ESM3030DV NPN DARLINGTON POWER MODULE

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ESM3030D NPN DARLINGTON POWER MODULE HIGH CURRENT POWER BIPOLAR MODULE ERY LOW Rth JUNCTION CASE SPECIFIED ACCIDENTAL OERLOAD AREAS ULTRAFAST FREEWHEELING DIODE FULLY INSULATED PACKAGE (UL COMPLIANT) EASY TO MOUNT LOW INTERNAL PARASITIC INDUCTANCE INDUSTRIAL APPLICATIONS: MOTOR CONTROL SMPS & UPS DC/DC & DC/AC CONERTERS WELDING EQUIPMENT ISOTOP INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter alue Unit CE Collector-Emitter oltage ( BE = -5 ) 400 CEO(sus) Collector-Emitter oltage (I B = 0) 300 EBO Emitter-Base oltage (I C = 0) 7 IC Collector Current 100 A I CM Collector Peak Current (t p = 10 ms) 150 A IB Base Current 5 A I BM Base Peak Current (t p = 10 ms) 10 A Ptot Total Dissipation at Tc = 25 o C 225 W isol Insulation Withstand oltage (RMS) from All 2500 Four Terminals to Exernal Heatsink T stg Storage Temperature -55 to 150 o C T j Max. Operating Junction Temperature 150 o C September 2003 1/8

THERMAL DATA R thj-case Rthj-case R thc-h Thermal Resistance Junction-case (transistor) Thermal Resistance Junction-case (diode) Thermal Resistance Case-heatsink With Conductive Grease Applied Max Max Max 0.55 1.2 0.05 o C/W o C/W o C/W ELECTRICAL CHARACTERISTICS (T case = 25 o C unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit ICER # Collector Cut-off Current (R BE = 5 Ω) I CE # Collector Cut-off Current (BE = -5) IEBO # Emitter Cut-off Current (I C = 0) CEO(SUS)* Collector-Emitter Sustaining oltage (IB = 0) CE = CE CE = CE CE = CE CE = CE T j = 100 o C Tj = 100 o C 1.5 16 1 11 ma ma ma ma EB = 5 1 ma IC = 0.2 A L = 25 mh clamp = 300 h FE DC Current Gain I C = 85 A CE = 5 300 CE(sat) BE(sat) dic/dt CE(3 µs) Collector-Emitter Saturation oltage Base-Emitter Saturation oltage Rate of Rise of On-state Collector Collector-Emitter Dynamic oltage I C = 60 A I C = 60 A I C = 85 A I C = 85 A I C = 85 A IC = 85 A I B = 0.6 A I B = 0.6 A T j = 100 o C I B = 2.4 A I B = 2.4 A T j = 100 o C I B = 2.4 A IB = 2.4 A Tj = 100 o C CC = 300 R C = 0 t p = 3 µs I B1 = 0.9 A T j = 100 o C CC = 300 R C = 5 Ω I B1 = 0.9 A T j = 100 o C 300 1.25 1.4 1.5 1.8 1.8 2.2 2.4 2.5 3 330 430 A/µs 3 6 CE(5 µs) Collector-Emitter Dynamic oltage CC = 300 R C = 5 Ω I B1 = 0.9 A T j = 100 o C 2.2 4 ts t f tc CEW Storage Time Fall Time Cross-over Time Maximum Collector Emitter oltage Without Snubber IC = 60 A BB = -5 clamp = 300 L = 0.04 mh ICWoff = 100 A BB = -5 L = 25 µh T j = 125 o C CC = 50 R BB = 0.6 Ω IB1 = 0.6 A T j = 100 o C IB1 = 2.4 A CC = 50 RBB = 0.6 Ω 2.3 0.35 0.8 3.5 0.6 1.2 µs µs µs 300 F Diode Forward oltage I F = 85 A T j = 100 o C 1.2 1.55 I RM Reverse Recovery CC = 200 I F = 85 A 18 25 A Current di F/dt = -330 A/µs L < 50 nh T j = 100 o C Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % # See test circuits in databook introduction To evaluate the conduction losses of the diode use the following equations: F =1.1 + 0.0045 IF P = 1.1 IF(A) + 0.0045 I 2 F(RMS) 2/8

Safe Operating Areas Thermal Impedance Derating Curve Collector-emitter oltage ersus base-emitter Resistance Collector Emitter Saturation oltage Base-Emitter Saturation oltage 3/8

Reverse Biased SOA Foward Biased SOA Reverse Biased AOA Forward Biased AOA Switching Times Inductive Load Switching Times Inductive Load ersus Temperature 4/8

Dc Current Gain Typical F ersus I F Peak Reverse Current ersus di F/dt Turn-on Switching Test Circuit Turn-on Switching Waveforms 5/8

Turn-on Switching Test Circuit Turn-off Switching Waveforms Turn-off Switching Test Circuit of Diode Turn-off Switching Waveform of Diode 6/8

ISOTOP MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 11.8 12.2 0.465 0.480 A1 8.9 9.1 0.350 0.358 B 7.8 8.2 0.307 0.322 C 0.75 0.85 0.029 0.033 C2 1.95 2.05 0.076 0.080 D 37.8 38.2 1.488 1.503 D1 31.5 31.7 1.240 1.248 E 25.15 25.5 0.990 1.003 E1 23.85 24.15 0.938 0.950 E2 24.8 0.976 G 14.9 15.1 0.586 0.594 G1 12.6 12.8 0.496 0.503 G2 3.5 4.3 0.137 1.169 F 4.1 4.3 0.161 0.169 F1 4.6 5 0.181 0.196 P 4 4.3 0.157 0.169 P1 4 4.4 0.157 0.173 S 30.1 30.3 1.185 1.193 P093A 7/8

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics. All other names are the property of their respective owners. 2003 STMicroelectronics All Rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 8/8