal DISCLAIMER System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. Reverse Costing is a deposed brand, by System Plus Consulting. SERVICES Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. These results are open for discussion. We can reevaluate this circuit with your information. 2017 System Plus Consulting Apple iphone X 3D Dot Projector 19